Page 222 - Xilinx Inc. Products | Heisener Electronics

XC17S15APD8I
Xilinx Inc.

IC PROM SER 5000 I-TEMP 8-DIP

Package: 8-DIP (0.300", 7.62mm)

Stock7,856
XCZU11EG-3FFVF1517E
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Package: 1517-BBGA, FCBGA

Stock5,760
XC7Z100-1FFG900I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900FBGA

Package: 900-BBGA, FCBGA

Stock2,384
XCZU5CG-L1FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Package: 900-BBGA, FCBGA

Stock3,280
XCZU5EV-L1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Package: 784-BBGA, FCBGA

Stock2,560
XC7Z035-2FBG676I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

Package: 676-BBGA, FCBGA

Stock6,640
XC3S50AN-4FTG256I
Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

Package: 256-LBGA

Stock6,496
XCS40-4PQ208C
Xilinx Inc.

IC FPGA 169 I/O 208QFP

Package: 208-BFQFP

Stock12,168
XC4052XL-2HQ304C
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Package: 304-BFQFP Exposed Pad

Stock2,960
XC4044XL-3BG352C
Xilinx Inc.

IC FPGA 289 I/O 352MBGA

Package: 352-LBGA, Metal

Stock5,248
XC4028XL-3HQ208I
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

Package: 208-BFQFP Exposed Pad

Stock5,328
XC4008E-3PC84C
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Package: 84-LCC (J-Lead)

Stock5,696
XC4003E-3PC84I
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Package: 84-LCC (J-Lead)

Stock2,320
XC5204-6PQ160C
Xilinx Inc.

IC FPGA 124 I/O 160QFP

Package: 160-BQFP

Stock9,960
XC4036XL-2HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock2,544
XC7VX485T-3FFG1930E
Xilinx Inc.

IC FPGA 700 I/O 1930FCBGA

Package: 1924-BBGA, FCBGA

Stock5,808
XQ5VLX220T-1EF1738I
Xilinx Inc.

IC FPGA VIRTEX-5 220K 1738FBGA

Package: 1738-BBGA, FCBGA

Stock5,072
XC7VX690T-2FF1157C
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Package: 1156-BBGA, FCBGA

Stock7,424
XC7VX415T-1FFG1927I
Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

Package: 1924-BBGA, FCBGA

Stock3,536
XC7K420T-L2FFG901I
Xilinx Inc.

IC FPGA 380 I/O 901FCBGA

Package: 900-BBGA, FCBGA

Stock7,216

Part Number	Manufacturer	Description	Package	Stock
XC17S15APD8I	Xilinx Inc.	IC PROM SER 5000 I-TEMP 8-DIP Programmable Type: OTP Memory Size: 150kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	Package: 8-DIP (0.300", 7.62mm)	Stock7,856
XCZU11EG-3FFVF1517E	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock5,760
XC7Z100-1FFG900I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 900FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock2,384
XCZU5CG-L1FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock3,280
XCZU5EV-L1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock2,560
XC7Z035-2FBG676I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock6,640
XC3S50AN-4FTG256I	Xilinx Inc.	IC FPGA 195 I/O 256FTBGA Number of LABs/CLBs: 176 Number of Logic Elements/Cells: 1584 Total RAM Bits: 55296 Number of I/O: 195 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock6,496
XCS40-4PQ208C	Xilinx Inc.	IC FPGA 169 I/O 208QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 169 Number of Gates: 40000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock12,168
XC4052XL-2HQ304C	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 256 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	Package: 304-BFQFP Exposed Pad	Stock2,960
XC4044XL-3BG352C	Xilinx Inc.	IC FPGA 289 I/O 352MBGA Number of LABs/CLBs: 1600 Number of Logic Elements/Cells: 3800 Total RAM Bits: 51200 Number of I/O: 289 Number of Gates: 44000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	Package: 352-LBGA, Metal	Stock5,248
XC4028XL-3HQ208I	Xilinx Inc.	IC FPGA 160 I/O 208HQFP Number of LABs/CLBs: 1024 Number of Logic Elements/Cells: 2432 Total RAM Bits: 32768 Number of I/O: 160 Number of Gates: 28000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP Exposed Pad	Stock5,328
XC4008E-3PC84C	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 324 Number of Logic Elements/Cells: 770 Total RAM Bits: 10368 Number of I/O: 61 Number of Gates: 8000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	Package: 84-LCC (J-Lead)	Stock5,696
XC4003E-3PC84I	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 100 Number of Logic Elements/Cells: 238 Total RAM Bits: 3200 Number of I/O: 61 Number of Gates: 3000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	Package: 84-LCC (J-Lead)	Stock2,320
XC5204-6PQ160C	Xilinx Inc.	IC FPGA 124 I/O 160QFP Number of LABs/CLBs: 120 Number of Logic Elements/Cells: 480 Total RAM Bits: - Number of I/O: 124 Number of Gates: 6000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	Package: 160-BQFP	Stock9,960
XC4036XL-2HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 1296 Number of Logic Elements/Cells: 3078 Total RAM Bits: 41472 Number of I/O: 193 Number of Gates: 36000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock2,544
XC7VX485T-3FFG1930E	Xilinx Inc.	IC FPGA 700 I/O 1930FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1930-FCBGA (45x45)	Package: 1924-BBGA, FCBGA	Stock5,808
XQ5VLX220T-1EF1738I	Xilinx Inc.	IC FPGA VIRTEX-5 220K 1738FBGA Number of LABs/CLBs: 17280 Number of Logic Elements/Cells: 221184 Total RAM Bits: 7815168 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	Package: 1738-BBGA, FCBGA	Stock5,072
XC7VX690T-2FF1157C	Xilinx Inc.	IC FPGA 600 I/O 1157FCBGA Number of LABs/CLBs: 54150 Number of Logic Elements/Cells: 693120 Total RAM Bits: 54190080 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock7,424
XC7VX415T-1FFG1927I	Xilinx Inc.	IC FPGA 600 I/O 1927FCBGA Number of LABs/CLBs: 32200 Number of Logic Elements/Cells: 412160 Total RAM Bits: 32440320 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1927-FCBGA (45x45)	Package: 1924-BBGA, FCBGA	Stock3,536
XC7K420T-L2FFG901I	Xilinx Inc.	IC FPGA 380 I/O 901FCBGA Number of LABs/CLBs: 32575 Number of Logic Elements/Cells: 416960 Total RAM Bits: 30781440 Number of I/O: 380 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 901-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock7,216
XC5VLX85-1FFG1153I	Xilinx Inc.	IC FPGA 560 I/O 1153FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3538944 Number of I/O: 560 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1153-BBGA, FCBGA Supplier Device Package: 1153-FCBGA (35x35)	Package: 1153-BBGA, FCBGA	Stock5,760
XC7K355T-2FFG901C	Xilinx Inc.	IC FPGA 300 I/O 901FCBGA Number of LABs/CLBs: 27825 Number of Logic Elements/Cells: 356160 Total RAM Bits: 26357760 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 901-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock6,400
XC4VLX80-11FFG1148C	Xilinx Inc.	IC FPGA 768 I/O 1148FCBGA Number of LABs/CLBs: 8960 Number of Logic Elements/Cells: 80640 Total RAM Bits: 3686400 Number of I/O: 768 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	Package: 1148-BBGA, FCBGA	Stock6,320
XC2VP20-5FF1152C	Xilinx Inc.	IC FPGA 564 I/O 1152FCBGA Number of LABs/CLBs: 2320 Number of Logic Elements/Cells: 20880 Total RAM Bits: 1622016 Number of I/O: 564 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-CFCBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock4,048
XC3S250E-5FTG256C	Xilinx Inc.	IC FPGA 172 I/O 256FTBGA Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 172 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock4,800
XC7K410T-1FFG900C	Xilinx Inc.	IC FPGA 500 I/O 900FCBGA Number of LABs/CLBs: 31775 Number of Logic Elements/Cells: 406720 Total RAM Bits: 29306880 Number of I/O: 500 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock6,288
XC2C64A-7VQG44C	Xilinx Inc.	IC CPLD 64MC 6.7NS 44VQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 33 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	Package: 44-TQFP	Stock12,060
XC4VFX100-11FF1152C	Xilinx Inc.	IC FPGA VIRTEX-4 100K 1152-FBGA Number of LABs/CLBs: 10544 Number of Logic Elements/Cells: 94896 Total RAM Bits: 6930432 Number of I/O: 576 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-CFCBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock3,840