Vishay Foil Resistors (Division of Vishay Precision Group) Products - Chip Resistor - Surface Mount

RES SMD 3.65KOHM 0.01% 1/5W 0805

• Resistance: 3.65 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.4K OHM 0.01% 1/5W 0805

• Resistance: 3.4 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.3K OHM 0.01% 1/5W 0805

• Resistance: 3.3 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.01KOHM 0.01% 1/5W 0805

• Resistance: 3.01 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3K OHM 0.01% 1/5W 0805

• Resistance: 3 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.7K OHM 0.01% 1/5W 0805

• Resistance: 2.7 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.6K OHM 0.01% 1/5W 0805

• Resistance: 2.6 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.49KOHM 0.01% 1/5W 0805

• Resistance: 2.49 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.43KOHM 0.01% 1/5W 0805

• Resistance: 2.43 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.4K OHM 0.01% 1/5W 0805

• Resistance: 2.4 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.2K OHM 0.01% 1/5W 0805

• Resistance: 2.2 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.2K OHM 0.01% 1/5W 0805

• Resistance: 2.2 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1K OHM 0.01% 1/10W 0603

• Resistance: 1 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.1W, 1/10W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.032" W (1.60mm x 0.81mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1K OHM 0.01% 1/10W 0603

• Resistance: 1 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.1W, 1/10W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.032" W (1.60mm x 0.81mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 0.01 OHM 0.5% 3W 3637

• Resistance: 10 mOhms
• Tolerance: ±0.5%
• Power (Watts): 3W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±5ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 3637
• Supplier Device Package: 3637
• Size / Dimension: 0.360" L x 0.370" W (9.14mm x 9.40mm)
• Height - Seated (Max): 0.035" (0.89mm)
• Number of Terminations: 4
• Failure Rate: -

RES SMD 0.004 OHM 0.5% 3W 3637

• Resistance: 4 mOhms
• Tolerance: ±0.5%
• Power (Watts): 3W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±5ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 3637
• Supplier Device Package: 3637
• Size / Dimension: 0.360" L x 0.370" W (9.14mm x 9.40mm)
• Height - Seated (Max): 0.035" (0.89mm)
• Number of Terminations: 4
• Failure Rate: -

RES SMD 0.003 OHM 0.5% 3W 3637

• Resistance: 3 mOhms
• Tolerance: ±0.5%
• Power (Watts): 3W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±5ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 3637
• Supplier Device Package: 3637
• Size / Dimension: 0.360" L x 0.370" W (9.14mm x 9.40mm)
• Height - Seated (Max): 0.035" (0.89mm)
• Number of Terminations: 4
• Failure Rate: -

RES SMD 5 OHM 1% 1/2W 2010

• Resistance: 5 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 50 OHM 1% 1/2W 2010

• Resistance: 50 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.32K OHM 1% 1/2W 2010

• Resistance: 3.32 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.2K OHM 1% 1/2W 2010

• Resistance: 3.2 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.01K OHM 1% 1/2W 2010

• Resistance: 3.01 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 33 OHM 1% 1/2W 2010

• Resistance: 33 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 31 OHM 1% 1/2W 2010

• Resistance: 31 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.9K OHM 1% 1/2W 2010

• Resistance: 2.9 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2K OHM 1% 1/2W 2010

• Resistance: 2 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 27 OHM 1% 1/2W 2010

• Resistance: 27 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 25 OHM 1% 1/2W 2010

• Resistance: 25 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -