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Aries Electronics |
CONN IC DIP SOCKET 22POS TIN
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid): 22 (2 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock5,526 |
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Aries Electronics |
CONN SOCKET PGA ZIF GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -65°C ~ 125°C
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Package: - |
Stock5,670 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50µin (1.27µm)
- Contact Material - Mating: Beryllium Nickel
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50µin (1.27µm)
- Contact Material - Post: Beryllium Nickel
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock2,736 |
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Aries Electronics |
CONN IC DIP SOCKET 38POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 38 (2 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock6,246 |
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Aries Electronics |
CONN SOCKET SIP 28POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 28 (1 x 28)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock3,888 |
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Aries Electronics |
CONN SOCKET SIP 40POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 40 (1 x 40)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock7,236 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS TIN
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock3,312 |
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Aries Electronics |
CONN SOCKET SIP 40POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 40 (1 x 40)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock3,330 |
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Aries Electronics |
CONN IC DIP SOCKET 22POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 22 (2 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame, Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock3,436 |
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Aries Electronics |
CONN SOCKET SIP 34POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 34 (1 x 34)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock2,682 |
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Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock7,362 |
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Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame, Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,802 |
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Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock3,508 |
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Aries Electronics |
CONN SOCKET SIP 21POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 21 (1 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: -
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock5,670 |
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Aries Electronics |
CONN SOCKET SIP 10POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 10 (1 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock6,534 |
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Aries Electronics |
CONN SOCKET SIP 3POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 3 (1 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,586 |
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Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 10 (2 x 5)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame, Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,154 |
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Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 6 (2 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock2,988 |
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Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole, Right Angle, Horizontal
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock6,408 |
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Aries Electronics |
CONN SOCKET SIP 4POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 4 (1 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock2,610 |
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Aries Electronics |
CONN SOCKET SIP 22POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 22 (1 x 22)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock4,356 |
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Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
- Type: DIP, 0.9" (22.86mm) Row Spacing
- Number of Positions or Pins (Grid): 6 (2 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock8,298 |
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Aries Electronics |
CONN SOCKET SIP 1POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 1 (1 x 1)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock3,960 |
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Aries Electronics |
SOCKET ADAPTER SSOP TO 28DIP 0.3
- Convert From (Adapter End): SSOP
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 28
- Pitch - Mating: 0.026" (0.65mm)
- Contact Finish - Mating: Gold
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock7,560 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Forked
- Number of Positions: 16
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.800" (20.32mm)
- Mounting Type: Through Hole
- Termination: Wire Wrap
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock6,570 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 48
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.600" (15.24mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock3,258 |
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Aries Electronics |
675 DIP PROGRAM HEADER
- Connector Type: Header
- Contact Type: Male Pin
- Number of Positions: 8
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.300" (7.62mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: Programmable
- Contact Finish: Gold
- Contact Finish Thickness: -
- Color: Black
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Package: - |
Stock3,562 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: -
- Contact Type: -
- Number of Positions: -
- Pitch: -
- Number of Rows: -
- Row Spacing: -
- Mounting Type: -
- Termination: -
- Features: -
- Contact Finish: -
- Contact Finish Thickness: -
- Color: -
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Package: - |
Stock2,412 |
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0
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