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10AS066K4F35I3SGES
Intel

IC SOC FPGA 396 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock3,968
5CSEMA6U23C6N
Intel

IC FPGA 145 I/O 672UBGA

Package: 672-FBGA

Stock2,464
EPC8QI100
Intel

IC CONFIG DEVICE 8MBIT 100QFP

Package: 100-BQFP

Stock5,904
EPF10K50SFC484-2
Intel

IC FPGA 220 I/O 484FBGA

Package: 484-BBGA

Stock4,064
EPF10K10ATC144-3N
Intel

IC FPGA 102 I/O 144TQFP

Package: 144-LQFP

Stock6,800
5SEE9F45I2N
Intel

IC FPGA 840 I/O 1932FBGA

Package: 1932-BBGA, FCBGA

Stock7,888
EP4SGX110FF35C3G
Intel

1152-PIN FBGA

Package: 1152-BBGA, FCBGA

Stock4,688
EP2S90F1508C5N
Intel

IC FPGA 902 I/O 1508FBGA

Package: 1508-BBGA, FCBGA

Stock6,016
10AX057K4F35E3LG
Intel

IC FPGA 396 I/O 1152FCBGA

Package: 1152-BBGA, FCBGA

Stock7,056
EP4CGX150DF27I7
Intel

IC FPGA 393 I/O 672FBGA

Package: 672-BGA

Stock3,440
EP4CE22F17I7
Intel

IC FPGA 153 I/O 256FBGA

Package: 256-LBGA

Stock3,712
EP4CE6E22C8
Intel

IC FPGA 91 I/O 144EQFP

Package: 144-LQFP Exposed Pad

Stock3,520
5CEBA2F17I7N
Intel

IC FPGA 128 I/O 256FBGA

Package: 256-LBGA

Stock6,720
10M08DCF256C8G
Intel

IC FPGA 178 I/O 256FBGA

Package: 256-LBGA

Stock6,080
EPM7064STC100-10N
Intel

IC CPLD 64MC 10NS 100TQFP

Package: 100-TQFP

Stock24,600
AGIB023R31B2I2VB
Intel

IC FPGA AGILEX-I 3184BGA

Package: -

Request a Quote
1SG250HH1F55I1VG
Intel

IC FPGA 1160 I/O 2912BGA

Package: -

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1ST165EU2F50I2LG
Intel

IC FPGA 440 I/O 2397BGA

Package: -

Request a Quote
5962-9089904MUA
Intel

IC FLASH 1MBIT PAR 32CFLATPACK

Package: -

Request a Quote
AGID023R18A2E3V
Intel

IC FPGA AGILEX-I 1805FBGA

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock
10AS066K4F35I3SGES	Intel	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock3,968
5CSEMA6U23C6N	Intel	IC FPGA 145 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	Package: 672-FBGA	Stock2,464
EPC8QI100	Intel	IC CONFIG DEVICE 8MBIT 100QFP Programmable Type: In System Programmable Memory Size: 8MB Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	Package: 100-BQFP	Stock5,904
EPF10K50SFC484-2	Intel	IC FPGA 220 I/O 484FBGA Number of LABs/CLBs: 360 Number of Logic Elements/Cells: 2880 Total RAM Bits: 40960 Number of I/O: 220 Number of Gates: 199000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock4,064
EPF10K10ATC144-3N	Intel	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 72 Number of Logic Elements/Cells: 576 Total RAM Bits: 6144 Number of I/O: 102 Number of Gates: 31000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock6,800
5SEE9F45I2N	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 64210944 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: 1932-BBGA, FCBGA	Stock7,888
EP4SGX110FF35C3G	Intel	1152-PIN FBGA Number of LABs/CLBs: 4224 Number of Logic Elements/Cells: 105600 Total RAM Bits: 9793536 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock4,688
EP2S90F1508C5N	Intel	IC FPGA 902 I/O 1508FBGA Number of LABs/CLBs: 4548 Number of Logic Elements/Cells: 90960 Total RAM Bits: 4520488 Number of I/O: 902 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1508-BBGA, FCBGA Supplier Device Package: 1508-FBGA (30x30)	Package: 1508-BBGA, FCBGA	Stock6,016
10AX057K4F35E3LG	Intel	IC FPGA 396 I/O 1152FCBGA Number of LABs/CLBs: 217080 Number of Logic Elements/Cells: 570000 Total RAM Bits: 42082304 Number of I/O: 396 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock7,056
EP4CGX150DF27I7	Intel	IC FPGA 393 I/O 672FBGA Number of LABs/CLBs: 9360 Number of Logic Elements/Cells: 149760 Total RAM Bits: 6635520 Number of I/O: 393 Number of Gates: - Voltage - Supply: 1.16 V ~ 1.24 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BGA	Stock3,440
EP4CE22F17I7	Intel	IC FPGA 153 I/O 256FBGA Number of LABs/CLBs: 1395 Number of Logic Elements/Cells: 22320 Total RAM Bits: 608256 Number of I/O: 153 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-LBGA	Stock3,712
EP4CE6E22C8	Intel	IC FPGA 91 I/O 144EQFP Number of LABs/CLBs: 392 Number of Logic Elements/Cells: 6272 Total RAM Bits: 276480 Number of I/O: 91 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	Package: 144-LQFP Exposed Pad	Stock3,520
5CEBA2F17I7N	Intel	IC FPGA 128 I/O 256FBGA Number of LABs/CLBs: 9434 Number of Logic Elements/Cells: 25000 Total RAM Bits: 2002944 Number of I/O: 128 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-LBGA	Stock6,720
10M08DCF256C8G	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 500 Number of Logic Elements/Cells: 8000 Total RAM Bits: 387072 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-LBGA	Stock6,080
EPM7064STC100-10N	Intel	IC CPLD 64MC 10NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-TQFP	Stock24,600
AGIB023R31B2I2VB	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
1SG250HH1F55I1VG	Intel	IC FPGA 1160 I/O 2912BGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 1160 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	Package: -	Request a Quote
1ST165EU2F50I2LG	Intel	IC FPGA 440 I/O 2397BGA Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Total RAM Bits: - Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote
5962-9089904MUA	Intel	IC FLASH 1MBIT PAR 32CFLATPACK Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 1Mbit Memory Interface: Parallel Clock Frequency: - Write Cycle Time - Word, Page: - Access Time: 120 ns Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -55°C ~ 125°C (TC) Mounting Type: Surface Mount Package / Case: 32-CFlatpack Supplier Device Package: 32-CFlatpack	Package: -	Request a Quote
AGID023R18A2E3V	Intel	IC FPGA AGILEX-I 1805FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
P2114A5	Intel	IC SRAM 4KBIT PARALLEL 18DIP Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Asynchronous Memory Size: 4Kbit Memory Interface: Parallel Clock Frequency: - Write Cycle Time - Word, Page: 250ns Access Time: 250 ns Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 18-DIP Supplier Device Package: 18-DIP	Package: -	Request a Quote
AGFA019R24C2I3E	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote
EP4SGX290KF40C3NAB	Intel	IC FPGA 744 I/O 1517FBGA Number of LABs/CLBs: 116480 Number of Logic Elements/Cells: 291200 Total RAM Bits: 17661952 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: -	Request a Quote
AGIB023R18A2E2VR0	Intel	IC FPGA AGILEX-I 1805FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
RK80546KG1122MMS	Intel	PRESCOTT CELERON PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
5SGSMD4H1F35C1G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 19456000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
AGFA023R31C2I2VB	Intel	IC FPGA AGILEX-F 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
5SGXEA7H3F35C4WN	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote