Page 100 - Preci-Dip Products - Sockets for ICs, Transistors

558-10-520M31-001101
Preci-Dip

PGA SOLDER TAIL 1.27MM

Package: -

Stock3,888
518-77-478M26-131106
Preci-Dip

CONN SOCKET PGA 478POS GOLD

Package: -

Stock2,556
550-10-600M35-001152
Preci-Dip

BGA SOLDER TAIL

Package: -

Stock2,250
518-77-520M31-001106
Preci-Dip

CONN SOCKET PGA 520POS GOLD

Package: -

Stock7,596
518-77-480M29-001105
Preci-Dip

CONN SOCKET PGA 480POS GOLD

Package: -

Stock7,794
558-10-480M29-001104
Preci-Dip

BGA SURFACE MOUNT 1.27MM

Package: -

Stock3,400
518-77-478M26-131105
Preci-Dip

CONN SOCKET PGA 478POS GOLD

Package: -

Stock3,762
558-10-478M26-131104
Preci-Dip

BGA SURFACE MOUNT 1.27MM

Package: -

Stock3,562
558-10-560M33-001101
Preci-Dip

PGA SOLDER TAIL 1.27MM

Package: -

Stock2,736
558-10-504M29-001101
Preci-Dip

PGA SOLDER TAIL 1.27MM

Package: -

Stock6,390
518-77-520M31-001105
Preci-Dip

CONN SOCKET PGA 520POS GOLD

Package: -

Stock7,434
558-10-520M31-001104
Preci-Dip

BGA SURFACE MOUNT 1.27MM

Package: -

Stock4,860
558-10-500M30-001101
Preci-Dip

PGA SOLDER TAIL 1.27MM

Package: -

Stock8,748
518-77-504M29-001106
Preci-Dip

CONN SOCKET PGA 504POS GOLD

Package: -

Stock8,964
518-77-456M26-001106
Preci-Dip

CONN SOCKET PGA 456POS GOLD

Package: -

Stock7,866
550-10-576M30-001152
Preci-Dip

BGA SOLDER TAIL

Package: -

Stock6,678
518-77-500M30-001106
Preci-Dip

CONN SOCKET PGA 500POS GOLD

Package: -

Stock3,852
550-10-520M31-001152
Preci-Dip

BGA SOLDER TAIL

Package: -

Stock3,042
514-83-600M35-001148
Preci-Dip

CONN SOCKET BGA 600POS GOLD

Package: -

Stock2,682
518-77-504M29-001105
Preci-Dip

CONN SOCKET PGA 504POS GOLD

Package: -

Stock7,722

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
558-10-520M31-001101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 520 (31 x 31) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,888	520 (31 x 31)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-478M26-131106	Preci-Dip	CONN SOCKET PGA 478POS GOLD Type: PGA Number of Positions or Pins (Grid): 478 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,556	478 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-600M35-001152	Preci-Dip	BGA SOLDER TAIL Type: BGA Number of Positions or Pins (Grid): 600 (35 x 35) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,250	600 (35 x 35)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-520M31-001106	Preci-Dip	CONN SOCKET PGA 520POS GOLD Type: PGA Number of Positions or Pins (Grid): 520 (31 x 31) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,596	520 (31 x 31)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-480M29-001105	Preci-Dip	CONN SOCKET PGA 480POS GOLD Type: PGA Number of Positions or Pins (Grid): 480 (29 x 29) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,794	480 (29 x 29)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-480M29-001104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 480 (29 x 29) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,400	480 (29 x 29)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-478M26-131105	Preci-Dip	CONN SOCKET PGA 478POS GOLD Type: PGA Number of Positions or Pins (Grid): 478 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,762	478 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-478M26-131104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 478 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,562	478 (26 x 26)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-560M33-001101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 560 (33 x 33) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,736	560 (33 x 33)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-504M29-001101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 504 (29 x 29) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,390	504 (29 x 29)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-520M31-001105	Preci-Dip	CONN SOCKET PGA 520POS GOLD Type: PGA Number of Positions or Pins (Grid): 520 (31 x 31) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,434	520 (31 x 31)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-520M31-001104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 520 (31 x 31) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,860	520 (31 x 31)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-500M30-001101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 500 (30 x 30) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,748	500 (30 x 30)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-504M29-001106	Preci-Dip	CONN SOCKET PGA 504POS GOLD Type: PGA Number of Positions or Pins (Grid): 504 (29 x 29) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,964	504 (29 x 29)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-456M26-001106	Preci-Dip	CONN SOCKET PGA 456POS GOLD Type: PGA Number of Positions or Pins (Grid): 456 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,866	456 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-576M30-001152	Preci-Dip	BGA SOLDER TAIL Type: BGA Number of Positions or Pins (Grid): 576 (30 x 30) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,678	576 (30 x 30)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-500M30-001106	Preci-Dip	CONN SOCKET PGA 500POS GOLD Type: PGA Number of Positions or Pins (Grid): 500 (30 x 30) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,852	500 (30 x 30)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-520M31-001152	Preci-Dip	BGA SOLDER TAIL Type: BGA Number of Positions or Pins (Grid): 520 (31 x 31) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,042	520 (31 x 31)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
514-83-600M35-001148	Preci-Dip	CONN SOCKET BGA 600POS GOLD Type: BGA Number of Positions or Pins (Grid): 600 (35 x 35) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,682	600 (35 x 35)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
518-77-504M29-001105	Preci-Dip	CONN SOCKET PGA 504POS GOLD Type: PGA Number of Positions or Pins (Grid): 504 (29 x 29) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,722	504 (29 x 29)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-456M26-001105	Preci-Dip	CONN SOCKET PGA 456POS GOLD Type: PGA Number of Positions or Pins (Grid): 456 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,114	456 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-504M29-001104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 504 (29 x 29) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,362	504 (29 x 29)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-456M26-001104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 456 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,878	456 (26 x 26)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-500M30-001105	Preci-Dip	CONN SOCKET PGA 500POS GOLD Type: PGA Number of Positions or Pins (Grid): 500 (30 x 30) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,668	500 (30 x 30)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-480M29-001101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 480 (29 x 29) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,678	480 (29 x 29)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-478M26-131101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 478 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,716	478 (26 x 26)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-504M29-001152	Preci-Dip	BGA SOLDER TAIL Type: BGA Number of Positions or Pins (Grid): 504 (29 x 29) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,834	504 (29 x 29)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-500M30-001152	Preci-Dip	BGA SOLDER TAIL Type: BGA Number of Positions or Pins (Grid): 500 (30 x 30) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,708	500 (30 x 30)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C