Vishay Foil Resistors (Division of Vishay Precision Group) Products - Chip Resistor - Surface Mount

RES SMD 1.58KOHM 0.01% 0.3W 2010

• Resistance: 1.58 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.3W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1K OHM 0.01% 0.3W 2010

• Resistance: 1 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.3W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1K OHM 0.01% 0.3W 2010

• Resistance: 1 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.3W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 10K OHM 0.01% 0.3W 2010

• Resistance: 10 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.3W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 10K OHM 0.01% 0.3W 2010

• Resistance: 10 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.3W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 56KOHM 0.05% 0.4W J LEAD

• Resistance: 56 kOhms
• Tolerance: ±0.05%
• Power (Watts): 0.4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive, Pulse Withstanding
• Temperature Coefficient: ±2ppm/°C
• Operating Temperature: -55°C ~ 175°C
• Package / Case: 3017 J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.287" L x 0.170" W (7.29mm x 4.32mm)
• Height - Seated (Max): 0.122" (3.10mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 500 OHM 1% 3/4W 2512

• Resistance: 500 Ohms
• Tolerance: ±1%
• Power (Watts): 0.75W, 3/4W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.249" L x 0.127" W (6.32mm x 3.23mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 5.62KOHM 0.01% 1/5W 0805

• Resistance: 5.62 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.21KOHM 0.01% 1/5W 0805

• Resistance: 2.21 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.2W, 1/5W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 88.7 OHM 0.05% 1/2W 2010

• Resistance: 88.7 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 825 OHM 0.05% 1/2W 2010

• Resistance: 825 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 71.43OHM 0.05% 1/2W 2010

• Resistance: 71.43 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 71.37OHM 0.05% 1/2W 2010

• Resistance: 71.37 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 54.34OHM 0.05% 1/2W 2010

• Resistance: 54.34 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 50 OHM 0.05% 1/2W 2010

• Resistance: 50 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 4.99KOHM 0.05% 1/2W 2010

• Resistance: 4.99 kOhms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 208.33 OHM 1/2W 2010

• Resistance: 208.33 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1.58KOHM 0.05% 1/2W 2010

• Resistance: 1.58 kOhms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1.5K OHM 0.05% 1/2W 2010

• Resistance: 1.5 kOhms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1.1K OHM 0.05% 1/2W 2010

• Resistance: 1.1 kOhms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 125 OHM 0.05% 1/2W 2010

• Resistance: 125 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 100 OHM 0.05% 1/2W 2010

• Resistance: 100 Ohms
• Tolerance: ±0.05%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.198" L x 0.097" W (5.03mm x 2.46mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 75K OHM 0.01% 0.6W 2512

• Resistance: 75 kOhms
• Tolerance: ±0.01%
• Power (Watts): 0.6W
• Composition: Metal Foil
• Features: Anti-Sulfur, Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±0.2ppm/°C
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.250" L x 0.126" W (6.35mm x 3.20mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.5K OHM 0.02% 0.3W 0805

• Resistance: 2.5 kOhms
• Tolerance: ±0.02%
• Power (Watts): 0.3W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 225°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.21KOHM 0.02% 0.3W 0805

• Resistance: 2.21 kOhms
• Tolerance: ±0.02%
• Power (Watts): 0.3W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 225°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.080" L x 0.050" W (2.03mm x 1.27mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1K OHM 1% 0.15W 2512

• Resistance: 1 kOhms
• Tolerance: ±1%
• Power (Watts): 0.15W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±3ppm/°C
• Operating Temperature: -55°C ~ 220°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.250" L x 0.126" W (6.35mm x 3.20mm)
• Height - Seated (Max): 0.023" (0.58mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 20K OHM 1% 1.2W 2512

• Resistance: 20 kOhms
• Tolerance: ±1%
• Power (Watts): 1.2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 225°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.249" L x 0.127" W (6.32mm x 3.23mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1.74K OHM 1% 1.2W 2512

• Resistance: 1.74 kOhms
• Tolerance: ±1%
• Power (Watts): 1.2W
• Composition: Metal Foil
• Features: Moisture Resistant, Non-Inductive
• Temperature Coefficient: ±2.5ppm/°C
• Operating Temperature: -55°C ~ 225°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.249" L x 0.127" W (6.32mm x 3.23mm)
• Height - Seated (Max): 0.025" (0.64mm)
• Number of Terminations: 2
• Failure Rate: -