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NXP |
DIODE ARRAY GP 80V 215MA SMT3
- Diode Configuration: 1 Pair Series Connection
- Diode Type: Standard
- Voltage - DC Reverse (Vr) (Max): 80V
- Current - Average Rectified (Io) (per Diode): 215mA (DC)
- Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA
- Speed: Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr): 4ns
- Current - Reverse Leakage @ Vr: 500nA @ 80V
- Operating Temperature - Junction: 150°C (Max)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock7,568 |
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NXP |
IC SYSTEM BASIS CHIP CAN 28-SOIC
- Applications: Automotive
- Current - Supply: 42mA
- Voltage - Supply: 5.5 V ~ 18 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock47,196 |
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NXP |
IC EEPROM 8KBIT 100KHZ 8SO
- Memory Type: Non-Volatile
- Memory Format: EEPROM
- Technology: EEPROM
- Memory Size: 8Kb (1K x 8)
- Memory Interface: I2C
- Clock Frequency: 100kHz
- Write Cycle Time - Word, Page: -
- Access Time: -
- Voltage - Supply: 2.5 V ~ 6.0 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.295", 7.50mm Width) |
Stock4,832 |
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NXP |
IC GATE NAND 4CH 2-INP 14-TSSOP
- Logic Type: NAND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 20mA, 32mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-TSSOP
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock2,272 |
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NXP |
IC UART DUAL W/FIFO 40-DIP
- Features: -
- Number of Channels: 2, DUART
- FIFO's: 16 Byte
- Protocol: -
- Data Rate (Max): 5Mbps
- Voltage - Supply: 2.5V, 3.3V, 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: Yes
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Through Hole
- Package / Case: 40-DIP (0.600", 15.24mm)
- Supplier Device Package: 40-DIP
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Package: 40-DIP (0.600", 15.24mm) |
Stock4,272 |
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NXP |
IC DVI/HDMI LVL SHIFTER 32HVQFN
- Applications: HDMI
- Interface: -
- Voltage - Supply: 3.3V
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
- Mounting Type: Surface Mount
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Package: 32-VFQFN Exposed Pad |
Stock2,560 |
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NXP |
IC MPU MPC83XX 400MHZ 473MAPBGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 473-LFBGA
- Supplier Device Package: 473-MAPBGA (19x19)
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Package: 473-LFBGA |
Stock5,760 |
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NXP |
IC MPU MPC83XX 400MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock2,016 |
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NXP |
IC MPU MPC83XX 266MHZ 516BGA
- Core Processor: PowerPC e300c2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Package: 516-BBGA |
Stock4,080 |
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NXP |
IC MPU MPC8XX 66MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM, Security; SEC
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (3), 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: Cryptography
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock4,240 |
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NXP |
IC MPU MPC85XX 833MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 833MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 784-BBGA, FCBGA |
Stock7,760 |
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NXP |
IC MPU MPC8XX 50MHZ 256BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Package: 256-BBGA |
Stock7,008 |
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NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock3,104 |
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NXP |
IC MPU MPC74XX 867MHZ 360FCCBGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 867MHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-CBGA, FCCBGA
- Supplier Device Package: 360-FCCBGA (25x25)
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Package: 360-CBGA, FCCBGA |
Stock5,968 |
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NXP |
IC MCU 32BIT 2MB FLASH 416BGA
- Core Processor: e200z6
- Core Size: 32-Bit
- Speed: 82MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 256
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
- Data Converters: A/D 40x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 416-BBGA
- Supplier Device Package: 416-PBGA (27x27)
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Package: 416-BBGA |
Stock18,924 |
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NXP |
IC MCU 32BIT 256KB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 168MHz
- Connectivity: CAN, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 74
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 38x12b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock5,200 |
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NXP |
IC MCU 8BIT 60KB FLASH 64QFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-QFP |
Stock4,736 |
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NXP |
IC MCU 32BIT 128KB FLASH 32QFN
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 75MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 28
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 2x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock5,664 |
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NXP |
IC MCU 32BIT 256KB FLASH 144LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 102
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 46x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock5,888 |
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NXP |
AUDIO PROCESSOR SYMPH 144-LQFP
- Type: Audio Processor
- Interface: Host Interface, I2C, SAI, SPI
- Clock Rate: 200MHz
- Non-Volatile Memory: External
- On-Chip RAM: 744kB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.00V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock2,736 |
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NXP |
IC ADC/DAC 8-BIT I2C 16-HVQFN
- Type: ADC, DAC
- Number of Channels: -
- Resolution (Bits): 8 b
- Sampling Rate (Per Second): -
- Data Interface: I2C, Serial
- Voltage Supply Source: Single Supply
- Voltage - Supply: 2.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-VQFN Exposed Pad
- Supplier Device Package: 16-HVQFN (4x4)
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Package: 16-VQFN Exposed Pad |
Stock3,824 |
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NXP |
IC RFID READER MODULE 100LQFP
- Type: RFID Reader
- Frequency: 125kHz, 13.56MHz
- Standards: FeliCa, ISO 14443, MIFARE, NFC
- Interface: I2C, SPI, UART
- Voltage - Supply: 3 V ~ 5.5 V
- Operating Temperature: -25°C ~ 70°C
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock20,676 |
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NXP |
SINGLE CORE 3M FLASH 384K RAM
- Core Processor: e200z4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
- Peripherals: DMA, I²S, POR, WDT
- Number of I/O: 129
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 384K x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 36x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP Exposed Pad |
Stock7,872 |
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NXP |
CAR DSP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
POWER MANAGEMENT IC I.MX8 NON-PR
- Applications: High Performance i.MX 8 Processor Based
- Current - Supply: -
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
I.MX8 QXP 21X21
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC COMPARATOR 1 GEN PUR 6XSON
- Type: General Purpose
- Number of Elements: 1
- Output Type: Open-Drain
- Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
- Voltage - Input Offset (Max): 30mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 68mA @ 5.5V
- Current - Quiescent (Max): 6µA (Typ)
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 800ns (Typ)
- Hysteresis: 20mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 6-XFDFN
- Mounting Type: Surface Mount
- Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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Package: - |
Stock4,836 |
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