Page 166 - Xilinx Inc. Products - Embedded - FPGAs (Field Programmable Gate Array)

XC4062XL-3BG432C
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

Package: 432-LBGA, Metal

Stock5,376
XC4062XL-2HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Package: 304-BFQFP Exposed Pad

Stock2,100
XC4062XL-2HQ304C
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Package: 304-BFQFP Exposed Pad

Stock6,128
XC4062XL-2HQ240I
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock3,808
XC4062XL-2HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock6,016
XC4062XL-2BG560I
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

Package: 560-LBGA, Metal

Stock4,288
XC4062XL-2BG560C
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

Package: 560-LBGA, Metal

Stock5,536
XC4062XL-2BG432I
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

Package: 432-LBGA, Metal

Stock5,776
XC4062XL-2BG432C
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

Package: 432-LBGA, Metal

Stock4,496
XC4062XL-1HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Package: 304-BFQFP Exposed Pad

Stock3,680
XC4062XL-1HQ304C
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Package: 304-BFQFP Exposed Pad

Stock3,984
XC4062XL-1HQ240I
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock3,008
XC4062XL-1HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock4,640
XC4062XL-1BG560I
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

Package: 560-LBGA, Metal

Stock2,416
XC4062XL-1BG560C
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

Package: 560-LBGA, Metal

Stock2,928
XC4062XL-1BG432I
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

Package: 432-LBGA, Metal

Stock2,192
XC4062XL-1BG432C
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

Package: 432-LBGA, Metal

Stock5,232
XC4062XL-09HQ304C
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Package: 304-BFQFP Exposed Pad

Stock4,496
XC4062XL-09HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock5,072
XC4062XL-09BG560C
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

Package: 560-LBGA, Metal

Stock2,000

Part Number	Manufacturer	Description	Package	Stock	Number of Logic Elements/Cells	Total RAM Bits	Number of I/O	Number of Gates	Voltage - Supply	Mounting Type	Operating Temperature	Package / Case	Supplier Device Package
XC4062XL-3BG432C	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 352 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock5,376	5472	73728	352	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XC4062XL-2HQ304I	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 256 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock2,100	5472	73728	256	62000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	304-BFQFP Exposed Pad	304-PQFP (40x40)
XC4062XL-2HQ304C	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 256 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock6,128	5472	73728	256	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	304-BFQFP Exposed Pad	304-PQFP (40x40)
XC4062XL-2HQ240I	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 193 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock3,808	5472	73728	193	62000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XC4062XL-2HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 193 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock6,016	5472	73728	193	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XC4062XL-2BG560I	Xilinx Inc.	IC FPGA 384 I/O 560MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 384 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock4,288	5472	73728	384	62000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XC4062XL-2BG560C	Xilinx Inc.	IC FPGA 384 I/O 560MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 384 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock5,536	5472	73728	384	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XC4062XL-2BG432I	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 352 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock5,776	5472	73728	352	62000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XC4062XL-2BG432C	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 352 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock4,496	5472	73728	352	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XC4062XL-1HQ304I	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 256 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock3,680	5472	73728	256	62000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	304-BFQFP Exposed Pad	304-PQFP (40x40)
XC4062XL-1HQ304C	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 256 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock3,984	5472	73728	256	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	304-BFQFP Exposed Pad	304-PQFP (40x40)
XC4062XL-1HQ240I	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 193 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock3,008	5472	73728	193	62000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XC4062XL-1HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 193 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock4,640	5472	73728	193	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XC4062XL-1BG560I	Xilinx Inc.	IC FPGA 384 I/O 560MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 384 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock2,416	5472	73728	384	62000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XC4062XL-1BG560C	Xilinx Inc.	IC FPGA 384 I/O 560MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 384 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock2,928	5472	73728	384	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XC4062XL-1BG432I	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 352 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock2,192	5472	73728	352	62000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XC4062XL-1BG432C	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 352 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock5,232	5472	73728	352	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XC4062XL-09HQ304C	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 256 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock4,496	5472	73728	256	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	304-BFQFP Exposed Pad	304-PQFP (40x40)
XC4062XL-09HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 193 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock5,072	5472	73728	193	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XC4062XL-09BG560C	Xilinx Inc.	IC FPGA 384 I/O 560MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 384 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock2,000	5472	73728	384	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XC4062XL-09BG432C	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 352 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock6,736	5472	73728	352	62000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XC4052XL-3HQ304I	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 256 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock6,016	4598	61952	256	52000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	304-BFQFP Exposed Pad	304-PQFP (40x40)
XC4052XL-3HQ304C	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 256 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock7,360	4598	61952	256	52000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	304-BFQFP Exposed Pad	304-PQFP (40x40)
XC4052XL-3HQ240I	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 193 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock3,952	4598	61952	193	52000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XC4052XL-3HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 193 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock4,864	4598	61952	193	52000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XC4052XL-3BG560I	Xilinx Inc.	IC FPGA 352 I/O 560MBGA Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 352 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock6,000	4598	61952	352	52000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XC4052XL-3BG560C	Xilinx Inc.	IC FPGA 352 I/O 560MBGA Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 352 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock2,240	4598	61952	352	52000	3 V ~ 3.6 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XC4052XL-3BG432I	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 352 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock7,424	4598	61952	352	52000	3 V ~ 3.6 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)