Page 29 - Xilinx Inc. Products | Heisener Electronics

XCZU7EV-2FFVF1517E
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Package: 1517-BBGA, FCBGA

Stock2,128
XCZU7EV-L1FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Package: 900-BBGA, FCBGA

Stock7,360
XC7Z035-1FBG676I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

Package: 676-BBGA, FCBGA

Stock4,320
XCZU2EG-2SBVA484E
Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

Package: 484-BBGA, FCBGA

Stock7,024
XC6SLX9-N3FT256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

Package: 256-LBGA

Stock7,760
XC6SLX150-N3FG484I
Xilinx Inc.

IC FPGA 338 I/O 484FBGA

Package: 484-BBGA

Stock3,152
XCV800-5HQ240I
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock4,256
XCV600-4BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock4,496
XC7VX485T-2FF1761I
Xilinx Inc.

IC FPGA 700 I/O 1761FCBGA

Package: 1760-BBGA, FCBGA

Stock5,360
XC5VLX110T-1FFG1738I
Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

Package: 1738-BBGA, FCBGA

Stock4,480
XC5VFX70T-2FF1136C
Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

Package: 1136-BBGA, FCBGA

Stock4,848
XC5VLX85T-1FF1136C
Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Package: 1136-BBGA, FCBGA

Stock3,872
XC2VP7-7FFG896C
Xilinx Inc.

IC FPGA 396 I/O 896FCBGA

Package: 896-BBGA, FCBGA

Stock3,168
XC3S5000-4FG676I
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock9,708
XC6SLX100-3FG676C
Xilinx Inc.

IC FPGA 480 I/O 676FCBGA

Package: 676-BBGA, FCBGA

Stock4,672
XQ6SLX75-2FG484I
Xilinx Inc.

IC FPGA SPARTAN 6 75K 484BGA

Package: 484-BBGA

Stock5,440
XC6SLX25-3FG484I
Xilinx Inc.

IC FPGA 266 I/O 484FBGA

Package: 484-BBGA

Stock3,232
XC3S700A-4FGG484I
Xilinx Inc.

IC FPGA 372 I/O 484FBGA

Package: 484-BBGA

Stock3,200
XC3S200A-5FT256C
Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

Package: 256-LBGA

Stock2,720
XC3S250E-5VQG100C
Xilinx Inc.

IC FPGA 66 I/O 100VQFP

Package: 100-TQFP

Stock5,200

Part Number	Manufacturer	Description	Package	Stock
XCZU7EV-2FFVF1517E	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock2,128
XCZU7EV-L1FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock7,360
XC7Z035-1FBG676I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock4,320
XCZU2EG-2SBVA484E	Xilinx Inc.	IC FPGA 82 I/O 484FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	Package: 484-BBGA, FCBGA	Stock7,024
XC6SLX9-N3FT256C	Xilinx Inc.	IC FPGA 186 I/O 256FTBGA Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 186 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock7,760
XC6SLX150-N3FG484I	Xilinx Inc.	IC FPGA 338 I/O 484FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 338 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock3,152
XCV800-5HQ240I	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 166 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock4,256
XCV600-4BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 98304 Number of I/O: 404 Number of Gates: 661111 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock4,496
XC7VX485T-2FF1761I	Xilinx Inc.	IC FPGA 700 I/O 1761FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1761-FCBGA (42.5x42.5)	Package: 1760-BBGA, FCBGA	Stock5,360
XC5VLX110T-1FFG1738I	Xilinx Inc.	IC FPGA 680 I/O 1738FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 5455872 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	Package: 1738-BBGA, FCBGA	Stock4,480
XC5VFX70T-2FF1136C	Xilinx Inc.	IC FPGA 640 I/O 1136FCBGA Number of LABs/CLBs: 5600 Number of Logic Elements/Cells: 71680 Total RAM Bits: 5455872 Number of I/O: 640 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	Package: 1136-BBGA, FCBGA	Stock4,848
XC5VLX85T-1FF1136C	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3981312 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	Package: 1136-BBGA, FCBGA	Stock3,872
XC2VP7-7FFG896C	Xilinx Inc.	IC FPGA 396 I/O 896FCBGA Number of LABs/CLBs: 1232 Number of Logic Elements/Cells: 11088 Total RAM Bits: 811008 Number of I/O: 396 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	Package: 896-BBGA, FCBGA	Stock3,168
XC3S5000-4FG676I	Xilinx Inc.	IC FPGA 489 I/O 676FBGA Number of LABs/CLBs: 8320 Number of Logic Elements/Cells: 74880 Total RAM Bits: 1916928 Number of I/O: 489 Number of Gates: 5000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock9,708
XC6SLX100-3FG676C	Xilinx Inc.	IC FPGA 480 I/O 676FCBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 480 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock4,672
XQ6SLX75-2FG484I	Xilinx Inc.	IC FPGA SPARTAN 6 75K 484BGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 280 Number of Gates: - Voltage - Supply: 1.2 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock5,440
XC6SLX25-3FG484I	Xilinx Inc.	IC FPGA 266 I/O 484FBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 266 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock3,232
XC3S700A-4FGG484I	Xilinx Inc.	IC FPGA 372 I/O 484FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 372 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock3,200
XC3S200A-5FT256C	Xilinx Inc.	IC FPGA 195 I/O 256FTBGA Number of LABs/CLBs: 448 Number of Logic Elements/Cells: 4032 Total RAM Bits: 294912 Number of I/O: 195 Number of Gates: 200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock2,720
XC3S250E-5VQG100C	Xilinx Inc.	IC FPGA 66 I/O 100VQFP Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 66 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	Package: 100-TQFP	Stock5,200
XC7A100T-2FGG676I	Xilinx Inc.	IC FPGA 300 I/O 676FCBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	Package: 676-BGA	Stock4,064
XC9536-5PC44C	Xilinx Inc.	IC CPLD 36MC 5NS 44PLCC Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 5.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock4,720
XC95108-20PQ100I	Xilinx Inc.	IC CPLD 108MC 20NS 100QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 108 Number of Gates: 2400 Number of I/O: 81 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	Package: 100-BQFP	Stock5,168
XC95144XL-7TQ144I	Xilinx Inc.	IC CPLD 144MC 7.5NS 144TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 144 Number of Gates: 3200 Number of I/O: 117 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock7,552
XC9572XL-7TQ100I	Xilinx Inc.	IC CPLD 72MC 7.5NS 100TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 72 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-LQFP	Stock14,196
XC7A25T-2CSG325I	Xilinx Inc.	XC7A25T-2CSG325I Number of LABs/CLBs: 1825 Number of Logic Elements/Cells: 23360 Total RAM Bits: 1658880 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TA) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	Package: 324-LFBGA, CSPBGA	Stock7,088
XCVU13P-2FHGB2104E	Xilinx Inc.	IC FPGA VIRTEX-UP 2104FCBGA Number of LABs/CLBs: 216000 Number of Logic Elements/Cells: 3780000 Total RAM Bits: 514867200 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (52.5x52.5)	Package: 2104-BBGA, FCBGA	Stock3,232
XCVU13P-2FHGA2104E	Xilinx Inc.	IC FPGA VIRTEX-UP 2104FCBGA Number of LABs/CLBs: 216000 Number of Logic Elements/Cells: 3780000 Total RAM Bits: 514867200 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (52.5x52.5)	Package: 2104-BBGA, FCBGA	Stock7,200