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10AS066H2F34E1HG
Intel

IC SOC FPGA 492 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock2,224
10AS027E2F27I2LG
Intel

672-PIN FBGA

Package: -

Stock6,048
10AS027E2F27I1HG
Intel

IC SOC FPGA 240 I/O 672FBGA

Package: 672-BBGA, FCBGA

Stock7,344
ER6230QI
Intel

3A HIGH EFFICIENCY SYNCHRONOUS D

Package: 24-VFQFN Exposed Pad

Stock22,860
EP20K400BC652-1
Intel

IC FPGA 502 I/O 652BGA

Package: 652-BGA

Stock7,232
EPF10K10AQC208-3
Intel

IC FPGA 134 I/O 208QFP

Package: 208-BFQFP

Stock4,688
5CGXFC7D6F27I7N
Intel

IC FPGA 336 I/O 672FBGA

Package: 672-BGA

Stock6,080
EP4SGX530HH35C2N
Intel

IC FPGA 564 I/O 1152HBGA

Package: 1152-BBGA, FCBGA

Stock6,384
5SGXEA7N2F45C2LN
Intel

IC FPGA 840 I/O 1932FBGA

Package: 1932-BBGA, FCBGA

Stock3,312
EP4SGX230HF35C3N
Intel

IC FPGA 564 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock6,064
EP2SGX60EF1152C3N
Intel

IC FPGA 534 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock2,832
EP2SGX60CF780C3N
Intel

IC FPGA 364 I/O 780FBGA

Package: 780-BBGA

Stock5,568
10AX022E4F29I3SG
Intel

780-PIN FBGA

Package: 780-BBGA, FCBGA

Stock6,928
10M50DAF256I7G
Intel

IC FPGA 178 I/O 256FBGA

Package: 256-LBGA

Stock14,844
EPM7064STC100-6F
Intel

IC CPLD 64MC 6NS 100TQFP

Package: 100-TQFP

Stock3,392
AGFB022R25A3I3E
Intel

IC FPGA AGILEX-F 2581FBGA

Package: -

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AGFC023R31C2I3E
Intel

IC FPGA AGILEX-F 3184FBGA

Package: -

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5SGXMA9N3F45I4G
Intel

IC FPGA 840 I/O 1932FBGA

Package: -

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1ST110EN3F43I3VG
Intel

IC FPGA 440 I/O 1760FBGA

Package: -

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5SGXEB5R3F43C3
Intel

IC FPGA 600 I/O 1760FBGA

Package: -

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Part Number	Manufacturer	Description	Package	Stock
10AS066H2F34E1HG	Intel	IC SOC FPGA 492 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock2,224
10AS027E2F27I2LG	Intel	672-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock6,048
10AS027E2F27I1HG	Intel	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BBGA, FCBGA	Stock7,344
ER6230QI	Intel	3A HIGH EFFICIENCY SYNCHRONOUS D Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Programmable Number of Outputs: 1 Voltage - Input (Min): 2.7V Voltage - Input (Max): 6.6V Voltage - Output (Min/Fixed): 0.75V Voltage - Output (Max): 6.33V Current - Output: 3A Frequency - Switching: 1.9MHz Synchronous Rectifier: Yes Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock22,860
EP20K400BC652-1	Intel	IC FPGA 502 I/O 652BGA Number of LABs/CLBs: 1664 Number of Logic Elements/Cells: 16640 Total RAM Bits: 212992 Number of I/O: 502 Number of Gates: 1052000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 652-BGA Supplier Device Package: 652-BGA (45x45)	Package: 652-BGA	Stock7,232
EPF10K10AQC208-3	Intel	IC FPGA 134 I/O 208QFP Number of LABs/CLBs: 72 Number of Logic Elements/Cells: 576 Total RAM Bits: 6144 Number of I/O: 134 Number of Gates: 31000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock4,688
5CGXFC7D6F27I7N	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 56480 Number of Logic Elements/Cells: 149500 Total RAM Bits: 7880704 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BGA	Stock6,080
EP4SGX530HH35C2N	Intel	IC FPGA 564 I/O 1152HBGA Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Total RAM Bits: 28033024 Number of I/O: 564 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA, FC (42.5x42.5)	Package: 1152-BBGA, FCBGA	Stock6,384
5SGXEA7N2F45C2LN	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: 1932-BBGA, FCBGA	Stock3,312
EP4SGX230HF35C3N	Intel	IC FPGA 564 I/O 1152FBGA Number of LABs/CLBs: 9120 Number of Logic Elements/Cells: 228000 Total RAM Bits: 17544192 Number of I/O: 564 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock6,064
EP2SGX60EF1152C3N	Intel	IC FPGA 534 I/O 1152FBGA Number of LABs/CLBs: 3022 Number of Logic Elements/Cells: 60440 Total RAM Bits: 2544192 Number of I/O: 534 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock2,832
EP2SGX60CF780C3N	Intel	IC FPGA 364 I/O 780FBGA Number of LABs/CLBs: 3022 Number of Logic Elements/Cells: 60440 Total RAM Bits: 2544192 Number of I/O: 364 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA	Stock5,568
10AX022E4F29I3SG	Intel	780-PIN FBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 288 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock6,928
10M50DAF256I7G	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-LBGA	Stock14,844
EPM7064STC100-6F	Intel	IC CPLD 64MC 6NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-TQFP	Stock3,392
AGFB022R25A3I3E	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
AGFC023R31C2I3E	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
5SGXMA9N3F45I4G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: -	Request a Quote
1ST110EN3F43I3VG	Intel	IC FPGA 440 I/O 1760FBGA Number of LABs/CLBs: 137500 Number of Logic Elements/Cells: 1100000 Total RAM Bits: - Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote
5SGXEB5R3F43C3	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: -	Request a Quote
5SGXMA4H2F35I2WN	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
5SGXEB5R1F43C2G	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: -	Request a Quote
5ASTFD5K3F40I5G	Intel	IC SOC CORTEX-A9 800MHZ 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA, FC (40x40)	Package: -	Request a Quote
5SGXEBBR1H43C2LG	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	Package: -	Request a Quote
5ASTFD3G3F35I5G	Intel	IC SOC CORTEX-A9 800MHZ 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35x35)	Package: -	Request a Quote
FW82801FAC	Intel	82801 - I/O CONTROLLER HUB Controller Type: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
RG82865GV	Intel	GRAPHICS AND MEMORY CONTROLLER H Applications: - Core Processor: - Program Memory Type: - Controller Series: - RAM Size: - Interface: - Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
5SGXMB6R1F43I2G	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: -	Request a Quote