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Intel |
IC FLASH 32MBIT 70NS 66SCSP
- Memory Type: Non-Volatile
- Memory Format: FLASH, RAM
- Technology: FLASH, SRAM
- Memory Size: 32Mbit Flash, 8Mbit RAM
- Memory Interface: Parallel
- Clock Frequency: -
- Write Cycle Time - Word, Page: 70ns
- Access Time: 70ns
- Voltage - Supply: 2.7 V ~ 3.3 V
- Operating Temperature: -25°C ~ 85°C (TC)
- Mounting Type: Surface Mount
- Package / Case: 66-LFBGA, CSPBGA
- Supplier Device Package: 66-SCSP (8x14)
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Package: 66-LFBGA, CSPBGA |
Stock6,400 |
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Intel |
672-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,616 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 2430
- Number of Logic Elements/Cells: 24320
- Total RAM Bits: 622592
- Number of I/O: 735
- Number of Gates: 2750000
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1020-BBGA
- Supplier Device Package: 1020-FBGA (33x33)
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Package: 1020-BBGA |
Stock3,824 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 832
- Number of Logic Elements/Cells: 8320
- Total RAM Bits: 106496
- Number of I/O: 144
- Number of Gates: 526000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock5,568 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 640
- Number of Logic Elements/Cells: 6400
- Total RAM Bits: 81920
- Number of I/O: -
- Number of Gates: 404000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-BGA
- Supplier Device Package: 400-BGA
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Package: 400-BGA |
Stock5,664 |
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Intel |
IC FPGA 252 I/O 356BGA
- Number of LABs/CLBs: 416
- Number of Logic Elements/Cells: 4160
- Total RAM Bits: 53248
- Number of I/O: 252
- Number of Gates: 263000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 356-LBGA
- Supplier Device Package: 356-BGA (35x35)
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Package: 356-LBGA |
Stock7,632 |
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Intel |
IC FPGA 66 I/O 100TQFP
- Number of LABs/CLBs: 72
- Number of Logic Elements/Cells: 576
- Total RAM Bits: 12288
- Number of I/O: 66
- Number of Gates: 56000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
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Package: 100-TQFP |
Stock5,648 |
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Intel |
1152-PIN FBGA
- Number of LABs/CLBs: 183590
- Number of Logic Elements/Cells: 480000
- Total RAM Bits: 5664768
- Number of I/O: 492
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,552 |
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Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: 1932-BBGA, FCBGA |
Stock5,568 |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 53105664
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock4,928 |
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Intel |
IC FPGA 432 I/O 1517FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 48927744
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock3,568 |
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Intel |
IC FPGA 744 I/O 1152FBGA
- Number of LABs/CLBs: 3200
- Number of Logic Elements/Cells: 80000
- Total RAM Bits: 6843392
- Number of I/O: 744
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,144 |
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Intel |
IC FPGA 240 I/O 484MBGA
- Number of LABs/CLBs: 56480
- Number of Logic Elements/Cells: 149500
- Total RAM Bits: 7880704
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA
- Supplier Device Package: 484-MBGA (15x15)
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Package: 484-LFBGA |
Stock2,576 |
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Intel |
IC FPGA 152 I/O 256FBGA
- Number of LABs/CLBs: 903
- Number of Logic Elements/Cells: 14448
- Total RAM Bits: 239616
- Number of I/O: 152
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-LBGA |
Stock6,672 |
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Intel |
IC CPLD 64MC 10NS 44PLCC
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 64
- Number of Gates: 1250
- Number of I/O: 34
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock11,268 |
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Intel |
INTEL I/O CONTROLLER HUB 8
- Protocol: -
- Function: -
- Interface: -
- Standards: -
- Voltage - Supply: -
- Current - Supply: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2486FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 440 I/O 2397BGA
- Number of LABs/CLBs: 206250
- Number of Logic Elements/Cells: 1650000
- Total RAM Bits: -
- Number of I/O: 440
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 654 I/O 1517HBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
CHIPSET FOR APPLIED COMPUTING
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 296 I/O 2912BGA
- Number of LABs/CLBs: 350000
- Number of Logic Elements/Cells: 2800000
- Total RAM Bits: -
- Number of I/O: 296
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 317000
- Number of Logic Elements/Cells: 840000
- Total RAM Bits: 53248000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1760FBGA
- Number of LABs/CLBs: 225400
- Number of Logic Elements/Cells: 597000
- Total RAM Bits: 53248000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
INTEL CELERON M PROCESSOR
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
MUX/DEMUX CHIPSET
- Type: -
- Circuit: -
- Independent Circuits: -
- Current - Output High, Low: -
- Voltage Supply Source: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 1650K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-I 2957FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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