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Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
- Programmable Type: OTP
- Memory Size: 65kb
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 20-LCC (J-Lead)
- Supplier Device Package: 20-PLCC (9x9)
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Package: 20-LCC (J-Lead) |
Stock6,480 |
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Xilinx Inc. |
IC SOC CORTEX A-9 ZYNQ7 1156BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
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Package: 1156-BBGA, FCBGA |
Stock5,216 |
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Xilinx Inc. |
IC FPGA QPRO
- Number of LABs/CLBs: 576
- Number of Logic Elements/Cells: 1368
- Total RAM Bits: 18432
- Number of I/O: 192
- Number of Gates: 13000
- Voltage - Supply: 4.5 V ~ 5.5 V
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C (TC)
- Package / Case: 223-BCPGA
- Supplier Device Package: 223-CPGA (47.25x47.25)
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Package: 223-BCPGA |
Stock6,960 |
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Xilinx Inc. |
IC FPGA 396 I/O 676FBGA
- Number of LABs/CLBs: 11519
- Number of Logic Elements/Cells: 147443
- Total RAM Bits: 4939776
- Number of I/O: 396
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
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Package: 676-BGA |
Stock7,216 |
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Xilinx Inc. |
IC FPGA 376 I/O 676FBGA
- Number of LABs/CLBs: 7911
- Number of Logic Elements/Cells: 101261
- Total RAM Bits: 4939776
- Number of I/O: 376
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
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Package: 676-BGA |
Stock2,880 |
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Xilinx Inc. |
IC FPGA 624 I/O 896FCBGA
- Number of LABs/CLBs: 2688
- Number of Logic Elements/Cells: -
- Total RAM Bits: 1032192
- Number of I/O: 624
- Number of Gates: 2000000
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FCBGA (31x31)
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Package: 896-BBGA, FCBGA |
Stock2,176 |
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Xilinx Inc. |
IC FPGA 684 I/O 957FCBGA
- Number of LABs/CLBs: 8448
- Number of Logic Elements/Cells: -
- Total RAM Bits: 2654208
- Number of I/O: 684
- Number of Gates: 6000000
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 957-BBGA, FCBGA
- Supplier Device Package: 957-FCBGA (40x40)
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Package: 957-BBGA, FCBGA |
Stock4,672 |
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Xilinx Inc. |
IC FPGA 404 I/O 560MBGA
- Number of LABs/CLBs: 4704
- Number of Logic Elements/Cells: 21168
- Total RAM Bits: 1146880
- Number of I/O: 404
- Number of Gates: 254016
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 560-LBGA, Metal
- Supplier Device Package: 560-MBGA (42.5x42.5)
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Package: 560-LBGA, Metal |
Stock2,720 |
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Xilinx Inc. |
IC FPGA 129 I/O 160QFP
- Number of LABs/CLBs: 400
- Number of Logic Elements/Cells: 950
- Total RAM Bits: 12800
- Number of I/O: 129
- Number of Gates: 10000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
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Package: 160-BQFP |
Stock2,960 |
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Xilinx Inc. |
IC FPGA 77 I/O 100VQFP
- Number of LABs/CLBs: 196
- Number of Logic Elements/Cells: 466
- Total RAM Bits: 6272
- Number of I/O: 77
- Number of Gates: 5000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 100-TQFP
- Supplier Device Package: 100-VQFP (14x14)
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Package: 100-TQFP |
Stock5,168 |
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Xilinx Inc. |
IC FPGA 850 I/O 1761FCBGA
- Number of LABs/CLBs: 54150
- Number of Logic Elements/Cells: 693120
- Total RAM Bits: 54190080
- Number of I/O: 850
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1761-FCBGA (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock4,592 |
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Xilinx Inc. |
IC FPGA 680 I/O 1738FCBGA
- Number of LABs/CLBs: 12160
- Number of Logic Elements/Cells: 155648
- Total RAM Bits: 7815168
- Number of I/O: 680
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1738-BBGA, FCBGA
- Supplier Device Package: 1738-FCBGA (42.5x42.5)
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Package: 1738-BBGA, FCBGA |
Stock9,852 |
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Xilinx Inc. |
IC FPGA 400 I/O 1156FCBGA
- Number of LABs/CLBs: 37325
- Number of Logic Elements/Cells: 477760
- Total RAM Bits: 35205120
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
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Package: 1156-BBGA, FCBGA |
Stock7,704 |
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Xilinx Inc. |
IC FPGA 360 I/O 665FCBGA
- Number of LABs/CLBs: 5600
- Number of Logic Elements/Cells: 71680
- Total RAM Bits: 5455872
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 665-BBGA, FCBGA
- Supplier Device Package: 665-FCBGA (27x27)
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Package: 665-BBGA, FCBGA |
Stock6,976 |
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Xilinx Inc. |
IC FPGA 360 I/O 665FCBGA
- Number of LABs/CLBs: 4080
- Number of Logic Elements/Cells: 52224
- Total RAM Bits: 4866048
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 665-BBGA, FCBGA
- Supplier Device Package: 665-FCBGA (27x27)
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Package: 665-BBGA, FCBGA |
Stock6,112 |
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Xilinx Inc. |
IC FPGA 560 I/O 1153FCBGA
- Number of LABs/CLBs: 6480
- Number of Logic Elements/Cells: 82944
- Total RAM Bits: 3538944
- Number of I/O: 560
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1153-BBGA, FCBGA
- Supplier Device Package: 1153-FCBGA (35x35)
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Package: 1153-BBGA, FCBGA |
Stock7,200 |
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Xilinx Inc. |
IC FPGA 692 I/O 1152FCBGA
- Number of LABs/CLBs: 4848
- Number of Logic Elements/Cells: 43632
- Total RAM Bits: 3538944
- Number of I/O: 692
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock6,064 |
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Xilinx Inc. |
IC FPGA 352 I/O 672FCBGA
- Number of LABs/CLBs: 4656
- Number of Logic Elements/Cells: 41904
- Total RAM Bits: 2654208
- Number of I/O: 352
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FCBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock4,016 |
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Xilinx Inc. |
IC FPGA 633 I/O 900FBGA
- Number of LABs/CLBs: 8320
- Number of Logic Elements/Cells: 74880
- Total RAM Bits: 1916928
- Number of I/O: 633
- Number of Gates: 5000000
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 900-BBGA
- Supplier Device Package: 900-FBGA (31x31)
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Package: 900-BBGA |
Stock4,656 |
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Xilinx Inc. |
IC FPGA 204 I/O 672FCBGA
- Number of LABs/CLBs: 352
- Number of Logic Elements/Cells: 3168
- Total RAM Bits: 221184
- Number of I/O: 204
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FCBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock6,112 |
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Xilinx Inc. |
IC FPGA 260 I/O 456FBGA
- Number of LABs/CLBs: 864
- Number of Logic Elements/Cells: 3888
- Total RAM Bits: 49152
- Number of I/O: 260
- Number of Gates: 150000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 456-BBGA
- Supplier Device Package: 456-FBGA (23x23)
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Package: 456-BBGA |
Stock16,032 |
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Xilinx Inc. |
IC FPGA 195 I/O 256FTBGA
- Number of LABs/CLBs: 896
- Number of Logic Elements/Cells: 8064
- Total RAM Bits: 368640
- Number of I/O: 195
- Number of Gates: 400000
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FTBGA (17x17)
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Package: 256-LBGA |
Stock6,368 |
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Xilinx Inc. |
IC CPLD 384MC 9NS 144QFP
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max: 9.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 24
- Number of Macrocells: 384
- Number of Gates: 9000
- Number of I/O: 118
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock7,424 |
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Xilinx Inc. |
IC CPLD 144MC 7.5NS 144CSBGA
- Programmable Type: In System Programmable (min 10K program/erase cycles)
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 8
- Number of Macrocells: 144
- Number of Gates: 3200
- Number of I/O: 117
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-TFBGA, CSPBGA
- Supplier Device Package: 144-LCSBGA (12x12)
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Package: 144-TFBGA, CSPBGA |
Stock9,096 |
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Xilinx Inc. |
IC CPLD 128MC 7NS 132BGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 7.0ns
- Voltage Supply - Internal: 1.7 V ~ 1.9 V
- Number of Logic Elements/Blocks: 8
- Number of Macrocells: 128
- Number of Gates: 3000
- Number of I/O: 100
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 132-TFBGA, CSPBGA
- Supplier Device Package: 132-CSPBGA (8x8)
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Package: 132-TFBGA, CSPBGA |
Stock24,144 |
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Xilinx Inc. |
IC CPLD 72MC 7.5NS 64VQFP
- Programmable Type: In System Programmable (min 10K program/erase cycles)
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 72
- Number of Gates: 1600
- Number of I/O: 52
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-TQFP
- Supplier Device Package: 64-VQFP (10x10)
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Package: 64-TQFP |
Stock45,828 |
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Xilinx Inc. |
XA7A25T-1CPG238I
- Number of LABs/CLBs: 1825
- Number of Logic Elements/Cells: 23360
- Total RAM Bits: 1658880
- Number of I/O: 150
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 238-LFBGA, CSPBGA
- Supplier Device Package: 236-CSBGA (10x10)
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Package: 238-LFBGA, CSPBGA |
Stock7,968 |
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Xilinx Inc. |
XC7S15-1CSGA225I
- Number of LABs/CLBs: 1000
- Number of Logic Elements/Cells: 12800
- Total RAM Bits: 368640
- Number of I/O: 100
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 225-LFBGA, CSPBGA
- Supplier Device Package: 225-CSPBGA (13x13)
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Package: 225-LFBGA, CSPBGA |
Stock6,084 |
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