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Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock3,006 |
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Aries Electronics |
CONN SOCKET PGA ZIF GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -65°C ~ 125°C
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Package: - |
Stock3,744 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 36POS
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 36 (2 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50µin (1.27µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50µin (1.27µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock8,010 |
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Aries Electronics |
CONN SOCKET SIP 29POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 29 (1 x 29)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,136 |
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Aries Electronics |
CONN SOCKET SIP 34POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 34 (1 x 34)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock3,330 |
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Aries Electronics |
CONN SOCKET SIP 27POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 27 (1 x 27)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock3,582 |
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Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock4,284 |
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Aries Electronics |
CONN IC DIP SOCKET 26POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 26 (2 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock7,650 |
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Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame, Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,856 |
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Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame, Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock3,798 |
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Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock2,394 |
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Aries Electronics |
CONN IC DIP SOCKET 48POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock4,500 |
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Aries Electronics |
CONN SOCKET SIP 30POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 30 (1 x 30)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock2,052 |
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Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock5,706 |
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Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
- Type: DIP, 0.9" (22.86mm) Row Spacing
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock4,050 |
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Aries Electronics |
CONN IC DIP SOCKET 36POS GOLD
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 36 (2 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock3,294 |
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Aries Electronics |
CONN SOCKET SIP 40POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 40 (1 x 40)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock4,392 |
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Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock5,202 |
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Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock6,948 |
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Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 10 (2 x 5)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock3,726 |
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Aries Electronics |
CONN SOCKET SIP 3POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 3 (1 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA), Nylon, Glass Filled
- Operating Temperature: -
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Package: - |
Stock2,214 |
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Aries Electronics |
SP200-SJ200 .040 SHRTNG JACK
- Type: Closed Top, Grip
- Gender: Female Sockets
- Number of Positions or Pins (Grid): 2 (1 x 2)
- Pitch: 0.200" (5.08mm)
- Height: 0.480" (12.20mm)
- Contact Finish: Gold
- Contact Finish Thickness: 30µin (0.76µm)
- Color: Black
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Package: - |
Stock2,520 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Forked
- Number of Positions: 38
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.600" (15.24mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock6,444 |
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Aries Electronics |
0625 PIN-LINE HDR SCRW MACH CONT
- Connector Type: Header Strip
- Contact Type: Post
- Number of Positions: 20
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock6,930 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Forked
- Number of Positions: 16
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.300" (7.62mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock5,508 |
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Aries Electronics |
0600 STRIP-LINE HDR COINED CNTCT
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 12
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock3,186 |
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Aries Electronics |
0600 STRIP-LINE HDR COINED CNTCT
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 8
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock8,784 |
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Aries Electronics |
DIP STRIP FEMALE 20 POSITION
- Connector Type: Receptacle, Breakaway
- Contact Type: Female Socket
- Style: -
- Number of Positions: 20
- Number of Positions Loaded: All
- Pitch - Mating: 0.200" (5.08mm)
- Number of Rows: 2
- Row Spacing - Mating: 0.200" (5.08mm)
- Mounting Type: Through Hole
- Termination: Solder
- Fastening Type: -
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Insulation Color: Black
- Insulation Height: 0.040" (1.02mm)
- Contact Length - Post: 0.129" (3.28mm)
- Operating Temperature: -55°C ~ 105°C
- Material Flammability Rating: UL94 V-0
- Contact Finish - Post: Tin
- Mated Stacking Heights: -
- Ingress Protection: -
- Features: -
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Package: - |
Stock9,180 |
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