|
|
|
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 16
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock7,038 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 16
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock7,776 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 16
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100µin (2.54µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock5,400 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 16
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 2µin (0.05µm)
- Contact Finish - Post: Gold
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock6,336 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 14
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 2µin (0.05µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock2,952 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 14
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock5,436 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 14
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock4,068 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 14
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100µin (2.54µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock2,304 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 14
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 2µin (0.05µm)
- Contact Finish - Post: Gold
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock3,834 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 12
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 2µin (0.05µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock7,542 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 12
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock7,686 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 12
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock5,382 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, S
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 12
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100µin (2.54µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock4,392 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 8
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 2µin (0.05µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock6,192 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 8
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock2,430 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 8
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock3,996 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 8
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100µin (2.54µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock2,178 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 8
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 2µin (0.05µm)
- Contact Finish - Post: Gold
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock6,300 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 6
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 2µin (0.05µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock5,652 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 6
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock6,660 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 6
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock3,544 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 6
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100µin (2.54µm)
- Contact Finish - Post: Tin
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock3,400 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
- Connector Type: Header, Breakaway
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board
- Shrouding: Unshrouded
- Number of Positions: 6
- Number of Positions Loaded: All
- Number of Rows: 2
- Row Spacing - Mating: 0.050" (1.27mm)
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: 0.120" (3.05mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.099" (2.51mm)
- Contact Shape: Square
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 2µin (0.05µm)
- Contact Finish - Post: Gold
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
- Features: Pick and Place
- Operating Temperature: -55°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: -
- Insulation Color: Black
|
Package: - |
Stock6,354 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
|
|
|
Molex, LLC |
HEADER PCB
- Connector Type: Header
- Contact Type: Male Blade
- Pitch - Mating: 0.050" (1.27mm)
- Style: Board to Board or Cable
- Shrouding: Shrouded - 2 Wall
- Number of Positions: 8
- Number of Positions Loaded: All
- Number of Rows: 1
- Row Spacing - Mating: -
- Mounting Type: Surface Mount
- Termination: Solder
- Fastening Type: Latch Lock
- Contact Length - Mating: 0.083" (2.10mm)
- Contact Length - Post: -
- Overall Contact Length: -
- Insulation Height: 0.333" (8.45mm)
- Contact Shape: Rectangular
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 118.1µin (3.00µm)
- Contact Finish - Post: Tin
- Contact Material: Brass
- Insulation Material: Polyphthalamide (PPA), Glass Filled
- Features: -
- Operating Temperature: -40°C ~ 105°C
- Ingress Protection: -
- Material Flammability Rating: UL94 HB
- Insulation Color: Black
|
Package: - |
Stock7,092 |
|
Male Blade | 0.050" (1.27mm) | Board to Board or Cable | Shrouded - 2 Wall | 8 | All | 1 | - | Surface Mount | Solder | Latch Lock | 0.083" (2.10mm) | - | - | 0.333" (8.45mm) | Rectangular | Tin | 118.1µin (3.00µm) | Tin | Brass | Polyphthalamide (PPA), Glass Filled | - | -40°C ~ 105°C | - | UL94 HB | Black |
|
|
|
Molex, LLC |
HS DOCK FIXED CONN 8.74CL 108CKT
- Connector Type: Header
- Contact Type: Male Blade; Male Pin
- Pitch - Mating: -
- Style: Board to Board
- Shrouding: Shrouded - 4 Wall
- Number of Positions: 108
- Number of Positions Loaded: All
- Number of Rows: 3
- Row Spacing - Mating: -
- Mounting Type: Through Hole, Right Angle
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: -
- Contact Length - Post: 0.112" (2.84mm)
- Overall Contact Length: -
- Insulation Height: -
- Contact Shape: Rectangular, Square
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Finish - Post: -
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP)
- Features: -
- Operating Temperature: -20°C ~ 85°C
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Insulation Color: -
|
Package: - |
Stock3,580 |
|
Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 108 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |
|
|
|
Molex, LLC |
HS DOCK FIXED ASSY 72CKT NO EARS
- Connector Type: Header
- Contact Type: Male Blade; Male Pin
- Pitch - Mating: -
- Style: Board to Board
- Shrouding: Shrouded - 4 Wall
- Number of Positions: 72
- Number of Positions Loaded: All
- Number of Rows: 3
- Row Spacing - Mating: -
- Mounting Type: Through Hole, Right Angle
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: -
- Contact Length - Post: 0.112" (2.84mm)
- Overall Contact Length: -
- Insulation Height: -
- Contact Shape: Rectangular, Square
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Finish - Post: -
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP)
- Features: -
- Operating Temperature: -20°C ~ 85°C
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Insulation Color: -
|
Package: - |
Stock6,210 |
|
Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 72 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |
|
|
|
Molex, LLC |
HS DOCK FIXED CONN 144CKT 4.74CL
- Connector Type: Header
- Contact Type: Male Blade; Male Pin
- Pitch - Mating: -
- Style: Board to Board
- Shrouding: Shrouded - 4 Wall
- Number of Positions: 144
- Number of Positions Loaded: All
- Number of Rows: 3
- Row Spacing - Mating: -
- Mounting Type: Through Hole, Right Angle
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: -
- Contact Length - Post: 0.112" (2.84mm)
- Overall Contact Length: -
- Insulation Height: -
- Contact Shape: Rectangular, Square
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Finish - Post: -
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP)
- Features: -
- Operating Temperature: -20°C ~ 85°C
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Insulation Color: -
|
Package: - |
Stock6,192 |
|
Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 144 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |
|
|
|
Molex, LLC |
HS DOCK FIXED CONN 4.74CL 108CKT
- Connector Type: Header
- Contact Type: Male Blade; Male Pin
- Pitch - Mating: -
- Style: Board to Board
- Shrouding: Shrouded - 4 Wall
- Number of Positions: 108
- Number of Positions Loaded: All
- Number of Rows: 3
- Row Spacing - Mating: -
- Mounting Type: Through Hole, Right Angle
- Termination: Solder
- Fastening Type: Push-Pull
- Contact Length - Mating: -
- Contact Length - Post: 0.112" (2.84mm)
- Overall Contact Length: -
- Insulation Height: -
- Contact Shape: Rectangular, Square
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Finish - Post: -
- Contact Material: Copper Alloy
- Insulation Material: Liquid Crystal Polymer (LCP)
- Features: -
- Operating Temperature: -20°C ~ 85°C
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Insulation Color: -
|
Package: - |
Stock4,140 |
|
Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 108 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |
0
Login/Register
BOM
Cart
