Page 56 - Intel Products | Heisener Electronics

5CSEBA6U19C6N
Intel

IC FPGA 66 I/O 484UBGA

Package: 484-FBGA

Stock4,016
EP20K100FC324-1X
Intel

IC FPGA 252 I/O 324FBGA

Package: 324-BGA

Stock6,528
EPF6016ATC100-3
Intel

IC FPGA 81 I/O 100TQFP

Package: 100-TQFP

Stock6,228
10AX048K2F35E2LG
Intel

1152-PIN FBGA

Package: 1152-BBGA, FCBGA

Stock5,008
EP3SE80F1152I4LN
Intel

IC FPGA 744 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock3,504
5SGXEB6R2F40C2N
Intel

IC FPGA 432 I/O 1517FBGA

Package: 1517-BBGA, FCBGA

Stock5,184
EP2AGX125DF25C4N
Intel

IC FPGA 260 I/O 572FBGA

Package: 572-BGA, FCBGA

Stock5,936
5AGXFA7H4F35C5N
Intel

IC FPGA 544 I/O 1152FBGA

Package: 1152-BBGA, FCBGA Exposed Pad

Stock8,700
10CX220YF780E5G
Intel

780-PIN FBGA

Package: 780-BBGA, FCBGA

Stock5,856
5CGTFD5C5F27I7N
Intel

IC FPGA 336 I/O 672FBGA

Package: 672-BGA

Stock4,912
EPM240T100I5
Intel

IC CPLD 192MC 4.7NS 100TQFP

Package: 100-TQFP

Stock5,056
EP4SGX110FF35I3G
Intel

IC FPGA 372 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock2,288
GWIXP460BADT
Intel

IC MPU INTEL 533MHZ PBGA544

Package: -

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5SGSMD3H3F35I3LG
Intel

IC FPGA 432 I/O 1152FBGA

Package: -

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FWIXP420BC
Intel

IC MPU 400MHZ 492BGA

Package: -

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5SGXMA3E3H29C2LG
Intel

IC FPGA 600 I/O 780HBGA

Package: -

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N82077SL
Intel

FLOPPY DISK DRIVE, 0.125MBPS

Package: -

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LF80538GF0282M
Intel

IC MPU T1300 1.66GHZ 478PPGA

Package: -

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1SG280HN1F43E2LGS3
Intel

IC FPGA 688 I/O 1760FBGA

Package: -

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5ASXBB3D6F35C6G
Intel

IC SOC CORTEX-A9 700MHZ 1152FBGA

Package: -

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Part Number	Manufacturer	Description	Package	Stock
5CSEBA6U19C6N	Intel	IC FPGA 66 I/O 484UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	Package: 484-FBGA	Stock4,016
EP20K100FC324-1X	Intel	IC FPGA 252 I/O 324FBGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 252 Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-BGA Supplier Device Package: 324-FBGA (19x19)	Package: 324-BGA	Stock6,528
EPF6016ATC100-3	Intel	IC FPGA 81 I/O 100TQFP Number of LABs/CLBs: 132 Number of Logic Elements/Cells: 1320 Total RAM Bits: - Number of I/O: 81 Number of Gates: 16000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-TQFP	Stock6,228
10AX048K2F35E2LG	Intel	1152-PIN FBGA Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Total RAM Bits: 5664768 Number of I/O: 396 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock5,008
EP3SE80F1152I4LN	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: 3200 Number of Logic Elements/Cells: 80000 Total RAM Bits: 6843392 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock3,504
5SGXEB6R2F40C2N	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock5,184
EP2AGX125DF25C4N	Intel	IC FPGA 260 I/O 572FBGA Number of LABs/CLBs: 4964 Number of Logic Elements/Cells: 118143 Total RAM Bits: 8315904 Number of I/O: 260 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25x25)	Package: 572-BGA, FCBGA	Stock5,936
5AGXFA7H4F35C5N	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Total RAM Bits: 15470592 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA Exposed Pad	Stock8,700
10CX220YF780E5G	Intel	780-PIN FBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 284 Number of Gates: - Voltage - Supply: 0.9V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock5,856
5CGTFD5C5F27I7N	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 29080 Number of Logic Elements/Cells: 77000 Total RAM Bits: 5001216 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BGA	Stock4,912
EPM240T100I5	Intel	IC CPLD 192MC 4.7NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 4.7ns Voltage Supply - Internal: 2.5V, 3.3V Number of Logic Elements/Blocks: 240 Number of Macrocells: 192 Number of Gates: - Number of I/O: 80 Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-TQFP	Stock5,056
EP4SGX110FF35I3G	Intel	IC FPGA 372 I/O 1152FBGA Number of LABs/CLBs: 4224 Number of Logic Elements/Cells: 105600 Total RAM Bits: 9793536 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock2,288
GWIXP460BADT	Intel	IC MPU INTEL 533MHZ PBGA544 Core Processor: Intel® IXP45X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: Mll (3), SMII (3) SATA: - USB: USB 1.1 (1), USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: 3DES, AES, DES, MD5, RNG, SHA1 Package / Case: 544-BBGA Supplier Device Package: 544-PBGA (35x35)	Package: -	Request a Quote
5SGSMD3H3F35I3LG	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
FWIXP420BC	Intel	IC MPU 400MHZ 492BGA Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100Mbps (2) SATA: - USB: USB 1.1 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35x35)	Package: -	Request a Quote
5SGXMA3E3H29C2LG	Intel	IC FPGA 600 I/O 780HBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	Package: -	Request a Quote
N82077SL	Intel	FLOPPY DISK DRIVE, 0.125MBPS Protocol: - Function: Controller Interface: - Standards: - Voltage - Supply: 4.5V ~ 5.5V Current - Supply: 50mA Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC	Package: -	Request a Quote
LF80538GF0282M	Intel	IC MPU T1300 1.66GHZ 478PPGA Core Processor: Intel® Core™ Solo Processor T1300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.66GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.1625V, 1.3V Operating Temperature: 0°C ~ 100°C (TJ) Security Features: - Package / Case: 478-PGA Supplier Device Package: 478-PPGA (35x35)	Package: -	Request a Quote
1SG280HN1F43E2LGS3	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote
5ASXBB3D6F35C6G	Intel	IC SOC CORTEX-A9 700MHZ 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35x35)	Package: -	Request a Quote
1SG280HU1F50I2LG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote
5SGXMA7N1F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: -	Request a Quote
1SG250HU2F50E2LG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote
5SGXMA3K2F35C2G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
RJ80530KZ001512	Intel	IC MPU 2 1GHZ PBGA479 Core Processor: Intel® Pentium® III Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.15V Operating Temperature: 100°C (TC) Security Features: - Package / Case: 479-BGA Supplier Device Package: 479-PBGA (35x35)	Package: -	Request a Quote
AGFB023R31C3E3E	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
AGFC023R25A2E3V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
1SX110HN3F43E2VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 1100K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote