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Xilinx Inc. |
IC PROM SERIAL 3.3V 200K 8-SOIC
- Programmable Type: OTP
- Memory Size: 200kb
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-TSOP
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,648 |
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Xilinx Inc. |
IC FPGA 464 I/O 1517FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock3,136 |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock2,832 |
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Xilinx Inc. |
IC FPGA 360 I/O 1156FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
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Package: 1156-BBGA, FCBGA |
Stock2,864 |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock6,992 |
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Xilinx Inc. |
IC FPGA 205 I/O 256BGA
- Number of LABs/CLBs: 1024
- Number of Logic Elements/Cells: 2432
- Total RAM Bits: 32768
- Number of I/O: 205
- Number of Gates: 28000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (27x27)
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Package: 256-BBGA |
Stock5,312 |
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Xilinx Inc. |
IC FPGA 1200 I/O 1760FBGA
- Number of LABs/CLBs: 59280
- Number of Logic Elements/Cells: 758784
- Total RAM Bits: 26542080
- Number of I/O: 1200
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock4,992 |
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Xilinx Inc. |
IC FPGA 840 I/O 1759FCBGA
- Number of LABs/CLBs: 37200
- Number of Logic Elements/Cells: 476160
- Total RAM Bits: 39223296
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1759-FCBGA (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock5,360 |
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Xilinx Inc. |
IC FPGA 680 I/O 1759FCBGA
- Number of LABs/CLBs: 11600
- Number of Logic Elements/Cells: 148480
- Total RAM Bits: 8404992
- Number of I/O: 680
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1759-FCBGA (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock3,840 |
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Xilinx Inc. |
IC FPGA 640 I/O 1136FCBGA
- Number of LABs/CLBs: 7360
- Number of Logic Elements/Cells: 94208
- Total RAM Bits: 8994816
- Number of I/O: 640
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1136-BBGA, FCBGA
- Supplier Device Package: 1136-FCBGA (35x35)
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Package: 1136-BBGA, FCBGA |
Stock3,456 |
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Xilinx Inc. |
IC FPGA 640 I/O 1136FCBGA
- Number of LABs/CLBs: 12160
- Number of Logic Elements/Cells: 155648
- Total RAM Bits: 7815168
- Number of I/O: 640
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1136-BBGA, FCBGA
- Supplier Device Package: 1136-FCBGA (35x35)
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Package: 1136-BBGA, FCBGA |
Stock10,896 |
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Xilinx Inc. |
IC FPGA 400 I/O 1156FCBGA
- Number of LABs/CLBs: 37325
- Number of Logic Elements/Cells: 477760
- Total RAM Bits: 35205120
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
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Package: 1156-BBGA, FCBGA |
Stock5,600 |
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Xilinx Inc. |
IC FPGA 832 I/O 2104FCBGA
- Number of LABs/CLBs: 82920
- Number of Logic Elements/Cells: 1451100
- Total RAM Bits: 77721600
- Number of I/O: 832
- Number of Gates: -
- Voltage - Supply: 0.922 V ~ 0.979 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 2104-BBGA, FCBGA
- Supplier Device Package: 2104-FCBGA (47.5x47.5)
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Package: 2104-BBGA, FCBGA |
Stock5,760 |
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Xilinx Inc. |
IC FPGA 400 I/O 676FCBGA
- Number of LABs/CLBs: 31775
- Number of Logic Elements/Cells: 406720
- Total RAM Bits: 29306880
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock6,624 |
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Xilinx Inc. |
IC FPGA 352 I/O 672FCBGA
- Number of LABs/CLBs: 6320
- Number of Logic Elements/Cells: 56880
- Total RAM Bits: 4276224
- Number of I/O: 352
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FCBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock5,856 |
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Xilinx Inc. |
IC FPGA 240 I/O 484FCBGA
- Number of LABs/CLBs: 5820
- Number of Logic Elements/Cells: 74496
- Total RAM Bits: 5750784
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA |
Stock6,416 |
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Xilinx Inc. |
IC FPGA 396 I/O 896FCBGA
- Number of LABs/CLBs: 1232
- Number of Logic Elements/Cells: 11088
- Total RAM Bits: 811008
- Number of I/O: 396
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FCBGA (31x31)
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Package: 896-BBGA, FCBGA |
Stock6,496 |
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Xilinx Inc. |
IC FPGA 250 I/O 484FCBGA
- Number of LABs/CLBs: 4075
- Number of Logic Elements/Cells: 52160
- Total RAM Bits: 2764800
- Number of I/O: 250
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA |
Stock3,376 |
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Xilinx Inc. |
IC FPGA 320 I/O 484BGA
- Number of LABs/CLBs: 3411
- Number of Logic Elements/Cells: 43661
- Total RAM Bits: 2138112
- Number of I/O: 320
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-FBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
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Package: 484-FBGA, CSPBGA |
Stock6,736 |
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Xilinx Inc. |
IC FPGA 172 I/O 256FTBGA
- Number of LABs/CLBs: 612
- Number of Logic Elements/Cells: 5508
- Total RAM Bits: 221184
- Number of I/O: 172
- Number of Gates: 250000
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FTBGA (17x17)
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Package: 256-LBGA |
Stock4,192 |
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Xilinx Inc. |
IC FPGA 173 I/O 256FTBGA
- Number of LABs/CLBs: 480
- Number of Logic Elements/Cells: 4320
- Total RAM Bits: 221184
- Number of I/O: 173
- Number of Gates: 200000
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FTBGA (17x17)
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Package: 256-LBGA |
Stock7,008 |
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Xilinx Inc. |
IC FPGA 195 I/O 256FTBGA
- Number of LABs/CLBs: 448
- Number of Logic Elements/Cells: 4032
- Total RAM Bits: 294912
- Number of I/O: 195
- Number of Gates: 200000
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FTBGA (17x17)
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Package: 256-LBGA |
Stock14,520 |
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Xilinx Inc. |
IC FPGA 500 I/O 900FCBGA
- Number of LABs/CLBs: 31775
- Number of Logic Elements/Cells: 406720
- Total RAM Bits: 29306880
- Number of I/O: 500
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock6,660 |
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Xilinx Inc. |
IC FPGA 300 I/O 676FCBGA
- Number of LABs/CLBs: 5125
- Number of Logic Elements/Cells: 65600
- Total RAM Bits: 4976640
- Number of I/O: 300
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock16,104 |
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Xilinx Inc. |
IC CPLD 36MC 7.5NS 64VQFP
- Programmable Type: In System Programmable (min 10K program/erase cycles)
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 2
- Number of Macrocells: 36
- Number of Gates: 800
- Number of I/O: 36
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-TQFP
- Supplier Device Package: 64-VQFP (10x10)
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Package: 64-TQFP |
Stock6,960 |
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Xilinx Inc. |
IC CPLD 288MC 10NS 208QFP
- Programmable Type: In System Programmable (min 10K program/erase cycles)
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 288
- Number of Gates: 6400
- Number of I/O: 168
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock142,692 |
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Xilinx Inc. |
XC7A25T-2CPG238C
- Number of LABs/CLBs: 1825
- Number of Logic Elements/Cells: 23360
- Total RAM Bits: 1658880
- Number of I/O: 112
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 238-LFBGA, CSPBGA
- Supplier Device Package: 236-CSBGA (10x10)
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Package: 238-LFBGA, CSPBGA |
Stock2,512 |
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Xilinx Inc. |
XCKU5P-3FFVD900E
- Number of LABs/CLBs: 20340
- Number of Logic Elements/Cells: 355950
- Total RAM Bits: 31641600
- Number of I/O: 304
- Number of Gates: -
- Voltage - Supply: 0.873 V ~ 0.927 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock5,040 |
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