Page 60 - Xilinx Inc. Products | Heisener Electronics

XC1736ESOG8C
Xilinx Inc.

IC PROM SERIAL CONFIG 36K 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock11,892
XC17S50APD8C
Xilinx Inc.

IC PROM SER 50000 C-TEMP 8-DIP

Package: 8-DIP (0.300", 7.62mm)

Stock12,840
XCZU3EG-1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Package: 784-BBGA, FCBGA

Stock2,656
XC7Z030-3FFG676E
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Package: 676-BBGA, FCBGA

Stock3,952
XCZU2EG-L1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Package: 784-BBGA, FCBGA

Stock5,376
XC7Z020-1CLG484C
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 484BGA

Package: 484-LFBGA, CSPBGA

Stock7,616
XC5VLX110-1FFG676CES
Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Package: 676-BBGA, FCBGA

Stock5,072
XCS30XL-4TQG144C
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

Package: 144-LQFP

Stock6,024
XCV600E-8FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock6,272
XCV1600E-8BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock5,328
XC4028XL-2BG352I
Xilinx Inc.

IC FPGA 256 I/O 352MBGA

Package: 352-LBGA, Metal

Stock6,832
XC4020E-4HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock7,024
XC4005XL-1PQ160I
Xilinx Inc.

IC FPGA 112 I/O 160QFP

Package: 160-BQFP

Stock5,168
XC5VFX200T-1FF1738I
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

Package: 1738-BBGA, FCBGA

Stock3,152
XC5VLX155-3FF1153C
Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

Package: 1153-BBGA, FCBGA

Stock2,768
XCKU060-2FFVA1156E
Xilinx Inc.

IC FPGA 520 I/O 1156FCBGA

Package: 1156-BBGA, FCBGA

Stock2,688
XQ7K325T-2RF676I
Xilinx Inc.

IC FPGA KINTEX-7 676-FBGA

Package: 676-BBGA, FCBGA

Stock6,160
XC2VP7-6FFG672I
Xilinx Inc.

IC FPGA 396 I/O 672FCBGA

Package: 672-BBGA, FCBGA

Stock5,728
XC7A100T-L2FGG676E
Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

Package: 676-BGA

Stock5,664
XC7A50T-2FT256I
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

Package: 256-LBGA

Stock2,208

Part Number	Manufacturer	Description	Package	Stock
XC1736ESOG8C	Xilinx Inc.	IC PROM SERIAL CONFIG 36K 8-SOIC Programmable Type: OTP Memory Size: 36kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	Package: 8-SOIC (0.154", 3.90mm Width)	Stock11,892
XC17S50APD8C	Xilinx Inc.	IC PROM SER 50000 C-TEMP 8-DIP Programmable Type: OTP Memory Size: 500kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	Package: 8-DIP (0.300", 7.62mm)	Stock12,840
XCZU3EG-1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock2,656
XC7Z030-3FFG676E	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock3,952
XCZU2EG-L1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock5,376
XC7Z020-1CLG484C	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX-7 484BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix?-7 FPGA, 85K Logic Cells Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	Package: 484-LFBGA, CSPBGA	Stock7,616
XC5VLX110-1FFG676CES	Xilinx Inc.	IC FPGA 440 I/O 676FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4718592 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,072
XCS30XL-4TQG144C	Xilinx Inc.	IC FPGA 113 I/O 144TQFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 113 Number of Gates: 30000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock6,024
XCV600E-8FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock6,272
XCV1600E-8BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 404 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock5,328
XC4028XL-2BG352I	Xilinx Inc.	IC FPGA 256 I/O 352MBGA Number of LABs/CLBs: 1024 Number of Logic Elements/Cells: 2432 Total RAM Bits: 32768 Number of I/O: 256 Number of Gates: 28000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock6,832
XC4020E-4HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 193 Number of Gates: 20000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock7,024
XC4005XL-1PQ160I	Xilinx Inc.	IC FPGA 112 I/O 160QFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	Package: 160-BQFP	Stock5,168
XC5VFX200T-1FF1738I	Xilinx Inc.	IC FPGA 960 I/O 1738FCBGA Number of LABs/CLBs: 15360 Number of Logic Elements/Cells: 196608 Total RAM Bits: 16809984 Number of I/O: 960 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	Package: 1738-BBGA, FCBGA	Stock3,152
XC5VLX155-3FF1153C	Xilinx Inc.	IC FPGA 800 I/O 1153FCBGA Number of LABs/CLBs: 12160 Number of Logic Elements/Cells: 155648 Total RAM Bits: 7077888 Number of I/O: 800 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1153-BBGA, FCBGA Supplier Device Package: 1153-FCBGA (35x35)	Package: 1153-BBGA, FCBGA	Stock2,768
XCKU060-2FFVA1156E	Xilinx Inc.	IC FPGA 520 I/O 1156FCBGA Number of LABs/CLBs: 41460 Number of Logic Elements/Cells: 725550 Total RAM Bits: 38912000 Number of I/O: 520 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock2,688
XQ7K325T-2RF676I	Xilinx Inc.	IC FPGA KINTEX-7 676-FBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock6,160
XC2VP7-6FFG672I	Xilinx Inc.	IC FPGA 396 I/O 672FCBGA Number of LABs/CLBs: 1232 Number of Logic Elements/Cells: 11088 Total RAM Bits: 811008 Number of I/O: 396 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FCBGA (27x27)	Package: 672-BBGA, FCBGA	Stock5,728
XC7A100T-L2FGG676E	Xilinx Inc.	IC FPGA 300 I/O 676FCBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	Package: 676-BGA	Stock5,664
XC7A50T-2FT256I	Xilinx Inc.	IC FPGA ARTIX7 170 I/O 256FTBGA Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 170 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock2,208
XA6SLX25-2FTG256Q	Xilinx Inc.	IC FPGA 186 I/O 256FTGBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 186 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock3,520
XC3S500E-4FTG256I	Xilinx Inc.	IC FPGA 190 I/O 256FTBGA Number of LABs/CLBs: 1164 Number of Logic Elements/Cells: 10476 Total RAM Bits: 368640 Number of I/O: 190 Number of Gates: 500000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock49,632
XC2S100-6FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 176 Number of Gates: 100000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock3,344
XA3S250E-4CPG132Q	Xilinx Inc.	IC FPGA 92 I/O 132CSBGA Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 92 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 132-TFBGA, CSPBGA Supplier Device Package: 132-CSPBGA (8x8)	Package: 132-TFBGA, CSPBGA	Stock5,472
XC7A35T-1FGG484C	Xilinx Inc.	IC FPGA 250 I/O 484FCBGA Number of LABs/CLBs: 2600 Number of Logic Elements/Cells: 33208 Total RAM Bits: 1843200 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock4,368
XCR3512XL-10PQ208C	Xilinx Inc.	IC CPLD 512MC 9NS 208QFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 180 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock4,976
XC2C256-7FT256I	Xilinx Inc.	IC CPLD 256MC 6.7NS 256BGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 184 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock7,504
XC7S15-1CPGA196I	Xilinx Inc.	XC7S15-1CPGA196I Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 12800 Total RAM Bits: 368640 Number of I/O: 100 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 196-TFBGA, CSBGA Supplier Device Package: 196-CSPBGA (8x8)	Package: 196-TFBGA, CSBGA	Stock6,864