Vishay Foil Resistors (Division of Vishay Precision Group) Products - Chip Resistor - Surface Mount

RES SMD 28K OHM 0.16W J LEAD

• Resistance: 28 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 21.5K OHM 0.16W J LEAD

• Resistance: 21.5 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 21.5K OHM 0.16W J LEAD

• Resistance: 21.5 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 19.6K OHM 0.16W J LEAD

• Resistance: 19.6 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 19K OHM 0.16W J LEAD

• Resistance: 19 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 18.7K OHM 0.16W J LEAD

• Resistance: 18.7 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 13.3K OHM 0.16W J LEAD

• Resistance: 13.3 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 13.3K OHM 0.16W J LEAD

• Resistance: 13.3 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 12.67K OHM 0.16W J LEAD

• Resistance: 12.67 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 12.5K OHM 0.16W J LEAD

• Resistance: 12.5 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 12.5K OHM 0.16W J LEAD

• Resistance: 12.5 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 11K OHM 0.16W J LEAD

• Resistance: 11 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 10K OHM 0.16W J LEAD

• Resistance: 10 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1K OHM 0.1% 0.0125W 0603

• Resistance: 1 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.0125W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±3ppm/°C
• Operating Temperature: -55°C ~ 220°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.032" W (1.60mm x 0.81mm)
• Height - Seated (Max): 0.023" (0.58mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 100OHM 0.1% 0.0125W 0603

• Resistance: 100 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.0125W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±3ppm/°C
• Operating Temperature: -55°C ~ 220°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.032" W (1.60mm x 0.81mm)
• Height - Seated (Max): 0.023" (0.58mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 20 OHM 0.25% 1/2W 2010

• Resistance: 20 Ohms
• Tolerance: ±0.25%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 16.97OHM 0.25% 1/2W 2010

• Resistance: 16.97 Ohms
• Tolerance: ±0.25%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 13 OHM 0.25% 1/2W 2010

• Resistance: 13 Ohms
• Tolerance: ±0.25%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 120OHM 0.01% 1/4W J LEAD

• Resistance: 120 Ohms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: -
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 5K OHM 0.01% 1/4W J LEAD

• Resistance: 5 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 50 OHM 0.01% 1/4W J LEAD

• Resistance: 50 Ohms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 432OHM 0.01% 1/4W J LEAD

• Resistance: 432 Ohms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.83K OHM 1/4W J LEAD

• Resistance: 3.83 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.83K OHM 1/4W J LEAD

• Resistance: 3.83 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.3K OHM 1/4W J LEAD

• Resistance: 3.3 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.8K OHM 1/4W J LEAD

• Resistance: 2.8 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.4K OHM 1/4W J LEAD

• Resistance: 2.4 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 25K OHM 0.16W J LEAD

• Resistance: 25 kOhms
• Tolerance: ±0.02%
• Power (Watts): 0.16W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 2512 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.236" L x 0.126" W (5.99mm x 3.20mm)
• Height - Seated (Max): 0.110" (2.79mm)
• Number of Terminations: 2
• Failure Rate: -