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NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock7,568 |
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- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
FS4500
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock5,136 |
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- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock6,080 |
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- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock5,696 |
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- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
15W SINGLE-COIL CONSUMER STAND
- Applications: -
- Current - Supply: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,256 |
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- | - | - | - | - | - |
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NXP |
REGULATOR BUCK QUAD WITH UP TO
- Applications: QorlQ LS1/T1 Communications Processors
- Current - Supply: 250µA
- Voltage - Supply: 2.8 V ~ 4.5 V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN-EP (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock6,336 |
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250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
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NXP |
REGULATOR BUCK QUAD WITH UP TO
- Applications: QorlQ LS1/T1 Communications Processors
- Current - Supply: 250µA
- Voltage - Supply: 2.8 V ~ 4.5 V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN-EP (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock4,656 |
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250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
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NXP |
REGULATOR BUCK QUAD WITH UP TO
- Applications: QorlQ LS1/T1 Communications Processors
- Current - Supply: 250µA
- Voltage - Supply: 2.8 V ~ 4.5 V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN-EP (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock5,856 |
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250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
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NXP |
REGULATOR BUCK QUAD WITH UP TO
- Applications: QorlQ LS1/T1 Communications Processors
- Current - Supply: 250µA
- Voltage - Supply: 2.8 V ~ 4.5 V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN-EP (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock3,904 |
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250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
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NXP |
REGULATOR BUCK QUAD WITH UP TO
- Applications: QorlQ LS1/T1 Communications Processors
- Current - Supply: 250µA
- Voltage - Supply: 2.8 V ~ 4.5 V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN-EP (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock7,328 |
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250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
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NXP |
FS6500
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock4,400 |
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- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP Exposed Pad |
Stock5,616 |
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- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
FS6500
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP Exposed Pad |
Stock4,160 |
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- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP Exposed Pad |
Stock5,504 |
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- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
SYSTEM BASIS CHIP CAN 5V 1.5
- Applications: System Basis Chip
- Current - Supply: 13mA
- Voltage - Supply: 2.7 V ~ 36 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP Exposed Pad |
Stock5,040 |
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13mA | 2.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
FS4500
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP Exposed Pad |
Stock7,136 |
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- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock4,944 |
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- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
|
Package: 48-VFQFN Exposed Pad |
Stock6,784 |
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- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
|
Package: 48-VFQFN Exposed Pad |
Stock6,144 |
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- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock5,552 |
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- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
|
Package: 48-VFQFN Exposed Pad |
Stock6,736 |
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- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP Exposed Pad |
Stock2,144 |
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- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
SYSTEM BASIS CHIP CAN 5V 0.7
- Applications: System Basis Chip
- Current - Supply: 13mA
- Voltage - Supply: 2.7 V ~ 36 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP Exposed Pad |
Stock5,536 |
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13mA | 2.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
|
Package: 48-VFQFN Exposed Pad |
Stock7,616 |
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- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP |
TRANSFORMER PHYSICAL LAYER
- Applications: Isolated Communications Interface
- Current - Supply: 40mA
- Voltage - Supply: 4.5 V ~ 7 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SOIC
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock4,128 |
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40mA | 4.5 V ~ 7 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
|
Package: 48-VFQFN Exposed Pad |
Stock5,056 |
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- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
|
Package: 48-VFQFN Exposed Pad |
Stock3,232 |
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- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP |
PF1550
- Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply: -
- Voltage - Supply: 3.8 V ~ 7 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-QFN (5x5)
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Package: 40-VFQFN Exposed Pad |
Stock4,912 |
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- | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |