STMicroelectronics Products

MOSFET N-CH 800V 2.5A DPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 800V
• Current - Continuous Drain (Id) @ 25°C: 2.5A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4.5V @ 50µA
• Gate Charge (Qg) (Max) @ Vgs: 19nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 485pF @ 25V
• Vgs (Max): ±30V
• FET Feature: -
• Power Dissipation (Max): 70W (Tc)
• Rds On (Max) @ Id, Vgs: 4.5 Ohm @ 1.25A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D-Pak
• Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63

DIAC 28-36V 2A MINIMELF

• Voltage - Breakover: 28 ~ 36V
• Current - Breakover: 50µA
• Current - Hold (Ih) (Max): -
• Current - Peak Output: 2A
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: DO-213AA
• Supplier Device Package: Mini MELF

DIODE ARRAY GP 200V 10A D2PAK

• Diode Configuration: 1 Pair Common Cathode
• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 200V
• Current - Average Rectified (Io) (per Diode): 10A
• Voltage - Forward (Vf) (Max) @ If: 850mV @ 8A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 35ns
• Current - Reverse Leakage @ Vr: 15µA @ 200V
• Operating Temperature - Junction: 150°C (Max)
• Mounting Type: Surface Mount
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
• Supplier Device Package: D2PAK

IC REG LINEAR 8V 500MA 8SO

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 20V
• Voltage - Output (Min/Fixed): 8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.7V @ 500mA
• Current - Output: 500mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 1.5mA ~ 12mA
• PSRR: 72dB ~ 60dB (120Hz ~ 10kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

IC DOOR MODULE DRIVER 64TQFP

• Applications: Automotive
• Current - Supply: 4µA
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-TQFP

IC MOTOR DRIVER LOWSIDE 20SO

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 4.5 V ~ 32 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): -
• Rds On (Typ): 1.7 Ohm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Over Temperature
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

IC MOTOR DRIVER PAR 48QFN

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (3)
• Interface: Parallel
• Technology: DMOS
• Step Resolution: -
• Applications: General Purpose
• Current - Output: 2.5A
• Voltage - Supply: 8 V ~ 52 V
• Voltage - Load: 8 V ~ 52 V
• Operating Temperature: -25°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

IC EEPROM 64KBIT 2MHZ 8MLP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 64Kb (8K x 8)
• Memory Interface: SPI
• Clock Frequency: 20MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-UFDFN Exposed Pad
• Supplier Device Package: 8-MLP (2x3)

IC EEPROM 4KBIT 10MHZ 8SO

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (512 x 8)
• Memory Interface: SPI
• Clock Frequency: 20MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

IC GATE NAND 4CH 2-INP 14-DIP

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 2 V ~ 6 V
• Current - Quiescent (Max): 1µA
• Current - Output High, Low: 5.2mA, 5.2mA
• Logic Level - Low: 0.5 V ~ 1.8 V
• Logic Level - High: 1.5 V ~ 4.2 V
• Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

IC 2INPUT AND/OR QUAD 14DIP

• Logic Type: AND/OR Gate
• Number of Circuits: 4
• Number of Inputs: 2 Input (1, 1)
• Schmitt Trigger Input: No
• Output Type: Single-Ended
• Current - Output High, Low: 6.8mA, 6.8mA
• Voltage - Supply: 3 V ~ 20 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

IC OPAMP GP 10KHZ RRO 8SO

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.0045 V/µs
• Gain Bandwidth Product: 10kHz
• -3db Bandwidth: -
• Current - Input Bias: 1pA
• Voltage - Input Offset: 5mV
• Current - Supply: 1.2µA
• Current - Output / Channel: 5mA
• Voltage - Supply, Single/Dual (±): 2.5 V ~ 10 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

IC OPAMP GP 5.5MHZ RRO 8DFN

• Amplifier Type: General Purpose
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 1.9 V/µs
• Gain Bandwidth Product: 5.5MHz
• -3db Bandwidth: -
• Current - Input Bias: 60nA
• Voltage - Input Offset: 3.5mV
• Current - Supply: 300µA
• Current - Output / Channel: 70mA
• Voltage - Supply, Single/Dual (±): 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-UFDFN Exposed Pad
• Supplier Device Package: 8-DFN (2x2)

IC MCU 32BIT 2MB FLASH 176LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 140
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 24x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: -

IC PROCESSOR CAR SGNL 6CH 64LQFP

• Function: Audio Signal Processor
• Applications: Automotive Audio
• Number of Channels: 6
• Interface: I2C, SPI
• Voltage - Supply: 7.5 V ~ 9.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Specifications: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

IC OVP DGTL TERMINATION 14-TSSOP

• Voltage - Clamping: -
• Technology: Mixed Technology
• Number of Circuits: 2
• Number of Circuits: 2
• Applications: General Purpose
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad
• Supplier Device Package: 14-TSSOP-EP

TVS DIODE 22VWM 48.3VC SMA

• Type: Zener
• Unidirectional Channels: -
• Bidirectional Channels: 1
• Voltage - Reverse Standoff (Typ): 22V
• Voltage - Breakdown (Min): 24.4V
• Voltage - Clamping (Max) @ Ipp: 48.3V
• Current - Peak Pulse (10/1000µs): 48A (8/20µs)
• Power - Peak Pulse: 400W
• Power Line Protection: No
• Applications: Automotive
• Capacitance @ Frequency: -
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-214AC, SMA
• Supplier Device Package: SMA (DO-214AC)

TVS DIODE 10VWM 19.6VC SMA

• Type: Zener
• Unidirectional Channels: 1
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 10V
• Voltage - Breakdown (Min): 11.1V
• Voltage - Clamping (Max) @ Ipp: 19.6V
• Current - Peak Pulse (10/1000µs): 184A (8/20µs)
• Power - Peak Pulse: 600W
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: -
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-214AC, SMA
• Supplier Device Package: SMA (DO-214AC)

GYROSCOPE MEMS DUAL AXIS 16-LGA

• Type: Analog
• Axis: X (Pitch), Y (Roll)
• Range °/s: ±1500
• Sensitivity (LSB/(°/s)): -
• Sensitivity (mV/°/s): 0.67
• Bandwidth: 140Hz
• Output Type: Analog Voltage
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Supply: 6.8mA
• Features: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 16-LFLGA

IC REG LINEAR 3V 250MA SOT23-5

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.2V @ 250mA
• Current - Output: 250mA
• Current - Quiescent (Iq): 25µA
• Current - Supply (Max): 425µA
• PSRR: 80dB ~ 60dB (100Hz ~ 100KHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Short Circuit, Soft Start
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

LQFP 64 10X10X1.4 1

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: HDMI-CEC, I²C, IrDA, LINbus, SPI, UART/USART
• Peripherals: DMA, I²S, POR, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 19x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

16/32-BITS MICROS

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, SWPMI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, PWM, WDT
• Number of I/O: 109
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 19x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

IC MCU 32BIT 128MB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 6K x 8
• RAM Size: 20K x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
• Data Converters: A/D 15x12b SAR; D/A 2x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

100 V, 1 A POWER SCHOTTKY TRENCH

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 100 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 725 mV @ 1 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 1.7 µA @ 100 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SOD-123F
• Supplier Device Package: SOD-123F
• Operating Temperature - Junction: 175°C

IC MCU 32BIT 32KB FLASH 28UFQFPN

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 64MHz
• Connectivity: I2C, IrDA, LINbus, SPI, SmartCard, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
• Data Converters: A/D 17x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-UFQFN
• Supplier Device Package: 28-UFQFPN (4x4)

IGBT TRENCH FS 650V 40A TO220FP

• IGBT Type: Trench Field Stop
• Voltage - Collector Emitter Breakdown (Max): 650 V
• Current - Collector (Ic) (Max): 40 A
• Current - Collector Pulsed (Icm): 60 A
• Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 20A
• Power - Max: 45 W
• Switching Energy: 265µJ (on), 214µJ (off)
• Input Type: Standard
• Gate Charge: 56 nC
• Td (on/off) @ 25°C: 16ns/78.8ns
• Test Condition: 400V, 20A, 10Ohm, 15V
• Reverse Recovery Time (trr): 215 ns
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-220-3 Full Pack
• Supplier Device Package: TO-220FP

IC MCU 32BIT 64KB FLASH 48UFQFPN

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 64MHz
• Connectivity: HDMI-CEC, I2C, IrDA, LINbus, SPI, UART/USART, USB Type-C™ (Power Delivery)
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, Temp Sensor, WDT
• Number of I/O: 44
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 36K x 8
• Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
• Data Converters: A/D 17x12b SAR; D/A 2x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-UFQFN Exposed Pad
• Supplier Device Package: 48-UFQFPN (7x7)

IC MCU 32BIT 1MB FLASH 100ETQFP

• Core Processor: e200z2
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, I2C, LINbus, SPI
• Peripherals: DMA, WDT
• Number of I/O: 48
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3.3V, 5V
• Data Converters: A/D 27x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad
• Supplier Device Package: 100-eTQFP (14x14)