Page 13 - Microchip Technology Products - Interface - Telecom

PM5397-FGI
Microchip Technology

ARROW 2XGE PB FREE

Package: 896-BGA

Stock6,240
PM5397-FEI
Microchip Technology

ARROW 2XGE PB FREE

Package: 896-BGA

Stock5,952
PM8320-PI
Microchip Technology

TEMUX-84 WITH E3 MAPPERS, DS3/E3

Package: 324-FBGA

Stock3,280
PM8320-PGI
Microchip Technology

TEMUX-84 WITH E3 MAPPERS, DS3/E3

Package: 324-FBGA

Stock2,576
ZL50111GAG2
Microchip Technology

IC CESOP PROC 1024CH 552BGA

Package: 552-BGA

Stock5,184
PM8324-FXI
Microchip Technology

TEMAP 84FDL, LF BUMP

Package: -

Stock2,816
PM8321-PI
Microchip Technology

HIGH DENSITY FRAMER/MAPPER FOR 8

Package: -

Stock4,144
PM5333-FEI
Microchip Technology

ARROW 8XFE PB FREE

Package: -

Stock3,920
PM5333-FGI
Microchip Technology

8 CHANNEL FAST ETHERNET OVER SON

Package: -

Stock3,104
PM4390-FEI
Microchip Technology

ARROW M8XFE

Package: -

Stock6,576
ZL50112GAG2
Microchip Technology

IC CESOP PROCESSOR 552BGA

Package: 552-BGA

Stock3,504
PM4390B-FGI
Microchip Technology

8 CHANNEL 10/100 OR 1XGE ETHERNE

Package: -

Stock5,968
PM8324-FEI
Microchip Technology

TEMAP 84FDL GREEN DUAL PASSIVATI

Package: -

Stock3,696
PM8321-PGI
Microchip Technology

HIGH DENSITY FRAMER/MAPPER FOR 8

Package: -

Stock5,184
PM5334A-FEI
Microchip Technology

SINGLE-CHIP SONET/SDH TRANSPORT

Package: -

Stock4,944
PM7382-PI
Microchip Technology

TELECOM INTERFACE ICS 32 LINK

Package: -

Stock3,152
ZL50110GAG2
Microchip Technology

IC CESOP PROC 256CH 552BGA

Package: 552-BGA

Stock5,520
MT90869AG2
Microchip Technology

IC DGTL SWITCH F16KDX 272BGA

Package: 272-BGA

Stock4,416
PM4332-PGI
Microchip Technology

32 CHANNEL T1/E1 FRAMER

Package: -

Stock6,816
PM7382-PGI
Microchip Technology

32 LINK, 256 HDLC CHANNEL FRAME

Package: -

Stock3,904

Part Number	Manufacturer	Description	Package	Stock	Interface	Number of Circuits	Voltage - Supply	Current - Supply	Power (Watts)	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
PM5397-FGI	Microchip Technology	ARROW 2XGE PB FREE Function: Ethernet, SONET/SDH Interface: GMII, SerDes Number of Circuits: 2 Voltage - Supply: 1.8V Current - Supply: - Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 896-BGA Supplier Device Package: 896-FCBGA	Package: 896-BGA	Stock6,240	GMII, SerDes	2	1.8V	-	-	-40°C ~ 85°C	Surface Mount	896-BGA	896-FCBGA
PM5397-FEI	Microchip Technology	ARROW 2XGE PB FREE Function: Ethernet, SONET/SDH Interface: GMII, SerDes Number of Circuits: 2 Voltage - Supply: 1.8V Current - Supply: - Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 896-BGA Supplier Device Package: 896-FCBGA	Package: 896-BGA	Stock5,952	GMII, SerDes	2	1.8V	-	-	-40°C ~ 85°C	Surface Mount	896-BGA	896-FCBGA
PM8320-PI	Microchip Technology	TEMUX-84 WITH E3 MAPPERS, DS3/E3 Function: Framer Interface: E1, J1, T1 Number of Circuits: - Voltage - Supply: 1.8V, 3.3V Current - Supply: - Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-PBGA (23x23)	Package: 324-FBGA	Stock3,280	E1, J1, T1	-	1.8V, 3.3V	-	-	-40°C ~ 85°C	Surface Mount	324-FBGA	324-PBGA (23x23)
PM8320-PGI	Microchip Technology	TEMUX-84 WITH E3 MAPPERS, DS3/E3 Function: Framer Interface: E1, J1, T1 Number of Circuits: - Voltage - Supply: 1.8V, 3.3V Current - Supply: - Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-PBGA (23x23)	Package: 324-FBGA	Stock2,576	E1, J1, T1	-	1.8V, 3.3V	-	-	-40°C ~ 85°C	Surface Mount	324-FBGA	324-PBGA (23x23)
ZL50111GAG2	Microchip Technology	IC CESOP PROC 1024CH 552BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-PBGA (35x35)	Package: 552-BGA	Stock5,184	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	552-BGA	552-PBGA (35x35)
PM8324-FXI	Microchip Technology	TEMAP 84FDL, LF BUMP Function: Framer Interface: E1, T1 Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,816	E1, T1	-	-	-	-	-	-	-	-
PM8321-PI	Microchip Technology	HIGH DENSITY FRAMER/MAPPER FOR 8 Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock4,144	-	-	-	-	-	-	-	-	-
PM5333-FEI	Microchip Technology	ARROW 8XFE PB FREE Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,920	-	-	-	-	-	-	-	-	-
PM5333-FGI	Microchip Technology	8 CHANNEL FAST ETHERNET OVER SON Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,104	-	-	-	-	-	-	-	-	-
PM4390-FEI	Microchip Technology	ARROW M8XFE Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,576	-	-	-	-	-	-	-	-	-
ZL50112GAG2	Microchip Technology	IC CESOP PROCESSOR 552BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-PBGA (35x35)	Package: 552-BGA	Stock3,504	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	552-BGA	552-PBGA (35x35)
PM4390B-FGI	Microchip Technology	8 CHANNEL 10/100 OR 1XGE ETHERNE Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,968	-	-	-	-	-	-	-	-	-
PM8324-FEI	Microchip Technology	TEMAP 84FDL GREEN DUAL PASSIVATI Function: Framer Interface: E1, T1 Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,696	E1, T1	-	-	-	-	-	-	-	-
PM8321-PGI	Microchip Technology	HIGH DENSITY FRAMER/MAPPER FOR 8 Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,184	-	-	-	-	-	-	-	-	-
PM5334A-FEI	Microchip Technology	SINGLE-CHIP SONET/SDH TRANSPORT Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock4,944	-	-	-	-	-	-	-	-	-
PM7382-PI	Microchip Technology	TELECOM INTERFACE ICS 32 LINK Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,152	-	-	-	-	-	-	-	-	-
ZL50110GAG2	Microchip Technology	IC CESOP PROC 256CH 552BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-PBGA (35x35)	Package: 552-BGA	Stock5,520	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	552-BGA	552-PBGA (35x35)
MT90869AG2	Microchip Technology	IC DGTL SWITCH F16KDX 272BGA Function: Switch Interface: - Number of Circuits: 1 Voltage - Supply: 3V ~ 3.6V Current - Supply: 160mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 272-BGA Supplier Device Package: 272-PBGA (27x27)	Package: 272-BGA	Stock4,416	-	1	3V ~ 3.6V	160mA	-	-40°C ~ 85°C	Surface Mount	272-BGA	272-PBGA (27x27)
PM4332-PGI	Microchip Technology	32 CHANNEL T1/E1 FRAMER Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,816	-	-	-	-	-	-	-	-	-
PM7382-PGI	Microchip Technology	32 LINK, 256 HDLC CHANNEL FRAME Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,904	-	-	-	-	-	-	-	-	-
ZL50117GAG2	Microchip Technology	IC CESOP PROCESSOR 128CH 324BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-BGA Supplier Device Package: 324-PBGA (23x23)	Package: 324-BGA	Stock5,760	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	324-BGA	324-PBGA (23x23)
PM8312-PI	Microchip Technology	32CHANNEL T1/E1 FRAMER DEVICE WI Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,040	-	-	-	-	-	-	-	-	-
PM8312-PGI	Microchip Technology	32CHANNEL T1/E1 FRAMER DEVICE WI Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,224	-	-	-	-	-	-	-	-	-
ZL50114GAG2	Microchip Technology	IC CESOP PROCESSOR 128CH 552BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-PBGA (35x35)	Package: 552-BGA	Stock5,296	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	552-BGA	552-PBGA (35x35)
ZL50116GAG2	Microchip Technology	IC CESOP PROCESSOR 64CH 324BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-BGA Supplier Device Package: 324-PBGA (23x23)	Package: 324-BGA	Stock2,192	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	324-BGA	324-PBGA (23x23)
ZL50232GDG2	Microchip Technology	IC VOICE ECHO CANCELLER 208LBGA Function: Echo Cancellation Interface: - Number of Circuits: 1 Voltage - Supply: 1.6V ~ 2V Current - Supply: 10mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 208-LBGA Supplier Device Package: 208-LBGA (17x17)	Package: 208-LBGA	Stock2,272	-	1	1.6V ~ 2V	10mA	-	-40°C ~ 85°C	Surface Mount	208-LBGA	208-LBGA (17x17)
ZL50118GAG2	Microchip Technology	IC CESOP PROCESSOR 32CH 324BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-BGA Supplier Device Package: 324-PBGA (23x23)	Package: 324-BGA	Stock5,200	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	324-BGA	324-PBGA (23x23)
ZL50064QCG1	Microchip Technology	IC DIGITAL SWITCH 16K CH 256LQFP Function: Switch Interface: - Number of Circuits: 1 Voltage - Supply: 1.71V ~ 1.89V Current - Supply: 240mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28x28)	Package: 256-LQFP	Stock7,536	-	1	1.71V ~ 1.89V	240mA	-	-40°C ~ 85°C	Surface Mount	256-LQFP	256-LQFP (28x28)