Page 160 - Xilinx Inc. Products | Heisener Electronics

XC17S150APD8C
Xilinx Inc.

IC PROM SER 150000 C-TEMP 8-DIP

Package: 8-DIP (0.300", 7.62mm)

Stock6,840
XCZU5EV-L2FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Package: 900-BBGA, FCBGA

Stock7,584
XC2V250-4FGG456I
Xilinx Inc.

IC FPGA 200 I/O 456FBGA

Package: 456-BBGA

Stock14,544
XCV400E-7PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

Package: 240-BFQFP

Stock4,592
XCV300E-6PQ240I
Xilinx Inc.

IC FPGA 158 I/O 240QFP

Package: 240-BFQFP

Stock5,536
XCV1000E-7FG1156C
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

Package: 1156-BBGA

Stock3,024
XC4020XL-3PQ208C
Xilinx Inc.

IC FPGA 160 I/O 208QFP

Package: 208-BFQFP

Stock10,512
XC4013E-3HQ208I
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

Package: 208-BFQFP Exposed Pad

Stock5,168
XC4010XL-09TQ144C
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

Package: 144-LQFP

Stock4,544
XC4005E-4PG156C
Xilinx Inc.

IC FPGA 112 I/O 156CPGA

Package: 156-BCPGA

Stock6,000
XC4005E-2PQ160I
Xilinx Inc.

IC FPGA 112 I/O 160QFP

Package: 160-BQFP

Stock7,776
XC6VSX475T-L1FFG1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Package: 1156-BBGA, FCBGA

Stock6,688
XCKU115-1FLVB2104C
Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

Package: 2104-BBGA, FCBGA

Stock4,368
XCKU9P-2FFVE900I
Xilinx Inc.

XCKU9P-2FFVE900I

Package: -

Stock3,264
XC5VLX110T-2FF1738C
Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

Package: 1738-BBGA, FCBGA

Stock6,656
XC5VFX70T-2FF1136I
Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

Package: 1136-BBGA, FCBGA

Stock6,576
XC2VP40-6FF1148I
Xilinx Inc.

IC FPGA 804 I/O 1148FBGA

Package: 1148-BBGA, FCBGA

Stock3,040
XCKU040-2FBVA900E
Xilinx Inc.

IC FPGA 468 I/O 900FCBGA

Package: 900-BBGA, FCBGA

Stock4,896
XQV100-4CB228M
Xilinx Inc.

IC FPGA 2.5V 108K GATES 228CQFN

Package: 228-CQFP

Stock5,200
XC2VP7-6FGG456I
Xilinx Inc.

IC FPGA 248 I/O 456FBGA

Package: 456-BBGA

Stock6,688

Part Number	Manufacturer	Description	Package	Stock
XC17S150APD8C	Xilinx Inc.	IC PROM SER 150000 C-TEMP 8-DIP Programmable Type: OTP Memory Size: 1.5Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	Package: 8-DIP (0.300", 7.62mm)	Stock6,840
XCZU5EV-L2FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock7,584
XC2V250-4FGG456I	Xilinx Inc.	IC FPGA 200 I/O 456FBGA Number of LABs/CLBs: 384 Number of Logic Elements/Cells: - Total RAM Bits: 442368 Number of I/O: 200 Number of Gates: 250000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock14,544
XCV400E-7PQ240C	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 10800 Total RAM Bits: 163840 Number of I/O: 158 Number of Gates: 569952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock4,592
XCV300E-6PQ240I	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 131072 Number of I/O: 158 Number of Gates: 411955 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock5,536
XCV1000E-7FG1156C	Xilinx Inc.	IC FPGA 660 I/O 1156FBGA Number of LABs/CLBs: 6144 Number of Logic Elements/Cells: 27648 Total RAM Bits: 393216 Number of I/O: 660 Number of Gates: 1569178 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA Supplier Device Package: 1156-FBGA (35x35)	Package: 1156-BBGA	Stock3,024
XC4020XL-3PQ208C	Xilinx Inc.	IC FPGA 160 I/O 208QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 160 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock10,512
XC4013E-3HQ208I	Xilinx Inc.	IC FPGA 160 I/O 208HQFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 160 Number of Gates: 13000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP Exposed Pad	Stock5,168
XC4010XL-09TQ144C	Xilinx Inc.	IC FPGA 113 I/O 144TQFP Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 113 Number of Gates: 10000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock4,544
XC4005E-4PG156C	Xilinx Inc.	IC FPGA 112 I/O 156CPGA Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Through Hole Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 156-BCPGA Supplier Device Package: 156-CPGA (42.17x42.17)	Package: 156-BCPGA	Stock6,000
XC4005E-2PQ160I	Xilinx Inc.	IC FPGA 112 I/O 160QFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	Package: 160-BQFP	Stock7,776
XC6VSX475T-L1FFG1156C	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 37200 Number of Logic Elements/Cells: 476160 Total RAM Bits: 39223296 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock6,688
XCKU115-1FLVB2104C	Xilinx Inc.	IC FPGA 702 I/O 2104FCBGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	Package: 2104-BBGA, FCBGA	Stock4,368
XCKU9P-2FFVE900I	Xilinx Inc.	XCKU9P-2FFVE900I Number of LABs/CLBs: 34260 Number of Logic Elements/Cells: 599550 Total RAM Bits: 32870400 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: - Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock3,264
XC5VLX110T-2FF1738C	Xilinx Inc.	IC FPGA 680 I/O 1738FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 5455872 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	Package: 1738-BBGA, FCBGA	Stock6,656
XC5VFX70T-2FF1136I	Xilinx Inc.	IC FPGA 640 I/O 1136FCBGA Number of LABs/CLBs: 5600 Number of Logic Elements/Cells: 71680 Total RAM Bits: 5455872 Number of I/O: 640 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	Package: 1136-BBGA, FCBGA	Stock6,576
XC2VP40-6FF1148I	Xilinx Inc.	IC FPGA 804 I/O 1148FBGA Number of LABs/CLBs: 4848 Number of Logic Elements/Cells: 43632 Total RAM Bits: 3538944 Number of I/O: 804 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	Package: 1148-BBGA, FCBGA	Stock3,040
XCKU040-2FBVA900E	Xilinx Inc.	IC FPGA 468 I/O 900FCBGA Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Total RAM Bits: 21606000 Number of I/O: 468 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock4,896
XQV100-4CB228M	Xilinx Inc.	IC FPGA 2.5V 108K GATES 228CQFN Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 162 Number of Gates: 108904 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 228-CQFP Supplier Device Package: 228-CQFP (65.53x65.53)	Package: 228-CQFP	Stock5,200
XC2VP7-6FGG456I	Xilinx Inc.	IC FPGA 248 I/O 456FBGA Number of LABs/CLBs: 1232 Number of Logic Elements/Cells: 11088 Total RAM Bits: 811008 Number of I/O: 248 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock6,688
XC6SLX100-2FG676I	Xilinx Inc.	IC FPGA 480 I/O 676FCBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 480 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock7,744
XC6SLX100-3FG484C	Xilinx Inc.	IC FPGA 326 I/O 484FBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 326 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock6,304
XA7A75T-1CSG324Q	Xilinx Inc.	IC FPGA 210 I/O 324BGA Number of LABs/CLBs: 5900 Number of Logic Elements/Cells: 75520 Total RAM Bits: 3870720 Number of I/O: 210 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	Package: 324-LFBGA, CSPBGA	Stock3,136
XA6SLX9-3CSG324Q	Xilinx Inc.	IC FPGA 200 I/O 324CSGBGA Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 200 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	Package: 324-LFBGA, CSPBGA	Stock4,176
XC3S700AN-4FGG484C	Xilinx Inc.	IC FPGA 372 I/O 484FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 372 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock7,536
XC9536XL-7PCG44C	Xilinx Inc.	IC CPLD 36MC 7.5NS 44PLCC Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock2,704
XC2C384-7PQ208C	Xilinx Inc.	IC CPLD 384MC 7.1NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.1ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 173 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock11,952
XCDAISY-CP132	Xilinx Inc.	IC 132 BALL CHIP-SCALE BGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,336