Page 174 - Xilinx Inc. Products - Embedded - FPGAs (Field Programmable Gate Array)

XCV1600E-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock5,456
XCV1600E-6FG1156I
Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

Package: 1156-BBGA

Stock7,824
XCV1600E-6FG1156C
Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

Package: 1156-BBGA

Stock5,520
XCV1600E-6BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock4,912
XCV1600E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock8,676
XCV150-6PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

Package: 240-BFQFP

Stock4,016
XCV150-6FG456C
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

Package: 456-BBGA

Stock5,648
XCV150-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Package: 256-BGA

Stock5,712
XCV150-6BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Package: 352-LBGA, Metal

Stock20,940
XCV150-6BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

Package: 256-BBGA

Stock4,736
XCV150-5PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

Package: 240-BFQFP

Stock12,756
XCV150-5PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

Package: 240-BFQFP

Stock3,696
XCV150-5FG456I
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

Package: 456-BBGA

Stock4,736
XCV150-5FG456C
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

Package: 456-BBGA

Stock2,048
XCV150-5FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Package: 256-BGA

Stock3,968
XCV150-5FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Package: 256-BGA

Stock3,344
XCV150-5BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Package: 352-LBGA, Metal

Stock3,968
XCV150-5BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Package: 352-LBGA, Metal

Stock30,372
XCV150-5BG256I
Xilinx Inc.

IC FPGA 180 I/O 256BGA

Package: 256-BBGA

Stock31,392
XCV150-5BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

Package: 256-BBGA

Stock2,336

Part Number	Manufacturer	Description	Package	Stock	Number of Logic Elements/Cells	Total RAM Bits	Number of I/O	Number of Gates	Voltage - Supply	Mounting Type	Operating Temperature	Package / Case	Supplier Device Package
XCV1600E-6FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 512 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock5,456	34992	589824	512	2188742	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV1600E-6FG1156I	Xilinx Inc.	IC FPGA 724 I/O 1156FBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 724 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA Supplier Device Package: 1156-FBGA (35x35)	Package: 1156-BBGA	Stock7,824	34992	589824	724	2188742	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	1156-BBGA	1156-FBGA (35x35)
XCV1600E-6FG1156C	Xilinx Inc.	IC FPGA 724 I/O 1156FBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 724 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA Supplier Device Package: 1156-FBGA (35x35)	Package: 1156-BBGA	Stock5,520	34992	589824	724	2188742	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	1156-BBGA	1156-FBGA (35x35)
XCV1600E-6BG560I	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 404 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock4,912	34992	589824	404	2188742	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV1600E-6BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 404 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock8,676	34992	589824	404	2188742	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV150-6PQ240C	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 166 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock4,016	3888	49152	166	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV150-6FG456C	Xilinx Inc.	IC FPGA 260 I/O 456FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock5,648	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV150-6FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 176 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock5,712	3888	49152	176	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	256-BGA	256-FBGA (17x17)
XCV150-6BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock20,940	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	352-LBGA, Metal	352-MBGA (35x35)
XCV150-6BG256C	Xilinx Inc.	IC FPGA 180 I/O 256BGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 180 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	Package: 256-BBGA	Stock4,736	3888	49152	180	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	256-BBGA	256-PBGA (27x27)
XCV150-5PQ240I	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 166 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock12,756	3888	49152	166	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV150-5PQ240C	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 166 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock3,696	3888	49152	166	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV150-5FG456I	Xilinx Inc.	IC FPGA 260 I/O 456FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock4,736	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV150-5FG456C	Xilinx Inc.	IC FPGA 260 I/O 456FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock2,048	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV150-5FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 176 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock3,968	3888	49152	176	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	256-BGA	256-FBGA (17x17)
XCV150-5FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 176 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock3,344	3888	49152	176	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	256-BGA	256-FBGA (17x17)
XCV150-5BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock3,968	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	352-LBGA, Metal	352-MBGA (35x35)
XCV150-5BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock30,372	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	352-LBGA, Metal	352-MBGA (35x35)
XCV150-5BG256I	Xilinx Inc.	IC FPGA 180 I/O 256BGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 180 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	Package: 256-BBGA	Stock31,392	3888	49152	180	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	256-BBGA	256-PBGA (27x27)
XCV150-5BG256C	Xilinx Inc.	IC FPGA 180 I/O 256BGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 180 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	Package: 256-BBGA	Stock2,336	3888	49152	180	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	256-BBGA	256-PBGA (27x27)
XCV150-4PQ240I	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 166 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock7,896	3888	49152	166	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV150-4PQ240C	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 166 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock6,848	3888	49152	166	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV150-4FG456I	Xilinx Inc.	IC FPGA 260 I/O 456FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock4,752	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV150-4FG456C	Xilinx Inc.	IC FPGA 260 I/O 456FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock4,880	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV150-4FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 176 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock7,952	3888	49152	176	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	256-BGA	256-FBGA (17x17)
XCV150-4FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 176 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock3,584	3888	49152	176	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	256-BGA	256-FBGA (17x17)
XCV150-4BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock5,776	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	352-LBGA, Metal	352-MBGA (35x35)
XCV150-4BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock17,124	3888	49152	260	164674	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	352-LBGA, Metal	352-MBGA (35x35)