Page 125 - Xilinx Inc. Products | Heisener Electronics

XC18V02VQ44I
Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

Package: 44-TQFP

Stock5,968
XCF16PFS48C
Xilinx Inc.

IC PROM SRL 1.8V 16M 48CSBGA

Package: 48-TFBGA, CSPBGA

Stock7,944
XCZU7EG-3FFVF1517E
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Package: 1517-BBGA, FCBGA

Stock6,768
XCZU5CG-2FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Package: 900-BBGA, FCBGA

Stock2,368
XCZU4EG-L2SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Package: 784-BBGA, FCBGA

Stock7,056
XC7Z045-1FFG676C
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Package: 676-BBGA, FCBGA

Stock5,536
XC7Z030-2FBG484I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 484FBGA

Package: 484-BBGA, FCBGA

Stock6,336
XC2V1500-5FF896I
Xilinx Inc.

IC FPGA 528 I/O 896FCBGA

Package: 896-BBGA, FCBGA

Stock4,016
XC2V1000-4BGG575I
Xilinx Inc.

IC FPGA 328 I/O 575MBGA

Package: 575-BBGA

Stock5,904
XCV1600E-6FG900I
Xilinx Inc.

IC FPGA 700 I/O 900FBGA

Package: 900-BBGA

Stock8,028
XC4044XL-3HQ208I
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

Package: 208-BFQFP Exposed Pad

Stock133,632
XC6VHX565T-1FFG1923I
Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

Package: 1924-BBGA, FCBGA

Stock4,800
XC5VFX200T-2FF1738C
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

Package: 1738-BBGA, FCBGA

Stock4,160
XCKU115-2FLVB1760I
Xilinx Inc.

IC FPGA 702 I/O 1760FCBGA

Package: 1760-BBGA, FCBGA

Stock7,136
XC7VX550T-1FFG1927I
Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

Package: 1924-BBGA, FCBGA

Stock2,880
XC6VLX240T-3FFG1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Package: 1156-BBGA, FCBGA

Stock4,816
XC4VLX80-12FFG1148C
Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

Package: 1148-BBGA, FCBGA

Stock5,952
XC3SD3400A-4CS484C
Xilinx Inc.

IC FPGA 309 I/O 484CSBGA

Package: 484-FBGA, CSPBGA

Stock2,480
XC3S1200E-5FG320C
Xilinx Inc.

IC FPGA 250 I/O 320FBGA

Package: 320-BGA

Stock6,368
XA3S500E-4FTG256Q
Xilinx Inc.

IC FPGA 190 I/O 256FTBGA

Package: 256-LBGA

Stock2,048

Part Number	Manufacturer	Description	Package	Stock
XC18V02VQ44I	Xilinx Inc.	IC PROM SER I-TEMP 3.3V 44-VQFP Programmable Type: In System Programmable Memory Size: 2Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	Package: 44-TQFP	Stock5,968
XCF16PFS48C	Xilinx Inc.	IC PROM SRL 1.8V 16M 48CSBGA Programmable Type: In System Programmable Memory Size: 16Mb Voltage - Supply: 1.65 V ~ 2 V Operating Temperature: -40°C ~ 85°C Package / Case: 48-TFBGA, CSPBGA Supplier Device Package: 48-CSP (8x9)	Package: 48-TFBGA, CSPBGA	Stock7,944
XCZU7EG-3FFVF1517E	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock6,768
XCZU5CG-2FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock2,368
XCZU4EG-L2SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock7,056
XC7Z045-1FFG676C	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,536
XC7Z030-2FBG484I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 484FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	Package: 484-BBGA, FCBGA	Stock6,336
XC2V1500-5FF896I	Xilinx Inc.	IC FPGA 528 I/O 896FCBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: - Total RAM Bits: 884736 Number of I/O: 528 Number of Gates: 1500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	Package: 896-BBGA, FCBGA	Stock4,016
XC2V1000-4BGG575I	Xilinx Inc.	IC FPGA 328 I/O 575MBGA Number of LABs/CLBs: 1280 Number of Logic Elements/Cells: - Total RAM Bits: 737280 Number of I/O: 328 Number of Gates: 1000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 575-BBGA Supplier Device Package: 575-BGA (31x31)	Package: 575-BBGA	Stock5,904
XCV1600E-6FG900I	Xilinx Inc.	IC FPGA 700 I/O 900FBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 700 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	Package: 900-BBGA	Stock8,028
XC4044XL-3HQ208I	Xilinx Inc.	IC FPGA 160 I/O 208HQFP Number of LABs/CLBs: 1600 Number of Logic Elements/Cells: 3800 Total RAM Bits: 51200 Number of I/O: 160 Number of Gates: 44000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP Exposed Pad	Stock133,632
XC6VHX565T-1FFG1923I	Xilinx Inc.	IC FPGA 720 I/O 1923FCBGA Number of LABs/CLBs: 44280 Number of Logic Elements/Cells: 566784 Total RAM Bits: 33619968 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	Package: 1924-BBGA, FCBGA	Stock4,800
XC5VFX200T-2FF1738C	Xilinx Inc.	IC FPGA 960 I/O 1738FCBGA Number of LABs/CLBs: 15360 Number of Logic Elements/Cells: 196608 Total RAM Bits: 16809984 Number of I/O: 960 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	Package: 1738-BBGA, FCBGA	Stock4,160
XCKU115-2FLVB1760I	Xilinx Inc.	IC FPGA 702 I/O 1760FCBGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: 1760-BBGA, FCBGA	Stock7,136
XC7VX550T-1FFG1927I	Xilinx Inc.	IC FPGA 600 I/O 1927FCBGA Number of LABs/CLBs: 43300 Number of Logic Elements/Cells: 554240 Total RAM Bits: 43499520 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1927-FCBGA (45x45)	Package: 1924-BBGA, FCBGA	Stock2,880
XC6VLX240T-3FFG1156C	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock4,816
XC4VLX80-12FFG1148C	Xilinx Inc.	IC FPGA 768 I/O 1148FCBGA Number of LABs/CLBs: 8960 Number of Logic Elements/Cells: 80640 Total RAM Bits: 3686400 Number of I/O: 768 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	Package: 1148-BBGA, FCBGA	Stock5,952
XC3SD3400A-4CS484C	Xilinx Inc.	IC FPGA 309 I/O 484CSBGA Number of LABs/CLBs: 5968 Number of Logic Elements/Cells: 53712 Total RAM Bits: 2322432 Number of I/O: 309 Number of Gates: 3400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	Package: 484-FBGA, CSPBGA	Stock2,480
XC3S1200E-5FG320C	Xilinx Inc.	IC FPGA 250 I/O 320FBGA Number of LABs/CLBs: 2168 Number of Logic Elements/Cells: 19512 Total RAM Bits: 516096 Number of I/O: 250 Number of Gates: 1200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 320-BGA Supplier Device Package: 320-FBGA (19x19)	Package: 320-BGA	Stock6,368
XA3S500E-4FTG256Q	Xilinx Inc.	IC FPGA 190 I/O 256FTBGA Number of LABs/CLBs: 1164 Number of Logic Elements/Cells: 10476 Total RAM Bits: 368640 Number of I/O: 190 Number of Gates: 500000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock2,048
XC7K70T-2FBG484I	Xilinx Inc.	IC FPGA 285 I/O 484FCBGA Number of LABs/CLBs: 5125 Number of Logic Elements/Cells: 65600 Total RAM Bits: 4976640 Number of I/O: 285 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	Package: 484-BBGA, FCBGA	Stock3,888
XC9572-10TQ100C	Xilinx Inc.	IC CPLD 72MC 10NS 100TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 72 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-LQFP	Stock28,236
XC95108-20TQ100C	Xilinx Inc.	IC CPLD 108MC 20NS 100TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 108 Number of Gates: 2400 Number of I/O: 81 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-LQFP	Stock7,232
XC95288XL-10FG256I	Xilinx Inc.	IC CPLD 288MC 10NS 256PFBGA Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock5,952
XCR3256XL-12FTG256C	Xilinx Inc.	IC CPLD 256MC 10.8NS 256BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 10.8ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock4,192
XCVU9P-3FLGC2104E	Xilinx Inc.	XCVU9P-3FLGC2104E Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Total RAM Bits: 391168000 Number of I/O: 416 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	Package: 2104-BBGA, FCBGA	Stock4,368
XCKU115-L1FLVA1517I	Xilinx Inc.	IC FPGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 624 Number of Gates: - Voltage - Supply: 0.880 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock5,056
XC7S100-2FGGA484C	Xilinx Inc.	XC7S100-2FGGA484C Number of LABs/CLBs: 8000 Number of Logic Elements/Cells: 102400 Total RAM Bits: 4423680 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	Package: 484-BBGA, FCBGA	Stock4,288