Page 2 - Xilinx Inc. Products - Embedded - FPGAs (Field Programmable Gate Array)

XCKU5P-3FFVD900E
Xilinx Inc.

XCKU5P-3FFVD900E

Package: 900-BBGA, FCBGA

Stock5,040
XCKU11P-1FFVD900I
Xilinx Inc.

XCKU11P-1FFVD900I

Package: 900-BBGA, FCBGA

Stock4,400
XCKU11P-1FFVA1156E
Xilinx Inc.

XCKU11P-1FFVA1156E

Package: 1156-BBGA, FCBGA

Stock5,328
XCKU5P-L2FFVD900E
Xilinx Inc.

XCKU5P-L2FFVD900E

Package: 900-BBGA, FCBGA

Stock6,144
XCKU5P-3SFVB784E
Xilinx Inc.

XCKU5P-3SFVB784E

Package: 784-BBGA, FCBGA

Stock4,768
XCKU5P-L2FFVB676E
Xilinx Inc.

XCKU5P-L2FFVB676E

Package: 676-BBGA, FCBGA

Stock5,136
XCKU5P-L2FFVA676E
Xilinx Inc.

XCKU5P-L2FFVA676E

Package: 676-BBGA, FCBGA

Stock7,040
XCKU11P-1FFVD900E
Xilinx Inc.

XCKU11P-1FFVD900E

Package: 900-BBGA, FCBGA

Stock3,184
XCKU5P-L2SFVB784E
Xilinx Inc.

XCKU5P-L2SFVB784E

Package: 784-BBGA, FCBGA

Stock3,600
XCKU5P-L1FFVD900I
Xilinx Inc.

XCKU5P-L1FFVD900I

Package: 900-BBGA, FCBGA

Stock4,944
XCKU3P-3FFVD900E
Xilinx Inc.

XCKU3P-3FFVD900E

Package: 900-BBGA, FCBGA

Stock5,232
XCKU3P-3FFVB676E
Xilinx Inc.

XCKU3P-3FFVB676E

Package: 676-BBGA, FCBGA

Stock7,968
XCKU5P-L1SFVB784I
Xilinx Inc.

XCKU5P-L1SFVB784I

Package: 784-BBGA, FCBGA

Stock4,800
XCKU3P-3FFVA676E
Xilinx Inc.

XCKU3P-3FFVA676E

Package: 676-BBGA, FCBGA

Stock2,704
XCKU3P-L2FFVB676E
Xilinx Inc.

XCKU3P-L2FFVB676E

Package: 676-BBGA, FCBGA

Stock5,424
XCKU3P-3SFVB784E
Xilinx Inc.

XCKU3P-3SFVB784E

Package: 784-BBGA, FCBGA

Stock5,888
XCKU3P-L2FFVD900E
Xilinx Inc.

XCKU3P-L2FFVD900E

Package: 900-BBGA, FCBGA

Stock3,680
XC7K355T-1FF901C
Xilinx Inc.

IC FPGA 300 I/O 901FCBGA

Package: 900-BBGA, FCBGA

Stock3,824
XCKU3P-L2FFVA676E
Xilinx Inc.

XCKU3P-L2FFVA676E

Package: 676-BBGA, FCBGA

Stock5,888
XCKU3P-L2SFVB784E
Xilinx Inc.

XCKU3P-L2SFVB784E

Package: 784-BBGA, FCBGA

Stock7,248

Part Number	Manufacturer	Description	Package	Stock	Number of Logic Elements/Cells	Total RAM Bits	Number of I/O	Number of Gates	Voltage - Supply	Mounting Type	Operating Temperature	Package / Case	Supplier Device Package
XCKU5P-3FFVD900E	Xilinx Inc.	XCKU5P-3FFVD900E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock5,040	355950	31641600	304	-	0.873 V ~ 0.927 V	Surface Mount	0°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCKU11P-1FFVD900I	Xilinx Inc.	XCKU11P-1FFVD900I Number of LABs/CLBs: 37320 Number of Logic Elements/Cells: 653100 Total RAM Bits: 53964800 Number of I/O: 408 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock4,400	653100	53964800	408	-	0.825 V ~ 0.876 V	Surface Mount	-40°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCKU11P-1FFVA1156E	Xilinx Inc.	XCKU11P-1FFVA1156E Number of LABs/CLBs: 37320 Number of Logic Elements/Cells: 653100 Total RAM Bits: 53964800 Number of I/O: 464 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock5,328	653100	53964800	464	-	0.825 V ~ 0.876 V	Surface Mount	0°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)
XCKU5P-L2FFVD900E	Xilinx Inc.	XCKU5P-L2FFVD900E Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 41984000 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock6,144	474600	41984000	304	-	0.698 V ~ 0.876 V	Surface Mount	0°C ~ 110°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCKU5P-3SFVB784E	Xilinx Inc.	XCKU5P-3SFVB784E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock4,768	355950	31641600	304	-	0.873 V ~ 0.927 V	Surface Mount	0°C ~ 100°C (TJ)	784-BBGA, FCBGA	784-FCBGA (23x23)
XCKU5P-L2FFVB676E	Xilinx Inc.	XCKU5P-L2FFVB676E Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 41984000 Number of I/O: 280 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,136	474600	41984000	280	-	0.698 V ~ 0.876 V	Surface Mount	0°C ~ 110°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCKU5P-L2FFVA676E	Xilinx Inc.	XCKU5P-L2FFVA676E Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 41984000 Number of I/O: 256 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock7,040	474600	41984000	256	-	0.698 V ~ 0.876 V	Surface Mount	0°C ~ 110°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCKU11P-1FFVD900E	Xilinx Inc.	XCKU11P-1FFVD900E Number of LABs/CLBs: 37320 Number of Logic Elements/Cells: 653100 Total RAM Bits: 53964800 Number of I/O: 408 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock3,184	653100	53964800	408	-	0.825 V ~ 0.876 V	Surface Mount	0°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCKU5P-L2SFVB784E	Xilinx Inc.	XCKU5P-L2SFVB784E Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 41984000 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock3,600	474600	41984000	304	-	0.698 V ~ 0.876 V	Surface Mount	0°C ~ 110°C (TJ)	784-BBGA, FCBGA	784-FCBGA (23x23)
XCKU5P-L1FFVD900I	Xilinx Inc.	XCKU5P-L1FFVD900I Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 41984000 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock4,944	474600	41984000	304	-	0.698 V ~ 0.876 V	Surface Mount	-40°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCKU3P-3FFVD900E	Xilinx Inc.	XCKU3P-3FFVD900E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock5,232	355950	31641600	304	-	0.873 V ~ 0.927 V	Surface Mount	0°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCKU3P-3FFVB676E	Xilinx Inc.	XCKU3P-3FFVB676E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 280 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock7,968	355950	31641600	280	-	0.873 V ~ 0.927 V	Surface Mount	0°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCKU5P-L1SFVB784I	Xilinx Inc.	XCKU5P-L1SFVB784I Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 41984000 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock4,800	474600	41984000	304	-	0.698 V ~ 0.876 V	Surface Mount	-40°C ~ 100°C (TJ)	784-BBGA, FCBGA	784-FCBGA (23x23)
XCKU3P-3FFVA676E	Xilinx Inc.	XCKU3P-3FFVA676E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 256 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock2,704	355950	31641600	256	-	0.873 V ~ 0.927 V	Surface Mount	0°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCKU3P-L2FFVB676E	Xilinx Inc.	XCKU3P-L2FFVB676E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 280 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,424	355950	31641600	280	-	0.698 V ~ 0.876 V	Surface Mount	0°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCKU3P-3SFVB784E	Xilinx Inc.	XCKU3P-3SFVB784E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock5,888	355950	31641600	304	-	0.873 V ~ 0.927 V	Surface Mount	0°C ~ 100°C (TJ)	784-BBGA, FCBGA	784-FCBGA (23x23)
XCKU3P-L2FFVD900E	Xilinx Inc.	XCKU3P-L2FFVD900E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock3,680	355950	31641600	304	-	0.698 V ~ 0.876 V	Surface Mount	0°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XC7K355T-1FF901C	Xilinx Inc.	IC FPGA 300 I/O 901FCBGA Number of LABs/CLBs: 27825 Number of Logic Elements/Cells: 356160 Total RAM Bits: 26357760 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C Package / Case: 900-BBGA, FCBGA Supplier Device Package: 901-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock3,824	356160	26357760	300	-	0.97 V ~ 1.03 V	Surface Mount	0°C ~ 85°C	900-BBGA, FCBGA	901-FCBGA (31x31)
XCKU3P-L2FFVA676E	Xilinx Inc.	XCKU3P-L2FFVA676E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 256 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,888	355950	31641600	256	-	0.698 V ~ 0.876 V	Surface Mount	0°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCKU3P-L2SFVB784E	Xilinx Inc.	XCKU3P-L2SFVB784E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 256 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock7,248	355950	31641600	256	-	0.698 V ~ 0.876 V	Surface Mount	0°C ~ 100°C (TJ)	784-BBGA, FCBGA	784-FCBGA (23x23)
XCKU3P-L1FFVD900I	Xilinx Inc.	XCKU3P-L1FFVD900I Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock7,952	355950	31641600	304	-	0.698 V ~ 0.876 V	Surface Mount	-40°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCKU3P-L1FFVB676I	Xilinx Inc.	XCKU3P-L1FFVB676I Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 280 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock2,336	355950	31641600	280	-	0.698 V ~ 0.876 V	Surface Mount	-40°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCKU3P-L1FFVA676I	Xilinx Inc.	XCKU3P-L1FFVA676I Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 256 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock2,048	355950	31641600	256	-	0.698 V ~ 0.876 V	Surface Mount	-40°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCKU3P-L1SFVB784I	Xilinx Inc.	XCKU3P-L1SFVB784I Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 256 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock3,872	355950	31641600	256	-	0.698 V ~ 0.876 V	Surface Mount	-40°C ~ 100°C (TJ)	784-BBGA, FCBGA	784-FCBGA (23x23)
XCKU035-L1SFVA784I	Xilinx Inc.	IC FPGA Number of LABs/CLBs: 25391 Number of Logic Elements/Cells: 444343 Total RAM Bits: 19456000 Number of I/O: 468 Number of Gates: - Voltage - Supply: 0.880 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCCSPBGA (23x23)	Package: 784-BBGA, FCBGA	Stock2,352	444343	19456000	468	-	0.880 V ~ 0.979 V	Surface Mount	-40°C ~ 100°C (TJ)	784-BBGA, FCBGA	784-FCCSPBGA (23x23)
XCDAISY-FF1924	Xilinx Inc.	XCDAISY-FF1924 Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,936	-	-	-	-	-	-	-	-	-
XCDAISY-FF1738	Xilinx Inc.	CONNECT EBOM Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,920	-	-	-	-	-	-	-	-	-
XC2VP30-5FG676C	Xilinx Inc.	IC FPGA 30816 CLB 676BGA Number of LABs/CLBs: 3424 Number of Logic Elements/Cells: 30816 Total RAM Bits: 2506752 Number of I/O: 416 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	Package: 676-BGA	Stock5,200	30816	2506752	416	-	1.425 V ~ 1.575 V	Surface Mount	0°C ~ 85°C (TJ)	676-BGA	676-FBGA (27x27)