Page 203 - NXP Products | Heisener Electronics

BUK75150-55A,127
NXP

MOSFET N-CH 55V 11A TO220AB

Package: TO-220-3

Stock2,976
PHD13005AD,127
NXP

TRANS NPN 700V 4A DPAK

Package: TO-252-3, DPak (2 Leads + Tab), SC-63

Stock4,592
PQJ7980AHN/C0JL,51
NXP

IC PQJ7980AHN 32HVQFN

Package: -

Stock3,056
BUK218-50DC,118
NXP

TOPFET DUAL SWITCH D2PAK

Package: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

Stock6,496
74ABT640D,602
NXP

IC TRANSCEIVER 3ST 8BIT 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock5,616
74ABT640N,602
NXP

IC TRANSCEIVER 3ST 8BIT 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock7,600
74LVTH322245EC,551
NXP

IC BUS TRSCVR 3-ST 32BIT 96LFBGA

Package: 96-LFBGA

Stock6,768
74HCT652D,118
NXP

IC TXRX NON-INV 3-ST 8BIT 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock6,416
MC33CM0902WEF
NXP

IC TXRX CAN 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock4,992
MC8641DTVU1000GC
NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Package: 1023-BCBGA, FCCBGA

Stock7,040
MC8641DTHX1000GC
NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Package: 1023-BCBGA, FCCBGA

Stock7,136
MC68EC030FE40C
NXP

IC MPU M680X0 40MHZ 132CQFP

Package: 132-BCQFP

Stock20,856
MC68340AB16E
NXP

IC MPU M683XX 16MHZ 144QFP

Package: 144-BQFP

Stock5,408
PC9RS08KA2DWE
NXP

IC MCU 8BIT 2KB FLASH 8SOIC

Package: 8-SOIC (0.209", 5.30mm Width)

Stock3,376
MC68336ACAB25
NXP

IC MCU 32BIT ROMLESS 160QFP

Package: 160-BQFP

Stock2,624
MC68332ACPV25
NXP

IC MCU 32BIT ROMLESS 144LQFP

Package: 144-LQFP

Stock8,184
MC9S12P128MQK
NXP

IC MCU 16BIT 128KB FLASH 80QFP

Package: 80-QFP

Stock3,344
MK81FN256VLL15
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Package: 100-LQFP

Stock7,760
SAA7709H/N107S,557
NXP

IC DSP CAR RADIO 80QFP

Package: 80-BQFP

Stock7,440
MPC962309DT-1H
NXP

IC CLOCK BUFFER 1:9 16-TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock3,808

Part Number	Manufacturer	Description	Package	Stock
BUK75150-55A,127	NXP	MOSFET N-CH 55V 11A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 11A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 5.5nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 322pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 36W (Tc) Rds On (Max) @ Id, Vgs: 150 mOhm @ 5A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock2,976
PHD13005AD,127	NXP	TRANS NPN 700V 4A DPAK Transistor Type: NPN Current - Collector (Ic) (Max): 4A Voltage - Collector Emitter Breakdown (Max): 700V Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - DC Current Gain (hFE) (Min) @ Ic, Vce: - Power - Max: - Frequency - Transition: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Supplier Device Package: DPAK	Package: TO-252-3, DPak (2 Leads + Tab), SC-63	Stock4,592
PQJ7980AHN/C0JL,51	NXP	IC PQJ7980AHN 32HVQFN Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,056
BUK218-50DC,118	NXP	TOPFET DUAL SWITCH D2PAK Driven Configuration: High-Side Channel Type: Independent Number of Drivers: 2 Gate Type: N-Channel MOSFET Voltage - Supply: 5.5 V ~ 35 V Logic Voltage - VIL, VIH: 1.2V, 3V Current - Peak Output (Source, Sink): 8A, 8A Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB Supplier Device Package: D2PAK	Package: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	Stock6,496
74ABT640D,602	NXP	IC TRANSCEIVER 3ST 8BIT 20SOIC Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	Package: 20-SOIC (0.295", 7.50mm Width)	Stock5,616
74ABT640N,602	NXP	IC TRANSCEIVER 3ST 8BIT 20DIP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	Package: 20-DIP (0.300", 7.62mm)	Stock7,600
74LVTH322245EC,551	NXP	IC BUS TRSCVR 3-ST 32BIT 96LFBGA Logic Type: Transceiver, Non-Inverting Number of Elements: 4 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	Package: 96-LFBGA	Stock6,768
74HCT652D,118	NXP	IC TXRX NON-INV 3-ST 8BIT 24SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock6,416
MC33CM0902WEF	NXP	IC TXRX CAN 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 2/2 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SOIC	Package: 14-SOIC (0.154", 3.90mm Width)	Stock4,992
MC8641DTVU1000GC	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	Package: 1023-BCBGA, FCCBGA	Stock7,040
MC8641DTHX1000GC	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	Package: 1023-BCBGA, FCCBGA	Stock7,136
MC68EC030FE40C	NXP	IC MPU M680X0 40MHZ 132CQFP Core Processor: 68030 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 40MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 132-BCQFP Supplier Device Package: 132-CQFP (24x24)	Package: 132-BCQFP	Stock20,856
MC68340AB16E	NXP	IC MPU M683XX 16MHZ 144QFP Core Processor: CPU32 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 16MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 144-BQFP Supplier Device Package: 144-QFP (28x28)	Package: 144-BQFP	Stock5,408
PC9RS08KA2DWE	NXP	IC MCU 8BIT 2KB FLASH 8SOIC Core Processor: RS08 Core Size: 8-Bit Speed: 10MHz Connectivity: - Peripherals: LVD, POR, WDT Number of I/O: 4 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 63 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	Package: 8-SOIC (0.209", 5.30mm Width)	Stock3,376
MC68336ACAB25	NXP	IC MCU 32BIT ROMLESS 160QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 7.5K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28)	Package: 160-BQFP	Stock2,624
MC68332ACPV25	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: CPU32 Core Size: 32-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock8,184
MC9S12P128MQK	NXP	IC MCU 16BIT 128KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock3,344
MK81FN256VLL15	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 150MHz Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM Number of I/O: 66 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x16b, D/A 2x6b, 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,760
SAA7709H/N107S,557	NXP	IC DSP CAR RADIO 80QFP Type: Car Signal Processor Interface: I2C, I2S, LSB, SPDIF Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14x20)	Package: 80-BQFP	Stock7,440
MPC962309DT-1H	NXP	IC CLOCK BUFFER 1:9 16-TSSOP Type: Fanout Distribution, Spread Spectrum Clock Generator, Zero Delay Buffer PLL: Yes Input: LVCMOS Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 1:9 Differential - Input:Output: No/No Frequency - Max: 133.33MHz Divider/Multiplier: No/No Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock3,808
MPX2202GP	NXP	SENSOR GAUGE PRESS 29PSI MAX Pressure Type: Vented Gauge Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.19" (4.93mm) Tube Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 4-SIP Module Supplier Device Package: -	Package: 4-SIP Module	Stock19,740
TEF6607T/V5,512	NXP	IC TUNER CAR RADIO AM/FM 32SO Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8.5V Operating Temperature: - Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	Package: 32-SOIC (0.295", 7.50mm Width)	Stock5,616
1321XDSK	NXP	KIT STARTER DEVELOPER 1321X Type: Transceiver; 802.15.4 (ZigBee?) Frequency: 2.4GHz For Use With/Related Products: MC1321x Supplied Contents: 2 Boards, Cables	Package: -	Stock8,208
FRDM-KW41Z	NXP	FREEDOM DEV KIT Type: Transceiver; Bluetooth? Smart 4.x Low Energy (BLE) Frequency: 2.4GHz For Use With/Related Products: KW41Z Supplied Contents: 2 Boards	Package: -	Stock5,166
MW6IC1940GNBR1	NXP	IC POWER AMP RF TO-272-16 GW Frequency: 1.92GHz ~ 2GHz P1dB: - Gain: 27dB Noise Figure: - RF Type: Cellular, W-CDMA Voltage - Supply: 28V Current - Supply: 200mA Test Frequency: - Package / Case: TO-272-16 Variant, Gull Wing Supplier Device Package: TO-272 WB-16 GULL	Package: TO-272-16 Variant, Gull Wing	Stock7,668
LS1023ASE7QQB	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,872
SPC5644AF0MMG2R	NXP	32BIT4MB FLASH192K RAMFLEXRAY Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 120 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	Package: 208-BGA	Stock3,776
S32K322NHT0MPAST	NXP	S32K322, 2MB FLASH, 256KB RAM Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote