Microchip Technology Products

OSC MEMS CONFIGURABLE OUTPUT

• Type: MEMS (Silicon)
• Frequency - Output 1: -
• Frequency - Output 2: -
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): -
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height: 0.035" (0.90mm)
• Package / Case: 20-VFQFN Exposed Pad

OSC MEMS 100.000MHZ PCIE SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Enable/Disable
• Output: HCSL
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 60mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 14-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

IC EEPROM 16KBIT 400KHZ 8TSSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 16Kb (2K x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP

IC OTP 1MBIT 150NS 40VSOP

• Memory Type: Non-Volatile
• Memory Format: EPROM
• Technology: EPROM - OTP
• Memory Size: 1Mb (64K x 16)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: 150ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 40-TFSOP (0.488", 12.40mm Width)
• Supplier Device Package: 40-VSOP

IC EEPROM 2KBIT 400KHZ 8DIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 2Kb (256 x 8)
• Memory Interface: I2C
• Clock Frequency: 100kHz
• Write Cycle Time - Word, Page: 1.5ms
• Access Time: 3500ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

IC EEPROM 4KBIT 3MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (512 x 8)
• Memory Interface: SPI
• Clock Frequency: 3MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC EEPROM 2KBIT 1MHZ 8TSSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 2Kb (256 x 8)
• Memory Interface: I2C
• Clock Frequency: 1MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 550ns
• Voltage - Supply: 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP

IC TXRX CAN FD 8MBPS 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC ETHERNET SWITCH 7PORT 128TQFP

• Protocol: Ethernet
• Function: Switch
• Interface: I2C, SPI
• Standards: 10/100 Base-T PHY
• Voltage - Supply: 1.8V, 2.5V, 3.3V
• Current - Supply: -
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 128-TQFP Exposed Pad
• Supplier Device Package: 128-TQFP-EP (14x14)

IC DSC 16BIT 128KB FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

IC MCU 8BIT 1.5KB OTP 8DFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 5
• Program Memory Size: 1.5KB (1K x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 41 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN-EP (3x3)

IC MCU 8BIT 4KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 4KB (2K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

IC MCU 16BIT 128KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

IC MCU 8BIT 32KB FLASH 64TQFP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: SPI, UART/USART, USI
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (14x14)

IC MCU 16BIT 16KB FLASH 28QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 16 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

IC FPGA 114 I/O 144LQFP

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 256
• Total RAM Bits: 2048
• Number of I/O: 114
• Number of Gates: 10000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TC)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

IC SYNTHSZR 106.25/212.5MHZ 24QF

• Type: Clock/Frequency Synthesizer
• PLL: Yes with Bypass
• Input: LVCMOS, Crystal
• Output: LVDS
• Number of Circuits: 1
• Ratio - Input:Output: 2:2
• Differential - Input:Output: No/Yes
• Frequency - Max: 212.5MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-QFN (4x4)

IC CLK BUFFER 1:2 3GHZ 8SOIC

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:2
• Differential - Input:Output: Yes/Yes
• Input: ECL, LVECL, LVPECL. PECL
• Output: ECL, LVECL, LVPECL. PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC RF TXRX ISM>1GHZ 32-VFQFN

• Type: TxRx Only
• RF Family/Standard: General ISM > 1GHZ
• Protocol: -
• Modulation: GFSK
• Frequency: 2.4GHz
• Data Rate (Max): 1.125 Mbps
• Power - Output: 4dBm
• Sensitivity: -93dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: -
• Voltage - Supply: 2.9 V ~ 3.6 V
• Current - Receiving: 31mA
• Current - Transmitting: 16mA
• Operating Temperature: -10°C ~ 60°C
• Package / Case: 32-VFQFN Exposed Pad

IC USB HUB CNTRL I2C/SPI 100VQFN

• Protocol: USB
• Function: Hub Controller
• Interface: I²C, SPI
• Standards: USB 3.1
• Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-VFQFN Exposed Pad
• Supplier Device Package: 100-VQFN (12x12)

IC INTERFACE CONTROLLER

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

SIC 4N-CH 1200V/700V 472A

• FET Type: Silicon Carbide (SiC)
• FET Feature: -
• Drain to Source Voltage (Vdss): 1200V (1.2kV), 700V
• Current - Continuous Drain (Id) @ 25°C: 472A (Tc), 442A (Tc)
• Rds On (Max) @ Id, Vgs: 5.2mOhm @ 240A, 20V, 4.8mOhm @ 160A, 20V
• Vgs(th) (Max) @ Id: 2.8V @ 18mA, 2.4V @ 16mA
• Gate Charge (Qg) (Max) @ Vgs: 1392nC @ 20V, 860nC @ 20V
• Input Capacitance (Ciss) (Max) @ Vds: 18100pF @ 1000V, 18000pF @ 700V
• Power - Max: 1.846kW (Tc), 1.161kW (Tc)
• Operating Temperature: -40°C ~ 175°C (TJ)
• Mounting Type: Chassis Mount
• Package / Case: Module
• Supplier Device Package: -

IC CLK BUFFER 1:2 250MHZ 16VQFN

• Type: Clock Buffer
• Number of Circuits: 1
• Ratio - Input:Output: 1:2
• Differential - Input:Output: Yes/Yes
• Input: HCSL
• Output: HCSL
• Frequency - Max: 250 MHz
• Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-VQFN (3x3)

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 15 V
• Tolerance: ±5%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 9 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 12 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: A, SQ-MELF

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 11 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 80 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 8.2 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 500 nA @ 6.3 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 300 V
• Tolerance: ±10%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 950 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 210 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: B, Axial
• Supplier Device Package: B, Axial

DIODE SCHOTTKY 45V 3A TO39

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 45 V
• Current - Average Rectified (Io): 3A
• Voltage - Forward (Vf) (Max) @ If: 680 mV @ 4 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 20 mA @ 45 V
• Capacitance @ Vr, F: 450pF @ 5V, 1MHz
• Mounting Type: Through Hole
• Package / Case: TO-205AD, TO-39-3 Metal Can
• Supplier Device Package: TO-39 (TO-205AD)
• Operating Temperature - Junction: -65°C ~ 175°C