|
|
Intel |
IC MCU 8BIT 16KB OTP 44PLCC
- Core Processor: MCS 51
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: SIO
- Peripherals: WDT
- Number of I/O: 32
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC
|
Package: 44-LCC (J-Lead) |
Stock18,846 |
|
|
|
Intel |
IC FPGA 188 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 25K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
|
Package: 672-FBGA |
Stock2,100 |
|
|
|
Intel |
IC FPGA FBGA
- Number of LABs/CLBs: 4125
- Number of Logic Elements/Cells: 41250
- Total RAM Bits: 3423744
- Number of I/O: 624
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1020-BBGA, FCBGA
- Supplier Device Package: 1020-FBGA (33x33)
|
Package: 1020-BBGA, FCBGA |
Stock5,232 |
|
|
|
Intel |
IC FPGA 588 I/O 1020FBGA
- Number of LABs/CLBs: 2432
- Number of Logic Elements/Cells: 24320
- Total RAM Bits: 311296
- Number of I/O: 588
- Number of Gates: 1537000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1020-BBGA
- Supplier Device Package: 1020-FBGA (33x33)
|
Package: 1020-BBGA |
Stock5,632 |
|
|
|
Intel |
IC FPGA 252 I/O 324FBGA
- Number of LABs/CLBs: 416
- Number of Logic Elements/Cells: 4160
- Total RAM Bits: 53248
- Number of I/O: 252
- Number of Gates: 263000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 324-BGA
- Supplier Device Package: 324-FBGA (19x19)
|
Package: 324-BGA |
Stock2,176 |
|
|
|
Intel |
IC FPGA 726 I/O 1020FBGA
- Number of LABs/CLBs: 3247
- Number of Logic Elements/Cells: 32470
- Total RAM Bits: 3317184
- Number of I/O: 726
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1020-BBGA
- Supplier Device Package: 1020-FBGA (33x33)
|
Package: 1020-BBGA |
Stock7,952 |
|
|
|
Intel |
IC FPGA 564 I/O 1152FBGA
- Number of LABs/CLBs: 9120
- Number of Logic Elements/Cells: 228000
- Total RAM Bits: 17544192
- Number of I/O: 564
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock6,976 |
|
|
|
Intel |
IC FPGA 1120 I/O 1760FBGA
- Number of LABs/CLBs: 13500
- Number of Logic Elements/Cells: 337500
- Total RAM Bits: 18822144
- Number of I/O: 1120
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
|
Package: 1760-BBGA, FCBGA |
Stock3,328 |
|
|
|
Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 43983872
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock2,480 |
|
|
|
Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 53105664
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock6,880 |
|
|
|
Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 135840
- Number of Logic Elements/Cells: 360000
- Total RAM Bits: 23946240
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock7,344 |
|
|
|
Intel |
IC FPGA 372 I/O 1152FBGA
- Number of LABs/CLBs: 4224
- Number of Logic Elements/Cells: 105600
- Total RAM Bits: 9793536
- Number of I/O: 372
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock7,712 |
|
|
|
Intel |
IC FPGA 744 I/O 1152FBGA
- Number of LABs/CLBs: 3200
- Number of Logic Elements/Cells: 80000
- Total RAM Bits: 6843392
- Number of I/O: 744
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock7,936 |
|
|
|
Intel |
IC FPGA 704 I/O 1517FBGA
- Number of LABs/CLBs: 17110
- Number of Logic Elements/Cells: 362000
- Total RAM Bits: 19822592
- Number of I/O: 704
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: 1517-BBGA |
Stock5,664 |
|
|
|
Intel |
IC FPGA 560 I/O 1152FBGA
- Number of LABs/CLBs: 113560
- Number of Logic Elements/Cells: 301000
- Total RAM Bits: 14251008
- Number of I/O: 560
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BGA |
Stock4,800 |
|
|
|
Intel |
IC FPGA 361 I/O 780FBGA
- Number of LABs/CLBs: 1694
- Number of Logic Elements/Cells: 33880
- Total RAM Bits: 1369728
- Number of I/O: 361
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA
- Supplier Device Package: 780-FBGA (29x29)
|
Package: 780-BBGA |
Stock4,896 |
|
|
|
Intel |
IC FPGA 82 I/O 144EQFP
- Number of LABs/CLBs: 1539
- Number of Logic Elements/Cells: 24624
- Total RAM Bits: 608256
- Number of I/O: 82
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 144-LQFP Exposed Pad
- Supplier Device Package: 144-EQFP (20x20)
|
Package: 144-LQFP Exposed Pad |
Stock4,976 |
|
|
|
Intel |
IC CPLD 256MC 15NS 192PGA
- Programmable Type: EE PLD
- Delay Time tpd(1) Max: 15.0ns
- Voltage Supply - Internal: 4.5 V ~ 5.5 V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 256
- Number of Gates: 5000
- Number of I/O: 164
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock6,192 |
|
|
|
Intel |
IC CPLD 128MC 6NS 100TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 6.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 8
- Number of Macrocells: 128
- Number of Gates: 2500
- Number of I/O: 84
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
|
Package: 100-TQFP |
Stock4,768 |
|
|
|
Intel |
IC FPGA 384 I/O 896FBGA
- Number of LABs/CLBs: 14151
- Number of Logic Elements/Cells: 300000
- Total RAM Bits: 17358848
- Number of I/O: 384
- Number of Gates: -
- Voltage - Supply: 1.07V ~ 1.13V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
|
Package: 896-BBGA, FCBGA |
Stock5,120 |
|
|
|
Intel |
IC FPGA 688 I/O 1760FBGA
- Number of LABs/CLBs: 206250
- Number of Logic Elements/Cells: 1650000
- Total RAM Bits: -
- Number of I/O: 688
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 600 I/O 1760HBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 53248000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-HBGA (45x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
MEMORY CONTROLLER, CMOS
- Controller Type: Controller Hub
- Voltage - Supply: 4.75V ~ 5.25V
- Operating Temperature: 0°C ~ 75°C (TC)
- Package / Case: 132-BCPGA
- Supplier Device Package: 132-CPGA (36.8x36.8)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-I 2957BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2957-BFBGA Exposed Pad
- Supplier Device Package: 2957-BGA (56x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC INTERFACE SYSTEM 493FCBGA
- Type: Interface System
- Applications: -
- Mounting Type: Surface Mount
- Package / Case: 493-TFBGA, FCBGA
- Supplier Device Package: 493-FCBGA (14x14)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 46080000
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: - |
Request a Quote |
|