Page 260 - Intel Products | Heisener Electronics

10AS048K2F35E1HG
Intel

IC SOC FPGA 396 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock7,424
5CSEBA4U23C7N
Intel

IC FPGA 188 I/O 672UBGA

Package: 672-FBGA

Stock6,416
HC1S30F780NAB
Intel

IC FPGA APEX 780FBGA

Package: 780-BBGA, FCBGA

Stock5,712
10M50DAF256C6GES
Intel

IC FPGA 178 I/O 256FBGA

Package: 256-LBGA

Stock6,960
5AGZME7H3F35I4N
Intel

IC FPGA 534 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock2,400
EP2AGZ300FH29C4N
Intel

IC FPGA 281 I/O 780HBGA

Package: 780-BBGA, FCBGA

Stock6,432
EP3SL70F780I3
Intel

IC FPGA 488 I/O 780FBGA

Package: 780-BBGA, FCBGA

Stock5,456
5AGXMA3D4F31I5N
Intel

IC FPGA 416 I/O 896FBGA

Package: 896-BBGA, FCBGA

Stock4,192
10AX022E4F29E3SG
Intel

780-PIN FBGA

Package: 780-BBGA, FCBGA

Stock3,504
5AGXBA1D6F27C6N
Intel

IC FPGA 336 I/O 672FBGA

Package: 672-BBGA, FCBGA

Stock6,784
5CGXFC5C6F23C6N
Intel

IC FPGA 240 I/O 484FBGA

Package: 484-BGA

Stock5,424
5CGXFC3B6U19A7N
Intel

IC FPGA 208 I/O 484UBGA

Package: 484-FBGA

Stock3,136
EP4CE40F29C7
Intel

IC FPGA 532 I/O 780FBGA

Package: 780-BGA

Stock2,608
EP3C16F484C7
Intel

IC FPGA 346 I/O 484FBGA

Package: 484-BGA

Stock4,032
EP4CE10F17I8L
Intel

IC FPGA 179 I/O 256FBGA

Package: 256-LBGA

Stock5,216
EPM9320ARC208-10N
Intel

IC CPLD 320MC 10NS 208RQFP

Package: 208-BFQFP Exposed Pad

Stock2,944
EPM3032ALC44-10
Intel

IC CPLD 32MC 10NS 44PLCC

Package: 44-LCC (J-Lead)

Stock3,696
EPM570ZM100C7N
Intel

IC CPLD 440MC 9NS 100MBGA

Package: 100-TFBGA

Stock16,572
5AGXBA5D4F27C4G
Intel

IC FPGA 336 I/O 672FBGA

Package: 672-BBGA, FCBGA

Stock5,888
AGIB022R31A1I1V
Intel

IC

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock
10AS048K2F35E1HG	Intel	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock7,424
5CSEBA4U23C7N	Intel	IC FPGA 188 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 40K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	Package: 672-FBGA	Stock6,416
HC1S30F780NAB	Intel	IC FPGA APEX 780FBGA Number of LABs/CLBs: 3247 Number of Logic Elements/Cells: 32470 Total RAM Bits: 2137536 Number of I/O: 597 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock5,712
10M50DAF256C6GES	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-LBGA	Stock6,960
5AGZME7H3F35I4N	Intel	IC FPGA 534 I/O 1152FBGA Number of LABs/CLBs: 21225 Number of Logic Elements/Cells: 450000 Total RAM Bits: 40249344 Number of I/O: 534 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock2,400
EP2AGZ300FH29C4N	Intel	IC FPGA 281 I/O 780HBGA Number of LABs/CLBs: 11920 Number of Logic Elements/Cells: 298000 Total RAM Bits: 18854912 Number of I/O: 281 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	Package: 780-BBGA, FCBGA	Stock6,432
EP3SL70F780I3	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 2700 Number of Logic Elements/Cells: 67500 Total RAM Bits: 2699264 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock5,456
5AGXMA3D4F31I5N	Intel	IC FPGA 416 I/O 896FBGA Number of LABs/CLBs: 7362 Number of Logic Elements/Cells: 156000 Total RAM Bits: 11746304 Number of I/O: 416 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	Package: 896-BBGA, FCBGA	Stock4,192
10AX022E4F29E3SG	Intel	780-PIN FBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 288 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock3,504
5AGXBA1D6F27C6N	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 3537 Number of Logic Elements/Cells: 75000 Total RAM Bits: 8666112 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BBGA, FCBGA	Stock6,784
5CGXFC5C6F23C6N	Intel	IC FPGA 240 I/O 484FBGA Number of LABs/CLBs: 29080 Number of Logic Elements/Cells: 77000 Total RAM Bits: 5001216 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BGA	Stock5,424
5CGXFC3B6U19A7N	Intel	IC FPGA 208 I/O 484UBGA Number of LABs/CLBs: 11900 Number of Logic Elements/Cells: 31500 Total RAM Bits: 1381376 Number of I/O: 208 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	Package: 484-FBGA	Stock3,136
EP4CE40F29C7	Intel	IC FPGA 532 I/O 780FBGA Number of LABs/CLBs: 2475 Number of Logic Elements/Cells: 39600 Total RAM Bits: 1161216 Number of I/O: 532 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BGA	Stock2,608
EP3C16F484C7	Intel	IC FPGA 346 I/O 484FBGA Number of LABs/CLBs: 963 Number of Logic Elements/Cells: 15408 Total RAM Bits: 516096 Number of I/O: 346 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BGA	Stock4,032
EP4CE10F17I8L	Intel	IC FPGA 179 I/O 256FBGA Number of LABs/CLBs: 645 Number of Logic Elements/Cells: 10320 Total RAM Bits: 423936 Number of I/O: 179 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-LBGA	Stock5,216
EPM9320ARC208-10N	Intel	IC CPLD 320MC 10NS 208RQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 20 Number of Macrocells: 320 Number of Gates: 6000 Number of I/O: 132 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	Package: 208-BFQFP Exposed Pad	Stock2,944
EPM3032ALC44-10	Intel	IC CPLD 32MC 10NS 44PLCC Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 600 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock3,696
EPM570ZM100C7N	Intel	IC CPLD 440MC 9NS 100MBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 9.0ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 570 Number of Macrocells: 440 Number of Gates: - Number of I/O: 76 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TFBGA Supplier Device Package: 100-MBGA (6x6)	Package: 100-TFBGA	Stock16,572
5AGXBA5D4F27C4G	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 8962 Number of Logic Elements/Cells: 190000 Total RAM Bits: 13284352 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BBGA, FCBGA	Stock5,888
AGIB022R31A1I1V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
1SG040HH3F35I2LG	Intel	IC FPGA STRATIX10GX 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 378000 Total RAM Bits: 31457280 Number of I/O: 374 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
5SGXMA9N2F45C3G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: -	Request a Quote
EP4SGX290NF45I4G	Intel	IC FPGA 920 I/O 1932FCBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
AGIB022R31B2I2V	Intel	IC FPGA AGILEX-I 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
EP4SGX290KF40I3G	Intel	IC FPGA 744 I/O 1517FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
FW82801CAM	Intel	MICRO PERIPHERAL IC PBGA421 Protocol: USB Function: Controller Interface: PCI Standards: USB 1.0 Voltage - Supply: - Current - Supply: - Operating Temperature: - Package / Case: 421-BBGA Supplier Device Package: 421-PBGA (31x31)	Package: -	Request a Quote
AGFC023R25A2E2V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
AGFA023R24C2I3E	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote