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Intel |
IC SOC FPGA 384 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,168 |
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Intel |
IC CONFIG DEVICE 212KBIT 20PLCC
- Programmable Type: OTP
- Memory Size: 212kb
- Voltage - Supply: 4.75 V ~ 5.25 V
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 20-LCC (J-Lead)
- Supplier Device Package: 20-PLCC (9x9)
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Package: 20-LCC (J-Lead) |
Stock4,208 |
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Intel |
IC FPGA 102 I/O 144TQFP
- Number of LABs/CLBs: 216
- Number of Logic Elements/Cells: 1728
- Total RAM Bits: 12288
- Number of I/O: 102
- Number of Gates: 69000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock6,128 |
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Intel |
672-PIN FBGA
- Number of LABs/CLBs: 80330
- Number of Logic Elements/Cells: 220000
- Total RAM Bits: 13752320
- Number of I/O: 236
- Number of Gates: -
- Voltage - Supply: 0.9V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock6,368 |
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Intel |
IC FPGA 56 I/O 81WLCSP
- Number of LABs/CLBs: 500
- Number of Logic Elements/Cells: 8000
- Total RAM Bits: 387072
- Number of I/O: 56
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 81-UFBGA, WLCSP
- Supplier Device Package: 81-VBGA, WLCSP (4.5x4.4)
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Package: 81-UFBGA, WLCSP |
Stock20,772 |
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Intel |
IC FPGA 564 I/O 1152FBGA
- Number of LABs/CLBs: 14144
- Number of Logic Elements/Cells: 353600
- Total RAM Bits: 23105536
- Number of I/O: 564
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,032 |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,448 |
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Intel |
IC FPGA 742 I/O 1020FBGA
- Number of LABs/CLBs: 6627
- Number of Logic Elements/Cells: 132540
- Total RAM Bits: 6747840
- Number of I/O: 742
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1020-BBGA
- Supplier Device Package: 1020-FBGA (33x33)
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Package: 1020-BBGA |
Stock4,656 |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock3,136 |
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Intel |
IC FPGA 210 I/O 484FBGA
- Number of LABs/CLBs: 12404
- Number of Logic Elements/Cells: 198464
- Total RAM Bits: 8211456
- Number of I/O: 210
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BGA |
Stock5,376 |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 128300
- Number of Logic Elements/Cells: 340000
- Total RAM Bits: 23704576
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock3,344 |
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Intel |
IC FPGA 704 I/O 1517FBGA
- Number of LABs/CLBs: 19811
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 23625728
- Number of I/O: 704
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA |
Stock3,008 |
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Intel |
IC FPGA 342 I/O 484FBGA
- Number of LABs/CLBs: 1694
- Number of Logic Elements/Cells: 33880
- Total RAM Bits: 1369728
- Number of I/O: 342
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA |
Stock6,288 |
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Intel |
IC FPGA 331 I/O 484FBGA
- Number of LABs/CLBs: 2475
- Number of Logic Elements/Cells: 39600
- Total RAM Bits: 1161216
- Number of I/O: 331
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BGA |
Stock6,896 |
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Intel |
IC CPLD 560MC 20NS 240RQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 20.0ns
- Voltage Supply - Internal: 4.5 V ~ 5.5 V
- Number of Logic Elements/Blocks: 35
- Number of Macrocells: 560
- Number of Gates: 12000
- Number of I/O: 191
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 240-BFQFP Exposed Pad
- Supplier Device Package: 240-RQFP (32x32)
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Package: 240-BFQFP Exposed Pad |
Stock4,448 |
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Intel |
IC CPLD 440MC 9NS 144TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 9.0ns
- Voltage Supply - Internal: 1.71 V ~ 1.89 V
- Number of Logic Elements/Blocks: 570
- Number of Macrocells: 440
- Number of Gates: -
- Number of I/O: 114
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock6,048 |
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Intel |
IC FPGA 432 I/O 1517FBGA
- Number of LABs/CLBs: 225400
- Number of Logic Elements/Cells: 597000
- Total RAM Bits: 53248000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-FBGA (40x40)
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1517FBGA
- Number of LABs/CLBs: 128300
- Number of Logic Elements/Cells: 340000
- Total RAM Bits: 19456000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 296 I/O 2912BGA
- Number of LABs/CLBs: 350000
- Number of Logic Elements/Cells: 2800000
- Total RAM Bits: -
- Number of I/O: 296
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 51200000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 359250
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 53248000
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA STRATIX10SX 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 650K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 534 I/O 1152FBGA
- Number of LABs/CLBs: 150960
- Number of Logic Elements/Cells: 400000
- Total RAM Bits: 34322432
- Number of I/O: 534
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 432 I/O 1517FBGA
- Number of LABs/CLBs: 225400
- Number of Logic Elements/Cells: 597000
- Total RAM Bits: 53248000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-FBGA (40x40)
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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