Page 27 - NXP Products - PMIC - Power Management - Specialized

MPF5030BMMA4ESR2
NXP

PMIC 3 BUCKS 2 LDO A1 DIE

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MFS2621AMDA0ADR2
NXP

AUTO SBC

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MPF5024AMBA0ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 4

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MFS2600AMBA0ADR2
NXP

AUTO SBC

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MFS2602AMDA0ADR2
NXP

AUTO SBC

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MC35FS6518CAER2
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

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MC33FS8530A0ESR2
NXP

SYSTEM BASIS CHIP FS8500

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MC33FS8410G6KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

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MC33FS8410G6ES
NXP

SYSTEM BASIS CHIP FS8410

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MC33FS8410G3KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

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MC33FS8410G3ES
NXP

SYSTEM BASIS CHIP FS8410

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Stock780
MC33PF8200CXESR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

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MFS2631AMBA0AD
NXP

AUTO SBC

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MC33FS8410G0ES
NXP

SAFETY POWER MANAGEMENT IC, QFN5

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MC33FS8410G0KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

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MPF5200AMMG3ESR2
NXP

POWER MANAGEMENT SPECIALIZED - P

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MC33FS4505KAER2
NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

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MC35FS6507NAER2
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

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PCA9460CUKZ
NXP

POWER MANAGE IC (PMIC) FOR I.MX

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MFS2321BMMA0EP
NXP

IC

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Part Number	Manufacturer	Description	Package	Stock	Current - Supply	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MPF5030BMMA4ESR2	NXP	PMIC 3 BUCKS 2 LDO A1 DIE Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	Package: -	Request a Quote	-	3.3V ~ 5.25V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-PowerVFQFN	40-HVQFN (6x6)
MFS2621AMDA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MPF5024AMBA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 4 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	Package: -	Request a Quote	10µA	2.5V ~ 5.5V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-VFQFN Exposed Pad	40-HVQFN (6x6)
MFS2600AMBA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MFS2602AMDA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC35FS6518CAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS8530A0ESR2	NXP	SYSTEM BASIS CHIP FS8500 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	-	-	-	-	-	-
MC33FS8410G6KS	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8410G6ES	NXP	SYSTEM BASIS CHIP FS8410 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	-	-	-	-	-	-
MC33FS8410G3KS	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8410G3ES	NXP	SYSTEM BASIS CHIP FS8410 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Stock780	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200CXESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS2631AMBA0AD	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC33FS8410G0ES	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8410G0KS	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MPF5200AMMG3ESR2	NXP	POWER MANAGEMENT SPECIALIZED - P Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	-	-	-	-	-	-
MC33FS4505KAER2	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC35FS6507NAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
PCA9460CUKZ	NXP	POWER MANAGE IC (PMIC) FOR I.MX Applications: Microcontroller, MCU Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 42-UFBGA, WLCSP Supplier Device Package: 42-WLCSP (2.86x2.46)	Package: -	Request a Quote	-	2.7V ~ 5.5V	-40°C ~ 125°C (TJ)	Surface Mount	42-UFBGA, WLCSP	42-WLCSP (2.86x2.46)
MFS2321BMMA0EP	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	-	-	-	-	-	-
MFS8623BMBA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Package: -	Request a Quote	-	4.5V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount	48-VFQFN Exposed Pad	48-QFN (7x7)
MC33FS6525NAER2	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS5502Y0ESR2	NXP	HIGH VOLTAGE PMIC QFN56 Applications: Power Supplies Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC35FS6506NAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MFS8633BMDA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Package: -	Request a Quote	-	4.5V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount	48-VFQFN Exposed Pad	48-QFN (7x7)
MWCT1001A3VLH	NXP	5W MULTI-COIL CONS QFP Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: -	Request a Quote	-	2.7V ~ 3.6V	-40°C ~ 105°C (TA)	Surface Mount	64-LQFP	64-LQFP (10x10)
MFS2632AMBA0AD	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MPF5032BMMA5ESR2	NXP	PMIC 2 BUCKS 2 LDO A1 DIE Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	Package: -	Request a Quote	-	3.3V ~ 5.25V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-PowerVFQFN	40-HVQFN (6x6)