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10AS022C3U19E2SG
Intel

484-PIN UBGA

Package: -

Stock2,304
HC20K400FC672
Intel

IC FPGA APEX 672FCBGA

Package: 672-BBGA

Stock7,632
10AX048K2F35I1SG
Intel

IC FPGA 396 I/O 1152FCBGA

Package: 1152-BBGA, FCBGA

Stock7,440
EPF81500AQC240-3
Intel

IC FPGA 181 I/O 240QFP

Package: 240-BFQFP

Stock6,512
EP1SGX10DF672C6
Intel

IC FPGA 362 I/O 672FBGA

Package: 672-BBGA, FCBGA

Stock7,120
EP1S10F780C7N
Intel

IC FPGA 426 I/O 780FBGA

Package: 780-BBGA

Stock4,912
10CL025YU256I7G
Intel

IC FPGA 150 I/O 256 UBGA

Package: 256-LFBGA

Stock2,944
5SGTMC7K3F40I2N
Intel

IC FPGA 600 I/O 1517FBGA

Package: 1517-BBGA, FCBGA

Stock4,912
5SGXEA5N2F45C2L
Intel

IC FPGA 840 I/O 1932FBGA

Package: 1932-BBGA, FCBGA

Stock6,272
5SGXEA5H2F35I3L
Intel

IC FPGA 552 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock2,464
5SGXEA3H3F35I3L
Intel

IC FPGA 432 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock3,840
EP2C70F896I8
Intel

IC FPGA 622 I/O 896FBGA

Package: 896-BGA

Stock3,472
EP4CE30F23C6
Intel

IC FPGA 328 I/O 484FBGA

Package: 484-BGA

Stock2,848
EPM7128BTC100-10
Intel

IC CPLD 128MC 10NS 100TQFP

Package: 100-TQFP

Stock3,856
EPM7256BFC256-7
Intel

IC CPLD 256MC 7.5NS 256FBGA

Package: 256-BGA

Stock8,688
AGFB019R24C2E2V
Intel

IC

Package: -

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AGFB027R24C3I3E
Intel

IC FPGA AGILEX-F 2340FBGA

Package: -

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5SGXMA9N2F45C2G
Intel

IC FPGA 840 I/O 1932FBGA

Package: -

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5SGXEA7N3F40C2LG
Intel

IC FPGA 600 I/O 1517FBGA

Package: -

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AGFB014R24C2E2VB
Intel

IC FPGA AGILEX-F 2340BGA

Package: -

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Part Number	Manufacturer	Description	Package	Stock
10AS022C3U19E2SG	Intel	484-PIN UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock2,304
HC20K400FC672	Intel	IC FPGA APEX 672FCBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 16640 Total RAM Bits: 212992 Number of I/O: - Number of Gates: 400000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BBGA	Stock7,632
10AX048K2F35I1SG	Intel	IC FPGA 396 I/O 1152FCBGA Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Total RAM Bits: 5664768 Number of I/O: 396 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock7,440
EPF81500AQC240-3	Intel	IC FPGA 181 I/O 240QFP Number of LABs/CLBs: 162 Number of Logic Elements/Cells: 1296 Total RAM Bits: - Number of I/O: 181 Number of Gates: 16000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock6,512
EP1SGX10DF672C6	Intel	IC FPGA 362 I/O 672FBGA Number of LABs/CLBs: 1057 Number of Logic Elements/Cells: 10570 Total RAM Bits: 920448 Number of I/O: 362 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BBGA, FCBGA	Stock7,120
EP1S10F780C7N	Intel	IC FPGA 426 I/O 780FBGA Number of LABs/CLBs: 1057 Number of Logic Elements/Cells: 10570 Total RAM Bits: 920448 Number of I/O: 426 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA	Stock4,912
10CL025YU256I7G	Intel	IC FPGA 150 I/O 256 UBGA Number of LABs/CLBs: 1539 Number of Logic Elements/Cells: 24624 Total RAM Bits: 608256 Number of I/O: 150 Number of Gates: - Voltage - Supply: 1.2V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LFBGA Supplier Device Package: 256-UBGA (14x14)	Package: 256-LFBGA	Stock2,944
5SGTMC7K3F40I2N	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 234750 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59938816 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock4,912
5SGXEA5N2F45C2L	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: 1932-BBGA, FCBGA	Stock6,272
5SGXEA5H2F35I3L	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock2,464
5SGXEA3H3F35I3L	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock3,840
EP2C70F896I8	Intel	IC FPGA 622 I/O 896FBGA Number of LABs/CLBs: 4276 Number of Logic Elements/Cells: 68416 Total RAM Bits: 1152000 Number of I/O: 622 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	Package: 896-BGA	Stock3,472
EP4CE30F23C6	Intel	IC FPGA 328 I/O 484FBGA Number of LABs/CLBs: 1803 Number of Logic Elements/Cells: 28848 Total RAM Bits: 608256 Number of I/O: 328 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BGA	Stock2,848
EPM7128BTC100-10	Intel	IC CPLD 128MC 10NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-TQFP	Stock3,856
EPM7256BFC256-7	Intel	IC CPLD 256MC 7.5NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock8,688
AGFB019R24C2E2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote
AGFB027R24C3I3E	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
5SGXMA9N2F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: -	Request a Quote
5SGXEA7N3F40C2LG	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: -	Request a Quote
AGFB014R24C2E2VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote
AGFA027R24C2E3E	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
5SGXMA7K3F35C2G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
5SGSMD5K2F40C2G	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 172600 Number of Logic Elements/Cells: 457000 Total RAM Bits: 39936000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: -	Request a Quote
AGFD023R24C2I1VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote
1SG280LU3F50I3VP	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote
5SGXMABK3H40I4G	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	Package: -	Request a Quote
5SGXMA7K2F35I3LG	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
1SG165HN3F43I3VGAS	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote