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Xilinx Inc. |
IC PROM SER 200K 8-SOIC
- Programmable Type: OTP
- Memory Size: 200kb
- Voltage - Supply: 4.75 V ~ 5.25 V
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-TSOP
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,392 |
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Xilinx Inc. |
IC FPGA QPRO 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
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Package: 484-LFBGA, CSPBGA |
Stock7,120 |
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Xilinx Inc. |
IC FPGA 512 I/O 1760FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock4,512 |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock7,872 |
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Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7 676FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock6,304 |
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Xilinx Inc. |
IC FPGA 252 I/O 784FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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Package: 784-BBGA, FCBGA |
Stock5,840 |
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Xilinx Inc. |
IC FPGA 400 I/O 676FCBGA
- Number of LABs/CLBs: 25475
- Number of Logic Elements/Cells: 326080
- Total RAM Bits: 16404480
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock6,672 |
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Xilinx Inc. |
IC FPGA 540 I/O 900FBGA
- Number of LABs/CLBs: 11519
- Number of Logic Elements/Cells: 147443
- Total RAM Bits: 4939776
- Number of I/O: 540
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA
- Supplier Device Package: 900-FBGA (31x31)
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Package: 900-BBGA |
Stock2,672 |
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Xilinx Inc. |
IC FPGA 324 I/O 456FBGA
- Number of LABs/CLBs: 1280
- Number of Logic Elements/Cells: -
- Total RAM Bits: 737280
- Number of I/O: 324
- Number of Gates: 1000000
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 456-BBGA
- Supplier Device Package: 456-FBGA (23x23)
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Package: 456-BBGA |
Stock2,100 |
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Xilinx Inc. |
IC FPGA 404 I/O 676FBGA
- Number of LABs/CLBs: 2400
- Number of Logic Elements/Cells: 10800
- Total RAM Bits: 81920
- Number of I/O: 404
- Number of Gates: 468252
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock2,896 |
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Xilinx Inc. |
IC FPGA 166 I/O 240QFP
- Number of LABs/CLBs: 1176
- Number of Logic Elements/Cells: 5292
- Total RAM Bits: 57344
- Number of I/O: 166
- Number of Gates: 236666
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-PQFP (32x32)
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Package: 240-BFQFP |
Stock6,832 |
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Xilinx Inc. |
IC FPGA 192 I/O 223CPGA
- Number of LABs/CLBs: 576
- Number of Logic Elements/Cells: 1368
- Total RAM Bits: 18432
- Number of I/O: 192
- Number of Gates: 13000
- Voltage - Supply: 4.5 V ~ 5.5 V
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 223-BCPGA
- Supplier Device Package: 223-CPGA (47.25x47.25)
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Package: 223-BCPGA |
Stock6,156 |
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Xilinx Inc. |
IC FPGA 112 I/O 160QFP
- Number of LABs/CLBs: 196
- Number of Logic Elements/Cells: 466
- Total RAM Bits: 6272
- Number of I/O: 112
- Number of Gates: 5000
- Voltage - Supply: 4.5 V ~ 5.5 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
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Package: 160-BQFP |
Stock3,728 |
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Xilinx Inc. |
IC FPGA 196 I/O 456FBGA
- Number of LABs/CLBs: 600
- Number of Logic Elements/Cells: 2700
- Total RAM Bits: 40960
- Number of I/O: 196
- Number of Gates: 100000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 456-BBGA
- Supplier Device Package: 456-FBGA (23x23)
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Package: 456-BBGA |
Stock7,488 |
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Xilinx Inc. |
IC FPGA 600 I/O 1157FCBGA
- Number of LABs/CLBs: 25500
- Number of Logic Elements/Cells: 326400
- Total RAM Bits: 27648000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1157-FCBGA (35x35)
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Package: 1156-BBGA, FCBGA |
Stock3,632 |
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Xilinx Inc. |
IC FPGA 400 I/O 676FCBGA
- Number of LABs/CLBs: 31775
- Number of Logic Elements/Cells: 406720
- Total RAM Bits: 29306880
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock13,260 |
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Xilinx Inc. |
IC FPGA 448 I/O 668FCBGA
- Number of LABs/CLBs: 2688
- Number of Logic Elements/Cells: 24192
- Total RAM Bits: 1327104
- Number of I/O: 448
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 668-BBGA, FCBGA
- Supplier Device Package: 668-FCBGA (27x27)
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Package: 668-BBGA, FCBGA |
Stock5,776 |
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Xilinx Inc. |
IC FPGA 320 I/O 668FCBGA
- Number of LABs/CLBs: 1368
- Number of Logic Elements/Cells: 12312
- Total RAM Bits: 663552
- Number of I/O: 320
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 668-BBGA, FCBGA
- Supplier Device Package: 668-FCBGA (27x27)
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Package: 668-BBGA, FCBGA |
Stock5,520 |
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Xilinx Inc. |
IC FPGA 400 I/O 676FCBGA
- Number of LABs/CLBs: 12675
- Number of Logic Elements/Cells: 162240
- Total RAM Bits: 11980800
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock5,296 |
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Xilinx Inc. |
IC FPGA 633 I/O 900FBGA
- Number of LABs/CLBs: 6912
- Number of Logic Elements/Cells: 62208
- Total RAM Bits: 1769472
- Number of I/O: 633
- Number of Gates: 4000000
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 900-BBGA
- Supplier Device Package: 900-FBGA (31x31)
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Package: 900-BBGA |
Stock9,768 |
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Xilinx Inc. |
IC FPGA 250 I/O 484FBGA
- Number of LABs/CLBs: 1879
- Number of Logic Elements/Cells: 24051
- Total RAM Bits: 958464
- Number of I/O: 250
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA |
Stock5,408 |
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Xilinx Inc. |
IC FPGA 176 I/O 256FBGA
- Number of LABs/CLBs: 384
- Number of Logic Elements/Cells: 1728
- Total RAM Bits: 32768
- Number of I/O: 176
- Number of Gates: 50000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-BGA |
Stock15,696 |
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Xilinx Inc. |
IC FPGA 97 I/O 144TQFP
- Number of LABs/CLBs: 480
- Number of Logic Elements/Cells: 4320
- Total RAM Bits: 221184
- Number of I/O: 97
- Number of Gates: 200000
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock11,964 |
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Xilinx Inc. |
IC CPLD 512MC 10.8NS 256BGA
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max: 10.8ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 32
- Number of Macrocells: 512
- Number of Gates: 12000
- Number of I/O: 212
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FTBGA (17x17)
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Package: 256-LBGA |
Stock3,216 |
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Xilinx Inc. |
IC CPLD 384MC 9NS 256BGA
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max: 9.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 24
- Number of Macrocells: 384
- Number of Gates: 9000
- Number of I/O: 212
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FTBGA (17x17)
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Package: 256-LBGA |
Stock4,944 |
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Xilinx Inc. |
IC CPLD 288MC 7.5NS 208QFP
- Programmable Type: In System Programmable (min 10K program/erase cycles)
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 288
- Number of Gates: 6400
- Number of I/O: 168
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock6,720 |
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Xilinx Inc. |
IC CPLD 384MC 9.2NS 208QFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 9.2ns
- Voltage Supply - Internal: 1.7 V ~ 1.9 V
- Number of Logic Elements/Blocks: 24
- Number of Macrocells: 384
- Number of Gates: 9000
- Number of I/O: 173
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock7,328 |
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Xilinx Inc. |
XC7S50-1FTGB196I
- Number of LABs/CLBs: 4075
- Number of Logic Elements/Cells: 52160
- Total RAM Bits: 2764800
- Number of I/O: 100
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 196-LBGA, CSPBGA
- Supplier Device Package: 196-CSBGA (15x15)
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Package: 196-LBGA, CSPBGA |
Stock7,760 |
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