Page 100 - Xilinx Inc. Products | Heisener Electronics

XC1765ESO8C
Xilinx Inc.

IC PROM SERIAL CONFIG 65K 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock2,100
XCZU9EG-3FFVC900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Package: 900-BBGA, FCBGA

Stock4,592
XCZU5EV-2FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Package: 900-BBGA, FCBGA

Stock6,160
XCZU7EG-1FFVC1156I
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Package: 1156-BBGA, FCBGA

Stock2,160
XC2V500-4FGG256C
Xilinx Inc.

IC FPGA 172 I/O 256FBGA

Package: 256-BGA

Stock5,936
XCV50-4BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

Package: 256-BBGA

Stock5,632
XCV200E-7CS144I
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Package: 144-TFBGA, CSPBGA

Stock2,880
XCV200-6BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Package: 352-LBGA, Metal

Stock6,048
XCV100E-7CS144I
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Package: 144-TFBGA, CSPBGA

Stock6,880
XC4044XL-1HQ160C
Xilinx Inc.

IC FPGA 129 I/O 160HQFP

Package: 160-BQFP Exposed Pad

Stock3,184
XC4028XL-2HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Package: 304-BFQFP Exposed Pad

Stock2,928
XC4020XL-2PQ240C
Xilinx Inc.

IC FPGA 192 I/O 240QFP

Package: 240-BFQFP

Stock2,288
XC3090L-8PC84C
Xilinx Inc.

IC FPGA 70 I/O 84PLCC

Package: 84-LCC (J-Lead)

Stock68,400
XC3030A-7PC44C
Xilinx Inc.

IC FPGA 34 I/O 44PLCC

Package: 44-LCC (J-Lead)

Stock8,340
XCVU9P-2FLGC2104I
Xilinx Inc.

XCVU9P-2FLGC2104I

Package: -

Stock6,704
XC4VFX100-11FFG1517C
Xilinx Inc.

IC FPGA 768 I/O 1517FCBGA

Package: 1517-BBGA, FCBGA

Stock13,032
XC4VLX100-11FF1148C
Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

Package: 1148-BBGA, FCBGA

Stock4,864
XCKU035-2FBVA676I
Xilinx Inc.

IC FPGA 312 I/O 676FCBGA

Package: 676-BBGA, FCBGA

Stock7,120
XC2VP7-5FG456C
Xilinx Inc.

IC FPGA 248 I/O 456FBGA

Package: 456-BBGA

Stock4,208
XC6SLX100T-N3FG676I
Xilinx Inc.

IC FPGA 376 I/O 676FCBGA

Package: 676-BBGA, FCBGA

Stock2,240

Part Number	Manufacturer	Description	Package	Stock
XC1765ESO8C	Xilinx Inc.	IC PROM SERIAL CONFIG 65K 8-SOIC Programmable Type: OTP Memory Size: 65kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	Package: 8-SOIC (0.154", 3.90mm Width)	Stock2,100
XCZU9EG-3FFVC900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock4,592
XCZU5EV-2FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock6,160
XCZU7EG-1FFVC1156I	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock2,160
XC2V500-4FGG256C	Xilinx Inc.	IC FPGA 172 I/O 256FBGA Number of LABs/CLBs: 768 Number of Logic Elements/Cells: - Total RAM Bits: 589824 Number of I/O: 172 Number of Gates: 500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock5,936
XCV50-4BG256C	Xilinx Inc.	IC FPGA 180 I/O 256BGA Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 32768 Number of I/O: 180 Number of Gates: 57906 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	Package: 256-BBGA	Stock5,632
XCV200E-7CS144I	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 94 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	Package: 144-TFBGA, CSPBGA	Stock2,880
XCV200-6BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 260 Number of Gates: 236666 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock6,048
XCV100E-7CS144I	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 81920 Number of I/O: 94 Number of Gates: 128236 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	Package: 144-TFBGA, CSPBGA	Stock6,880
XC4044XL-1HQ160C	Xilinx Inc.	IC FPGA 129 I/O 160HQFP Number of LABs/CLBs: 1600 Number of Logic Elements/Cells: 3800 Total RAM Bits: 51200 Number of I/O: 129 Number of Gates: 44000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 160-BQFP Exposed Pad Supplier Device Package: 160-PQFP (28x28)	Package: 160-BQFP Exposed Pad	Stock3,184
XC4028XL-2HQ304I	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 1024 Number of Logic Elements/Cells: 2432 Total RAM Bits: 32768 Number of I/O: 256 Number of Gates: 28000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock2,928
XC4020XL-2PQ240C	Xilinx Inc.	IC FPGA 192 I/O 240QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 192 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP	Stock2,288
XC3090L-8PC84C	Xilinx Inc.	IC FPGA 70 I/O 84PLCC Number of LABs/CLBs: 320 Number of Logic Elements/Cells: - Total RAM Bits: 64160 Number of I/O: 70 Number of Gates: 6000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	Package: 84-LCC (J-Lead)	Stock68,400
XC3030A-7PC44C	Xilinx Inc.	IC FPGA 34 I/O 44PLCC Number of LABs/CLBs: 100 Number of Logic Elements/Cells: - Total RAM Bits: 22176 Number of I/O: 34 Number of Gates: 2000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock8,340
XCVU9P-2FLGC2104I	Xilinx Inc.	XCVU9P-2FLGC2104I Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Total RAM Bits: 354201600 Number of I/O: 416 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: - Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock6,704
XC4VFX100-11FFG1517C	Xilinx Inc.	IC FPGA 768 I/O 1517FCBGA Number of LABs/CLBs: 10544 Number of Logic Elements/Cells: 94896 Total RAM Bits: 6930432 Number of I/O: 768 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock13,032
XC4VLX100-11FF1148C	Xilinx Inc.	IC FPGA 768 I/O 1148FCBGA Number of LABs/CLBs: 12288 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4423680 Number of I/O: 768 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	Package: 1148-BBGA, FCBGA	Stock4,864
XCKU035-2FBVA676I	Xilinx Inc.	IC FPGA 312 I/O 676FCBGA Number of LABs/CLBs: 25391 Number of Logic Elements/Cells: 444343 Total RAM Bits: 19456000 Number of I/O: 312 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock7,120
XC2VP7-5FG456C	Xilinx Inc.	IC FPGA 248 I/O 456FBGA Number of LABs/CLBs: 1232 Number of Logic Elements/Cells: 11088 Total RAM Bits: 811008 Number of I/O: 248 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	Package: 456-BBGA	Stock4,208
XC6SLX100T-N3FG676I	Xilinx Inc.	IC FPGA 376 I/O 676FCBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 376 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock2,240
XC3S1600E-5FGG484C	Xilinx Inc.	IC FPGA 376 I/O 484FBGA Number of LABs/CLBs: 3688 Number of Logic Elements/Cells: 33192 Total RAM Bits: 663552 Number of I/O: 376 Number of Gates: 1600000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock10,548
XC3S4000-5FG676C	Xilinx Inc.	IC FPGA 489 I/O 676FBGA Number of LABs/CLBs: 6912 Number of Logic Elements/Cells: 62208 Total RAM Bits: 1769472 Number of I/O: 489 Number of Gates: 4000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock11,112
XC3SD1800A-4FG676C	Xilinx Inc.	IC FPGA 519 I/O 676FBGA Number of LABs/CLBs: 4160 Number of Logic Elements/Cells: 37440 Total RAM Bits: 1548288 Number of I/O: 519 Number of Gates: 1800000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock3,840
XC7K325T-1FFG676C	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock6,480
XC9572-15PQ100C	Xilinx Inc.	IC CPLD 72MC 15NS 100QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 72 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	Package: 100-BQFP	Stock17,988
XC9536XL-7PC44C	Xilinx Inc.	IC CPLD 36MC 7.5NS 44PLCC Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock30,108
XC2C64A-5QFG48C	Xilinx Inc.	IC CPLD 64MC 4.6NS 48QFN Programmable Type: In System Programmable Delay Time tpd(1) Max: 4.6ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 37 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Package: 48-VFQFN Exposed Pad	Stock5,472
XC7S25-L1FTGB196I	Xilinx Inc.	XC7S25-L1FTGB196I Number of LABs/CLBs: 1825 Number of Logic Elements/Cells: 23360 Total RAM Bits: 1658880 Number of I/O: 100 Number of Gates: - Voltage - Supply: 0.92 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 196-LBGA, CSPBGA Supplier Device Package: 196-CSBGA (15x15)	Package: 196-LBGA, CSPBGA	Stock7,168