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Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock7,506 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS GLD
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 44 (2 x 22)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock8,658 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS GLD
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 42 (2 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock4,068 |
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Aries Electronics |
CONN IC DIP SOCKET 60POS GOLD
- Type: DIP, 0.9" (22.86mm) Row Spacing
- Number of Positions or Pins (Grid): 60 (2 x 30)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,442 |
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Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame, Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock2,106 |
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Aries Electronics |
CONN IC DIP SOCKET 36POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 36 (2 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole, Right Angle, Horizontal
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -
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Package: - |
Stock4,842 |
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Aries Electronics |
CONN IC DIP SOCKET 34POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 34 (2 x 17)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole, Right Angle, Horizontal
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,190 |
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Aries Electronics |
CONN SOCKET SIP 34POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 34 (1 x 34)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock6,984 |
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Aries Electronics |
CONN SOCKET SIP 24POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 24 (1 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock6,174 |
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Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole, Right Angle, Horizontal
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,082 |
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Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock4,446 |
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Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame, Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock2,826 |
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Aries Electronics |
CONN IC DIP SOCKET 30POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 30 (2 x 15)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock2,754 |
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Aries Electronics |
CONN SOCKET SIP 9POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 9 (1 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock8,730 |
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Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock3,474 |
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Aries Electronics |
CONN IC DIP SOCKET 34POS GOLD
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 34 (2 x 17)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock8,856 |
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Aries Electronics |
CONN SOCKET SIP 32POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 32 (1 x 32)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock6,318 |
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Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock5,580 |
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Aries Electronics |
SOCKET ADAPTER SOIC TO 10SOWIC
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): SOWIC
- Number of Pins: 10
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Surface Mount
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock7,920 |
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Aries Electronics |
SOCKET ADAPTER SOIC TO 10DIP 0.3
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 10
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: Polyimide (PI)
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Package: - |
Stock3,006 |
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Aries Electronics |
SOCKET ADAPTER SOIC TO 8DIP 0.3
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 8
- Pitch - Mating: -
- Contact Finish - Mating: Tin
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: Polyimide (PI)
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Package: - |
Stock12,390 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 32
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.300" (7.62mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: 200µin (5.08µm)
- Color: Black
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Package: - |
Stock4,266 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: Header
- Contact Type: Male Pin
- Number of Positions: 16
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.300" (7.62mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: Programmed
- Contact Finish: Tin
- Contact Finish Thickness: 50µin (1.27µm)
- Color: Black
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Package: - |
Stock2,592 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 8
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.600" (15.24mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock3,312 |
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Aries Electronics |
0625 PIN-LINE HDR SCRW MACH CONT
- Connector Type: Header Strip
- Contact Type: Post
- Number of Positions: 10
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: 200µin (5.08µm)
- Color: Black
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Package: - |
Stock3,348 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Solder Cup
- Number of Positions: 4
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.300" (7.62mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock3,150 |
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Aries Electronics |
0600 STRIP-LINE HDR COINED CNTCT
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 6
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock8,838 |
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Aries Electronics |
600 DIP HDR COINED CONTACTS
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 2
- Pitch: -
- Number of Rows: 2
- Row Spacing: 0.300" (7.62mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: 200µin (5.08µm)
- Color: Black
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Package: - |
Stock3,474 |
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