Vishay Foil Resistors (Division of Vishay Precision Group) Products - Chip Resistor - Surface Mount

RES SMD 5K OHM 0.1% 1/2W 2010

• Resistance: 5 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 120 OHM 0.02% 1/5W 0805

• Resistance: 120 Ohms
• Tolerance: ±0.02%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1K OHM 0.02% 1/5W 0805

• Resistance: 1 kOhms
• Tolerance: ±0.02%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 80K OHM 1% 0.4W J LEAD

• Resistance: 80 kOhms
• Tolerance: ±1%
• Power (Watts): 0.4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 3017 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.287" L x 0.170" W (7.29mm x 4.32mm)
• Height - Seated (Max): 0.122" (3.10mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 80K OHM 1% 0.4W J LEAD

• Resistance: 80 kOhms
• Tolerance: ±1%
• Power (Watts): 0.4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 3017 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.287" L x 0.170" W (7.29mm x 4.32mm)
• Height - Seated (Max): 0.122" (3.10mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 50 OHM 0.05% 0.3W 2010

• Resistance: 50 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.3W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 75K OHM 0.5% 0.4W J LEAD

• Resistance: 75 kOhms
• Tolerance: ±0.5%
• Power (Watts): 0.4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 3017 J-Lead
• Supplier Device Package: SMD, Stand Off
• Size / Dimension: 0.287" L x 0.170" W (7.29mm x 4.32mm)
• Height - Seated (Max): 0.122" (3.10mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 0.01 OHM 0.1% 5W 3637

• Resistance: 10 mOhms
• Tolerance: ±0.1%
• Power (Watts): 5W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 3637
• Supplier Device Package: 3637
• Size / Dimension: 0.360" L x 0.370" W (9.14mm x 9.40mm)
• Height - Seated (Max): 0.060" (1.52mm)
• Number of Terminations: 4
• Failure Rate: -

RES SMD 0.005 OHM 0.1% 5W 3637

• Resistance: 5 mOhms
• Tolerance: ±0.1%
• Power (Watts): 5W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 3637
• Supplier Device Package: 3637
• Size / Dimension: 0.360" L x 0.370" W (9.14mm x 9.40mm)
• Height - Seated (Max): 0.060" (1.52mm)
• Number of Terminations: 4
• Failure Rate: -

RES SMD 0.01 OHM 0.1% 5W 3637

• Resistance: 10 mOhms
• Tolerance: ±0.1%
• Power (Watts): 5W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 3637
• Supplier Device Package: -
• Size / Dimension: 0.360" L x 0.370" W (9.14mm x 9.40mm)
• Height - Seated (Max): 0.060" (1.52mm)
• Number of Terminations: 4
• Failure Rate: -

RES SMD 0.009 OHM 0.1% 5W 3637

• Resistance: 9 mOhms
• Tolerance: ±0.1%
• Power (Watts): 5W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 3637
• Supplier Device Package: -
• Size / Dimension: 0.360" L x 0.370" W (9.14mm x 9.40mm)
• Height - Seated (Max): 0.060" (1.52mm)
• Number of Terminations: 4
• Failure Rate: -

RES SMD 0.008 OHM 0.1% 5W 3637

• Resistance: 8 mOhms
• Tolerance: ±0.1%
• Power (Watts): 5W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 3637
• Supplier Device Package: -
• Size / Dimension: 0.360" L x 0.370" W (9.14mm x 9.40mm)
• Height - Seated (Max): 0.060" (1.52mm)
• Number of Terminations: 4
• Failure Rate: -

RES SMD 21.5K OHM 1/32W 1206

• Resistance: 21.5 kOhms
• Tolerance: ±0.02%
• Power (Watts): 0.03W, 1/32W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 220°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.126" L x 0.062" W (3.20mm x 1.57mm)
• Height - Seated (Max): 0.023" (0.58mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 11.5K OHM 1/32W 1206

• Resistance: 11.5 kOhms
• Tolerance: ±0.02%
• Power (Watts): 0.03W, 1/32W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 220°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.126" L x 0.062" W (3.20mm x 1.57mm)
• Height - Seated (Max): 0.023" (0.58mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 68.1 OHM 1% 1/2W 2010

• Resistance: 68.1 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 68.1 OHM 1% 1/2W 2010

• Resistance: 68.1 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 46.4 OHM 1% 1/2W 2010

• Resistance: 46.4 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 46.4 OHM 1% 1/2W 2010

• Resistance: 46.4 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 31.6 OHM 1% 1/2W 2010

• Resistance: 31.6 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 31.6 OHM 1% 1/2W 2010

• Resistance: 31.6 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 26.1 OHM 1% 1/2W 2010

• Resistance: 26.1 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 21.5 OHM 1% 1/2W 2010

• Resistance: 21.5 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 21.5 OHM 1% 1/2W 2010

• Resistance: 21.5 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 178 OHM 1% 1/2W 2010

• Resistance: 178 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 178 OHM 1% 1/2W 2010

• Resistance: 178 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 10 OHM 1% 1/2W 2010

• Resistance: 10 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 10 OHM 1% 1/2W 2010

• Resistance: 10 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 100 OHM 1% 1/2W 2010

• Resistance: 100 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -