|
|
NXP |
IC MCU 16BIT 512KB FLASH 112LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b, 16x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock5,504 |
|
16-Bit | 80MHz | CAN, I2C, SCI, SPI | LVD, POR, PWM, WDT | 91 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 125°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 32BIT ROMLESS 196MAPBGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 150MHz
- Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Peripherals: DMA, WDT
- Number of I/O: 97
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 196-LBGA
- Supplier Device Package: 196-MAPBGA (15x15)
|
Package: 196-LBGA |
Stock3,328 |
|
32-Bit | 150MHz | EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, WDT | 97 | - | ROMless | - | 64K x 8 | 1.4 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | - | 196-LBGA | 196-MAPBGA (15x15) |
|
|
NXP |
IC MCU 32BIT 1MB FLASH 208MAPBGA
- Core Processor: e200z0, e200z1
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 144
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 208-BGA
- Supplier Device Package: 208-MAPBGA (17x17)
|
Package: 208-BGA |
Stock3,024 |
|
32-Bit Dual-Core | 80MHz | CAN, EBI/EMI, I2C, SCI, SPI | DMA, POR, PWM, WDT | 144 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 105°C (TA) | - | 208-BGA | 208-MAPBGA (17x17) |
|
|
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 85
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock6,144 |
|
16-Bit | 25MHz | CAN, EBI/EMI, I2C, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 85 | 256KB (256K x 8) | FLASH | 2K x 8 | 12K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 8BIT ROMLESS 68PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 3MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 30
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 68-LCC (J-Lead)
- Supplier Device Package: 68-PLCC (25x25)
|
Package: 68-LCC (J-Lead) |
Stock2,560 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 30 | - | ROMless | 512 x 8 | 1K x 8 | 4.75 V ~ 5.25 V | A/D 8x8b | Internal | -40°C ~ 105°C (TA) | - | 68-LCC (J-Lead) | 68-PLCC (25x25) |
|
|
NXP |
IC MCU 32BIT 1MB FLASH 257MAPBGA
- Core Processor: e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 120MHz
- Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 32x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 257-LFBGA
- Supplier Device Package: 257-MAPBGA (14x14)
|
Package: 257-LFBGA |
Stock4,848 |
|
32-Bit Dual-Core | 120MHz | CAN, FlexRay, LIN, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
|
|
NXP |
IC MCU 32BIT 3MB FLASH 256MAPBGA
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
|
Package: 256-LBGA |
Stock5,904 |
|
32-Bit Dual-Core | 80MHz/160MHz | CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
|
|
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 16MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: LCD, POR, PWM, WDT
- Number of I/O: 85
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock4,288 |
|
16-Bit | 16MHz | CAN, I2C, SCI, SPI | LCD, POR, PWM, WDT | 85 | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 8BIT ROMLESS 52PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 3MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 38
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 52-LCC (J-Lead)
- Supplier Device Package: 52-PLCC (19.1x19.1)
|
Package: 52-LCC (J-Lead) |
Stock6,176 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | 512 x 8 | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 125°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
NXP |
IC MCU 8BIT ROMLESS 68PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 3MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 30
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 68-LCC (J-Lead)
- Supplier Device Package: 68-PLCC (25x25)
|
Package: 68-LCC (J-Lead) |
Stock6,944 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 30 | - | ROMless | 512 x 8 | 1K x 8 | 3 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | 68-LCC (J-Lead) | 68-PLCC (25x25) |
|
|
NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
|
Package: 80-QFP |
Stock23,652 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | PWM, WDT | 59 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 80-QFP | 80-QFP (14x14) |
|
|
NXP |
IC MCU 32BIT 1MB FLASH 324TEBGA
- Core Processor: e200z6
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 192
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
- Data Converters: A/D 40x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 324-BBGA
- Supplier Device Package: 324-TEPBGA (23x23)
|
Package: 324-BBGA |
Stock5,776 |
|
32-Bit | 80MHz | CAN, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 192 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
|
|
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock4,672 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 32BIT 1MB FLASH 144LQFP
- Core Processor: e200z0, e200z1
- Core Size: 32-Bit Dual-Core
- Speed: 66MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 111
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Package: 144-LQFP |
Stock5,488 |
|
32-Bit Dual-Core | 66MHz | CAN, EBI/EMI, I2C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
|
|
NXP |
IC MCU 32BIT ROMLESS 360PBGA
- Core Processor: Coldfire V4
- Core Size: 32-Bit
- Speed: 266MHz
- Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals: DMA, WDT
- Number of I/O: 132
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 360-BBGA
- Supplier Device Package: 360-PBGA (23x23)
|
Package: 360-BBGA |
Stock5,392 |
|
32-Bit | 266MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | 132 | - | ROMless | - | 32K x 8 | 1.35 V ~ 3.6 V | - | Internal | 0°C ~ 70°C (TA) | - | 360-BBGA | 360-PBGA (23x23) |
|
|
NXP |
IC MCU 32BIT ROMLESS 360PBGA
- Core Processor: Coldfire V4
- Core Size: 32-Bit
- Speed: 200MHz
- Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals: DMA, WDT
- Number of I/O: 132
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 360-BBGA
- Supplier Device Package: 360-PBGA (23x23)
|
Package: 360-BBGA |
Stock4,432 |
|
32-Bit | 200MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | 132 | - | ROMless | - | 32K x 8 | 1.35 V ~ 3.6 V | - | Internal | -40°C ~ 85°C (TA) | - | 360-BBGA | 360-PBGA (23x23) |
|
|
NXP |
IC MCU 16BIT 128KB FLASH 144LQFP
- Core Processor: 56800E
- Core Size: 16-Bit
- Speed: 60MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI
- Peripherals: POR, PWM, Temp Sensor, WDT
- Number of I/O: 62
- Program Memory Size: 128KB (64K x 16)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 6K x 16
- Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Package: 144-LQFP |
Stock6,792 |
|
16-Bit | 60MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, Temp Sensor, WDT | 62 | 128KB (64K x 16) | FLASH | - | 6K x 16 | 2.25 V ~ 3.6 V | A/D 16x12b | External | -40°C ~ 105°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
|
|
NXP |
IC MCU 16BIT 256KB FLASH 80QFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 14K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
|
Package: 80-QFP |
Stock4,992 |
|
16-Bit | 80MHz | CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI | LVD, POR, PWM, WDT | 59 | 256KB (256K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | -40°C ~ 125°C (TA) | - | 80-QFP | 80-QFP (14x14) |
|
|
NXP |
IC MCU 32BIT 2MB FLASH 169WLCSP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 180MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 116
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 2x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 169-UFBGA, WLCSP
- Supplier Device Package: 169-WLCSP (5.5x5.63)
|
Package: 169-UFBGA, WLCSP |
Stock4,416 |
|
32-Bit | 180MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I2S, LVD, POR, PWM, WDT | 116 | 2MB (2M x 8) | FLASH | - | 256K x 8 | 1.71 V ~ 3.6 V | A/D 2x16b, D/A 2x12b | Internal | -40°C ~ 85°C (TA) | - | 169-UFBGA, WLCSP | 169-WLCSP (5.5x5.63) |
|
|
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock4,000 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 125°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 8BIT ROMLESS 52PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 2MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 38
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 52-LCC (J-Lead)
- Supplier Device Package: 52-PLCC (19.1x19.1)
|
Package: 52-LCC (J-Lead) |
Stock5,552 |
|
8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | 512 x 8 | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock4,240 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 32BIT 1MB FLASH 176LQFP
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: DMA, LCD, POR, PWM, WDT
- Number of I/O: 136
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 48K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP |
Stock4,800 |
|
32-Bit | 64MHz | CAN, I2C, LIN, SCI, SPI | DMA, LCD, POR, PWM, WDT | 136 | 1MB (1M x 8) | FLASH | 64K x 8 | 48K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
|
|
NXP |
IC MCU 32BIT 1MB FLASH 176LQFP
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: DMA, LCD, POR, PWM, WDT
- Number of I/O: 136
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 48K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP |
Stock5,040 |
|
32-Bit | 64MHz | CAN, I2C, LIN, SCI, SPI | DMA, LCD, POR, PWM, WDT | 136 | 1MB (1M x 8) | FLASH | 64K x 8 | 48K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
|
|
NXP |
IC MCU 16BIT 512KB FLASH 112LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock6,416 |
|
16-Bit | 80MHz | EBI/EMI, I2C, IrDA, LIN, SCI, SPI | LVD, POR, PWM, WDT | 91 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock4,848 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock95,976 |
|
16-Bit | 25MHz | CAN, EBI/EMI, I2C, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 6K x 8 | 2.35 V ~ 2.75 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
|
|
NXP |
IC MCU 32BIT ROMLESS 144LQFP
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
- Peripherals: DMA, I2S, POR, Serial Audio, WDT
- Number of I/O: 34
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 4x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Package: 144-LQFP |
Stock5,056 |
|
32-Bit | 120MHz | I2C, IDE, Memory Card, SPI, UART/USART | DMA, I2S, POR, Serial Audio, WDT | 34 | - | ROMless | - | 96K x 8 | 3 V ~ 3.6 V | A/D 4x12b | External | -40°C ~ 85°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |