Page 5 - NXP Products - Embedded - Microcontrollers - Application Specific

MM912G634DM1AE
NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Package: 48-LQFP Exposed Pad

Stock6,432
MM908E626AVPEK
NXP

IC STEPPER MOTOR DRVR 54SOIC

Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

Stock168,696
MM908E625ACPEK
NXP

IC QUAD HALF-BRIDGE 54SOIC

Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock7,424
MM908E622ACPEKR2
NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock7,616
MM912JS812AMAF
NXP

IC DRVR INJECTOR/IGN 100LQFP

Package: 100-LQFP Exposed Pad

Stock4,688
MM912G634DM1AER2
NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Package: 48-LQFP Exposed Pad

Stock6,704
MM912I637AM2EPR2
NXP

IC MCU LIN BATT MONITOR 48QFN

Package: 48-VFQFN Exposed Pad

Stock5,984
MM912I637AM2EP
NXP

IC MCU LIN BATT MONITOR 48QFN

Package: 48-VFQFN Exposed Pad

Stock2,976
MM912G634DV2APR2
NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Package: 48-LQFP

Stock7,632
MM912KS812AMAFR2
NXP

IC MCU 16BIT HCS12 100LQFP

Package: 100-LQFP Exposed Pad

Stock4,272
MM912G634DV2AP
NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Package: 48-LQFP

Stock143,916
MM908E624AYPEW
NXP

IC SW TRPL HISIDE MCU/LIN 54SOIC

Package: 54-BSSOP (0.295", 7.50mm Width)

Stock5,088
MM912I637AV1EPR2
NXP

IC MCU LIN BATT MONITOR 48QFN

Package: 48-VFQFN Exposed Pad

Stock6,160
MM912I637AV1EP
NXP

IC MCU LIN BATT MONITOR 48QFN

Package: 48-VFQFN Exposed Pad

Stock7,344
MM912JP812AMAF
NXP

IC DRVR INJECTOR/IGN 100LQFP

Package: 100-LQFP Exposed Pad

Stock6,016
MM908E621ACPEKR2
NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

Stock3,504
MM908E626AVPEKR2
NXP

IC STEPPER MOTOR DRVR 54SOIC

Package: 54-SOIC (0.295", 7.50mm Width) Exposed Pad

Stock4,528
MM908E625ACPEKR2
NXP

IC QUAD HALF-BRIDGE 54SOIC

Package: 54-SOIC (0.295", 7.50mm Width) Exposed Pad

Stock4,448
MM912J637AM2EP
NXP

IC MCU LIN BATT MONITOR 48QFN

Package: 48-VFQFN Exposed Pad

Stock15,612
MM912J637AM2EPR2
NXP

IC MCU LIN BATT MONITOR 48QFN

Package: 48-VFQFN Exposed Pad

Stock6,832

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Program Memory Type	Controller Series	RAM Size	Interface	Number of I/O	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MM912G634DM1AE	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: 48-LQFP Exposed Pad	Stock6,432	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MM908E626AVPEK	NXP	IC STEPPER MOTOR DRVR 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 115°C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock168,696	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	13	8 V ~ 18 V	-40°C ~ 115°C	Surface Mount	54-SSOP (0.295", 7.50mm Width) Exposed Pad	54-SOIC
MM908E625ACPEK	NXP	IC QUAD HALF-BRIDGE 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock7,424	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	13	8 V ~ 18 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	54-SOICW-EP
MM908E622ACPEKR2	NXP	IC QUAD HALF BRDG TRPL SW 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock7,616	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	12	9 V ~ 16 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	54-SOICW-EP
MM912JS812AMAF	NXP	IC DRVR INJECTOR/IGN 100LQFP Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	Package: 100-LQFP Exposed Pad	Stock4,688	S12XS	FLASH (128 kB)	HCS12	8K x 8	CAN, SCI, SPI	6	4.7 V ~ 36 V	-40°C ~ 125°C	Surface Mount	100-LQFP Exposed Pad	100-LQFP-EP (14x14)
MM912G634DM1AER2	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: 48-LQFP Exposed Pad	Stock6,704	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MM912I637AM2EPR2	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock5,984	S12	FLASH (96 KB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 125°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912I637AM2EP	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock2,976	S12	FLASH (96 KB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 125°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912G634DV2APR2	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock7,632	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP	48-LQFP (7x7)
MM912KS812AMAFR2	NXP	IC MCU 16BIT HCS12 100LQFP Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (256 kB) Controller Series: HCS12 RAM Size: 12K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	Package: 100-LQFP Exposed Pad	Stock4,272	S12XS	FLASH (256 kB)	HCS12	12K x 8	CAN, SCI, SPI	6	4.7 V ~ 36 V	-40°C ~ 125°C	Surface Mount	100-LQFP Exposed Pad	100-LQFP-EP (14x14)
MM912G634DV2AP	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock143,916	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP	48-LQFP (7x7)
MM908E624AYPEW	NXP	IC SW TRPL HISIDE MCU/LIN 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC	Package: 54-BSSOP (0.295", 7.50mm Width)	Stock5,088	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	16	5.5 V ~ 18 V	-40°C ~ 125°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width)	54-SOIC
MM912I637AV1EPR2	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock6,160	S12	FLASH (96 KB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912I637AV1EP	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock7,344	S12	FLASH (96 KB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912JP812AMAF	NXP	IC DRVR INJECTOR/IGN 100LQFP Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	Package: 100-LQFP Exposed Pad	Stock6,016	S12P	FLASH (128 kB)	HCS12	6K x 8	CAN, SCI, SPI	8	4.7 V ~ 36 V	-40°C ~ 125°C	Surface Mount	100-LQFP Exposed Pad	100-LQFP-EP (14x14)
MM908E621ACPEKR2	NXP	IC QUAD HALF BRDG TRPL SW 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP	Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock3,504	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	12	9 V ~ 16 V	-40°C ~ 85°C	Surface Mount	54-SSOP (0.295", 7.50mm Width) Exposed Pad	54-SOIC W EP
MM908E626AVPEKR2	NXP	IC STEPPER MOTOR DRVR 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 115°C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP	Package: 54-SOIC (0.295", 7.50mm Width) Exposed Pad	Stock4,528	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	13	8 V ~ 18 V	-40°C ~ 115°C	Surface Mount	54-SOIC (0.295", 7.50mm Width) Exposed Pad	54-SOIC W EP
MM908E625ACPEKR2	NXP	IC QUAD HALF-BRIDGE 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	Package: 54-SOIC (0.295", 7.50mm Width) Exposed Pad	Stock4,448	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	13	8 V ~ 18 V	-40°C ~ 85°C	Surface Mount	54-SOIC (0.295", 7.50mm Width) Exposed Pad	54-SOIC
MM912J637AM2EP	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock15,612	S12	FLASH (128 kB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 125°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912J637AM2EPR2	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock6,832	S12	FLASH (128 kB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 125°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM908E624ACPEW	NXP	IC SW TRPL HISIDE MCU/LIN 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC	Package: 54-BSSOP (0.295", 7.50mm Width)	Stock39,996	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	16	5.5 V ~ 18 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width)	54-SOIC
MM912G634DC1AER2	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: 48-LQFP Exposed Pad	Stock5,024	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MM912J637AV1EP	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock3,936	S12	FLASH (128 kB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912J637AV1EPR2	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock2,096	S12	FLASH (128 kB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912JS812AMAFR2	NXP	IC DRVR INJECTOR/IGN 100LQFP Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	Package: 100-LQFP Exposed Pad	Stock7,856	S12XS	FLASH (128 kB)	HCS12	8K x 8	CAN, SCI, SPI	6	4.7 V ~ 36 V	-40°C ~ 125°C	Surface Mount	100-LQFP Exposed Pad	100-LQFP-EP (14x14)
MM912G634DC2APR2	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,264	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP	48-LQFP (7x7)
MM908E624AYPEWR2	NXP	IC SW TRPL HISIDE MCU/LIN 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC	Package: 54-BSSOP (0.295", 7.50mm Width)	Stock6,672	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	16	5.5 V ~ 18 V	-40°C ~ 125°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width)	54-SOIC
MM912JP812AMAFR2	NXP	IC DRVR INJECTOR/IGN 100LQFP Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	Package: 100-LQFP Exposed Pad	Stock3,584	S12P	FLASH (128 kB)	HCS12	6K x 8	CAN, SCI, SPI	8	4.7 V ~ 36 V	-40°C ~ 125°C	Surface Mount	100-LQFP Exposed Pad	100-LQFP-EP (14x14)