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XCMECH-FFG676
Xilinx Inc.

FFG676 MECHANICAL SAMPLE

Package: -

Stock3,520
XC18V01VQ44I
Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

Package: 44-TQFP

Stock20,532
XCZU4EG-1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Package: 784-BBGA, FCBGA

Stock3,312
XC6SLX45-N3FG484I
Xilinx Inc.

IC FPGA 316 I/O 484FBGA

Package: 484-BBGA

Stock3,744
XC2V500-4FG256I
Xilinx Inc.

IC FPGA 172 I/O 256FBGA

Package: 256-BGA

Stock3,744
XC2V3000-5FG676I
Xilinx Inc.

IC FPGA 484 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock4,320
XA2S100E-6TQ144Q
Xilinx Inc.

IC FPGA 102 I/O 144TQFP

Package: 144-LQFP

Stock6,272
XC2V1500-5FGG676C
Xilinx Inc.

IC FPGA 392 I/O 676FBGA

Package: 676-BGA

Stock4,992
XCV405E-7FG676C
Xilinx Inc.

IC FPGA 404 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock5,088
XCV300E-6BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Package: 352-LBGA, Metal

Stock4,736
XCV200E-7BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Package: 352-LBGA, Metal

Stock7,168
XC4020XL-2HT144C
Xilinx Inc.

IC FPGA 113 I/O 144HQFP

Package: 144-LQFP Exposed Pad

Stock4,624
XC4010XL-3PQ208I
Xilinx Inc.

IC FPGA 160 I/O 208QFP

Package: 208-BFQFP

Stock10,512
XC4005XL-3TQ144I
Xilinx Inc.

IC FPGA 112 I/O 144TQFP

Package: 144-LQFP

Stock6,784
XCKU115-1FLVB2104I
Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

Package: 2104-BBGA, FCBGA

Stock5,680
XCKU060-2FFVA1156I
Xilinx Inc.

IC FPGA 520 I/O 1156FCBGA

Package: 1156-BBGA, FCBGA

Stock6,224
XC5VSX50T-3FFG1136C
Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Package: 1136-BBGA, FCBGA

Stock4,000
XC7K325T-1FBG676I
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Package: 676-BBGA, FCBGA

Stock7,408
XA3S700A-4FGG484I
Xilinx Inc.

IC FPGA 372 I/O 484FBGA

Package: 484-BBGA

Stock6,848
XC2S200-5FGG456I
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

Package: 456-BBGA

Stock4,544

Part Number	Manufacturer	Description	Package	Stock
XCMECH-FFG676	Xilinx Inc.	FFG676 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,520
XC18V01VQ44I	Xilinx Inc.	IC PROM SER I-TEMP 3.3V 44-VQFP Programmable Type: In System Programmable Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	Package: 44-TQFP	Stock20,532
XCZU4EG-1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock3,312
XC6SLX45-N3FG484I	Xilinx Inc.	IC FPGA 316 I/O 484FBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 316 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock3,744
XC2V500-4FG256I	Xilinx Inc.	IC FPGA 172 I/O 256FBGA Number of LABs/CLBs: 768 Number of Logic Elements/Cells: - Total RAM Bits: 589824 Number of I/O: 172 Number of Gates: 500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock3,744
XC2V3000-5FG676I	Xilinx Inc.	IC FPGA 484 I/O 676FBGA Number of LABs/CLBs: 3584 Number of Logic Elements/Cells: - Total RAM Bits: 1769472 Number of I/O: 484 Number of Gates: 3000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock4,320
XA2S100E-6TQ144Q	Xilinx Inc.	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 102 Number of Gates: 100000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock6,272
XC2V1500-5FGG676C	Xilinx Inc.	IC FPGA 392 I/O 676FBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: - Total RAM Bits: 884736 Number of I/O: 392 Number of Gates: 1500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	Package: 676-BGA	Stock4,992
XCV405E-7FG676C	Xilinx Inc.	IC FPGA 404 I/O 676FBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 10800 Total RAM Bits: 573440 Number of I/O: 404 Number of Gates: 129600 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,088
XCV300E-6BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 131072 Number of I/O: 260 Number of Gates: 411955 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock4,736
XCV200E-7BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 260 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock7,168
XC4020XL-2HT144C	Xilinx Inc.	IC FPGA 113 I/O 144HQFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 113 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP Exposed Pad	Stock4,624
XC4010XL-3PQ208I	Xilinx Inc.	IC FPGA 160 I/O 208QFP Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 160 Number of Gates: 10000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock10,512
XC4005XL-3TQ144I	Xilinx Inc.	IC FPGA 112 I/O 144TQFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock6,784
XCKU115-1FLVB2104I	Xilinx Inc.	IC FPGA 702 I/O 2104FCBGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	Package: 2104-BBGA, FCBGA	Stock5,680
XCKU060-2FFVA1156I	Xilinx Inc.	IC FPGA 520 I/O 1156FCBGA Number of LABs/CLBs: 41460 Number of Logic Elements/Cells: 725550 Total RAM Bits: 38912000 Number of I/O: 520 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock6,224
XC5VSX50T-3FFG1136C	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 4080 Number of Logic Elements/Cells: 52224 Total RAM Bits: 4866048 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	Package: 1136-BBGA, FCBGA	Stock4,000
XC7K325T-1FBG676I	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock7,408
XA3S700A-4FGG484I	Xilinx Inc.	IC FPGA 372 I/O 484FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 372 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock6,848
XC2S200-5FGG456I	Xilinx Inc.	IC FPGA 284 I/O 456FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 284 Number of Gates: 200000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock4,544
XC6SLX25-N3FG484I	Xilinx Inc.	IC FPGA 266 I/O 484FBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 266 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock5,760
XC9572-10PC44I	Xilinx Inc.	IC CPLD 72MC 10NS 44PLCC Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 34 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock4,832
XCR3384XL-12PQG208I	Xilinx Inc.	IC CPLD 384MC 10.8NS 208QFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 10.8ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 172 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock7,616
XC2C256-6FTG256C	Xilinx Inc.	IC CPLD 256MC 5.7NS 256FTBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 184 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock7,140
XC2C64A-7VQ44C	Xilinx Inc.	IC CPLD 64MC 6.7NS 44VQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 33 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	Package: 44-TQFP	Stock3,904
XC7S15-2CPGA196I	Xilinx Inc.	XC7S15-2CPGA196I Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 12800 Total RAM Bits: 368640 Number of I/O: 100 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 196-TFBGA, CSBGA Supplier Device Package: 196-CSPBGA (8x8)	Package: 196-TFBGA, CSBGA	Stock9,120
XCVU095-H1FFVD1517E	Xilinx Inc.	IC FPGA VIRTEX-U 1517FCBGA Number of LABs/CLBs: 67200 Number of Logic Elements/Cells: 1176000 Total RAM Bits: 62259200 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.922 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock4,432
XCKU3P-L2FFVD900E	Xilinx Inc.	XCKU3P-L2FFVD900E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock3,680