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Intel |
IC SOC FPGA 360 I/O 780FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 480K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock3,632 |
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Intel |
IC SOC FPGA 360 I/O 780FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 480K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock5,056 |
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Intel |
1760-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,264 |
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Intel |
IC FPGA 170 I/O 896FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 700MHz
- Primary Attributes: FPGA - 350K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BBGA, FCBGA |
Stock4,800 |
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Intel |
IC FPGA 93 I/O 144FBGA
- Number of LABs/CLBs: 2560
- Number of Logic Elements/Cells: 2560
- Total RAM Bits: 32768
- Number of I/O: 93
- Number of Gates: 162000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-BGA
- Supplier Device Package: 144-FBGA (13x13)
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Package: 144-BGA |
Stock4,256 |
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Intel |
IC FPGA 78 I/O 100TQFP
- Number of LABs/CLBs: 26
- Number of Logic Elements/Cells: 208
- Total RAM Bits: -
- Number of I/O: 78
- Number of Gates: 2500
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
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Package: 100-TQFP |
Stock4,416 |
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Intel |
IC FPGA 189 I/O 240QFP
- Number of LABs/CLBs: 360
- Number of Logic Elements/Cells: 2880
- Total RAM Bits: 20480
- Number of I/O: 189
- Number of Gates: 116000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 240-BQFP
- Supplier Device Package: 240-PQFP (32x32)
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Package: 240-BQFP |
Stock2,208 |
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Intel |
IC FPGA 744 I/O 1152HBGA
- Number of LABs/CLBs: 13500
- Number of Logic Elements/Cells: 337500
- Total RAM Bits: 18822144
- Number of I/O: 744
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-HBGA (40x40)
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Package: 1152-BBGA, FCBGA |
Stock5,872 |
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Intel |
IC FPGA 480 I/O 1932FCBGA
- Number of LABs/CLBs: 427200
- Number of Logic Elements/Cells: 1150000
- Total RAM Bits: 68857856
- Number of I/O: 480
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.98 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: 1932-BBGA, FCBGA |
Stock2,032 |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 172600
- Number of Logic Elements/Cells: 457000
- Total RAM Bits: 46769152
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock4,352 |
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Intel |
IC FPGA 432 I/O 1517FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 48927744
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock2,592 |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 135840
- Number of Logic Elements/Cells: 360000
- Total RAM Bits: 23946240
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock2,080 |
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Intel |
IC FPGA 544 I/O 1152FBGA
- Number of LABs/CLBs: 23780
- Number of Logic Elements/Cells: 504000
- Total RAM Bits: 27695104
- Number of I/O: 544
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA Exposed Pad
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA Exposed Pad |
Stock5,696 |
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Intel |
672-PIN FBGA
- Number of LABs/CLBs: 80330
- Number of Logic Elements/Cells: 220000
- Total RAM Bits: 13752320
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA, FC (27x27)
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Package: 672-BBGA, FCBGA |
Stock3,376 |
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Intel |
IC FPGA 426 I/O 780FBGA
- Number of LABs/CLBs: 4713
- Number of Logic Elements/Cells: 75408
- Total RAM Bits: 2810880
- Number of I/O: 426
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BGA |
Stock5,376 |
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Intel |
IC CPLD 128MC 4NS 169FBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 4.0ns
- Voltage Supply - Internal: 2.375 V ~ 2.625 V
- Number of Logic Elements/Blocks: 8
- Number of Macrocells: 128
- Number of Gates: 2500
- Number of I/O: 100
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,096 |
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Intel |
IC CPLD 64MC 15NS 100QFP
- Programmable Type: EE PLD
- Delay Time tpd(1) Max: 15.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 64
- Number of Gates: 1250
- Number of I/O: 68
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-BQFP
- Supplier Device Package: 100-PQFP (20x14)
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Package: 100-BQFP |
Stock2,448 |
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Intel |
IC CPLD 128MC 10NS 100TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 8
- Number of Macrocells: 128
- Number of Gates: 2500
- Number of I/O: 80
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
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Package: 100-TQFP |
Stock9,084 |
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Intel |
IC CPLD 440MC 5.4NS 256FBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 5.4ns
- Voltage Supply - Internal: 2.5V, 3.3V
- Number of Logic Elements/Blocks: 570
- Number of Macrocells: 440
- Number of Gates: -
- Number of I/O: 160
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-BGA |
Stock6,208 |
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Intel |
IC FPGA 544 I/O 1152FBGA
- Number of LABs/CLBs: 14151
- Number of Logic Elements/Cells: 300000
- Total RAM Bits: 17358848
- Number of I/O: 544
- Number of Gates: -
- Voltage - Supply: 1.07V ~ 1.13V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock4,032 |
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Intel |
IC FPGA 372 I/O 780FBGA
- Number of LABs/CLBs: 2904
- Number of Logic Elements/Cells: 72600
- Total RAM Bits: 7564880
- Number of I/O: 372
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock5,872 |
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Intel |
IC FPGA AGILEX-I 3948FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 3.54M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3948-BFBGA Exposed Pad
- Supplier Device Package: 3948-BGA (56x56)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 360 I/O 780HBGA
- Number of LABs/CLBs: 135840
- Number of Logic Elements/Cells: 360000
- Total RAM Bits: 19456000
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-HBGA (33x33)
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Package: - |
Request a Quote |
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Intel |
IC SOC CORTEX-A9 800MHZ 896FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 350K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: - |
Request a Quote |
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Intel |
IC MATH COPROCESSOR 68CQFP
- Type: Math Coprocessor
- Applications: -
- Mounting Type: Surface Mount
- Package / Case: 68-CFlatpack
- Supplier Device Package: 68-CQFP (24.08x24.08)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1760FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 41984000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 688 I/O 1760FBGA
- Number of LABs/CLBs: 106250
- Number of Logic Elements/Cells: 850000
- Total RAM Bits: -
- Number of I/O: 688
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 46080000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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