NXP Products

TRANS PREBIAS NPN 250MW SMT3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 10k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

TRANS PREBIAS PNP 150MW SC75

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 100k
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

TRANS NPN 15V 9GHZ SOT-23

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 15V
• Frequency - Transition: 9GHz
• Noise Figure (dB Typ @ f): 1.2dB ~ 2.1dB @ 900MHz
• Gain: -
• Power - Max: 150mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
• Current - Collector (Ic) (Max): 18mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

IC DDR TERMINATION SPAK-5

• Applications: Converter, DDR
• Voltage - Input: 1.6 V ~ 3.6 V
• Number of Outputs: 1
• Voltage - Output: -
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: SPak-5 (5 leads + Tab)
• Supplier Device Package: 5-SPAK

IC MULT VOLT REG W/SWITCH 20HSOP

• Applications: Processor
• Current - Supply: 500µA
• Voltage - Supply: 9.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 20-HSOP

IC LAMP DVR FLUORES 600V 20-SOIC

• Type: CFL/TL Controller
• Frequency: -
• Voltage - Supply: 11.9 V ~ 13.8 V
• Current - Supply: 1.7mA
• Current - Output Source/Sink: -
• Dimming: No
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

IC 4X4 REGISTER FILE 3ST 16SOIC

• Logic Type: Register File
• Output Type: Tri-State
• Number of Elements: 1
• Number of Bits per Element: 4
• Function: Universal
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

IC D-TYPE POS TRG SNGL 20DIP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 70MHz
• Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 16mA, 16mA
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Iq): 20µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)

IC IF-PLL I2C-BUS DEMOD 32-HVQFN

• Type: Demodulator
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

IC MPU MPC74XX 1.6GHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.6GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-BCBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

IC MPU Q OR IQ 800MHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: e200z0, e200z1
• Core Size: 32-Bit Dual-Core
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 111
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

IC MCU 32BIT 128KB FLASH 100LQFP

• Core Processor: 56800EX
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 86
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b, 8x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

IC MCU 8BIT 60KB FLASH 64QFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

IC MCU 32BIT 48KB FLASH 48LQFP

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 42
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

IC ADC 10BIT HS 28-SSOP

• Number of Bits: 10
• Sampling Rate (Per Second): 40M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: Sigma-Delta
• Reference Type: External
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP
• Mounting Type: -

RF TXRX MODULE 802.15.4 U.FL ANT

• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate: -
• Power - Output: 2.5dBm
• Sensitivity: -95dBm
• Serial Interfaces: I2C, SPI, UART
• Antenna Type: Not Included, U.FL
• Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
• Voltage - Supply: 2 V ~ 3.6 V
• Current - Receiving: 17mA
• Current - Transmitting: 15.3mA
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 27-SMD Module

BOARD EVAL MC33493 TANGO

• Type: Transmitter
• Frequency: 315MHz
• For Use With/Related Products: MC33493
• Supplied Contents: Board

SYSTEM BASIS CHIP DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

PF1510

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

IC SWITCH HIGH SIDE 32SOIC

• Switch Type: -
• Number of Outputs: -
• Ratio - Input:Output: -
• Output Configuration: -
• Output Type: -
• Interface: -
• Voltage - Load: -
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): -
• Rds On (Typ): -
• Input Type: -
• Features: -
• Fault Protection: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

S12Z CORE 128K FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

LAYERSCAPE 64-BIT ARM CORTEX-A72

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L, DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: USB 3.0 (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

POWER MANAGE IC (PMIC) FOR I.MX

• Applications: Microcontroller, MCU
• Current - Supply: -
• Voltage - Supply: 2.7V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 42-UFBGA, WLCSP
• Supplier Device Package: 42-WLCSP (2.86x2.46)

IC TRANSCEIVER 1/1 8SO

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: 175 mV
• Data Rate: -
• Voltage - Supply: 5V ~ 18V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

SOFTWARE DEFINED RADIO

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

IC MCU 32BIT 2MB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 112MHz
• Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: I2S, POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 32x12b SAR; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

IC MPU I.MX8MN 1.4GHZ 306TFBGA

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 1.4GHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: DDR3L, DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
• Ethernet: GbE
• SATA: -
• USB: USB 2.0 OTG + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
• Package / Case: 306-TFBGA
• Supplier Device Package: 306-TFBGA (11x11)