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Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
- Programmable Type: OTP
- Memory Size: 400kb
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock15,252 |
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Xilinx Inc. |
IC PROM SRL 128M GATE 64-FTBGA
- Programmable Type: In System Programmable
- Memory Size: 128Mb
- Voltage - Supply: 1.7 V ~ 2 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 64-TBGA
- Supplier Device Package: 64-FTBGA (10x13)
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Package: 64-TBGA |
Stock24,768 |
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Xilinx Inc. |
IC FPGA 360 I/O 1156FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
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Package: 1156-BBGA, FCBGA |
Stock7,680 |
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Xilinx Inc. |
IC FPGA 464 I/O 1517FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock7,920 |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock3,840 |
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Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7 676FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock5,216 |
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Xilinx Inc. |
IC FPGA 176 I/O 256FBGA
- Number of LABs/CLBs: 600
- Number of Logic Elements/Cells: 2700
- Total RAM Bits: 81920
- Number of I/O: 176
- Number of Gates: 128236
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-BGA |
Stock6,528 |
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Xilinx Inc. |
IC FPGA 129 I/O 160QFP
- Number of LABs/CLBs: 784
- Number of Logic Elements/Cells: 1862
- Total RAM Bits: 25088
- Number of I/O: 129
- Number of Gates: 20000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
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Package: 160-BQFP |
Stock7,664 |
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Xilinx Inc. |
IC FPGA 113 I/O 144HQFP
- Number of LABs/CLBs: 784
- Number of Logic Elements/Cells: 1862
- Total RAM Bits: 25088
- Number of I/O: 113
- Number of Gates: 20000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP Exposed Pad
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP Exposed Pad |
Stock8,844 |
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Xilinx Inc. |
IC FPGA 192 I/O 240QFP
- Number of LABs/CLBs: 576
- Number of Logic Elements/Cells: 1368
- Total RAM Bits: 18432
- Number of I/O: 192
- Number of Gates: 13000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-PQFP (32x32)
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Package: 240-BFQFP |
Stock3,632 |
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Xilinx Inc. |
IC FPGA 144 I/O 208QFP
- Number of LABs/CLBs: 324
- Number of Logic Elements/Cells: 770
- Total RAM Bits: 10368
- Number of I/O: 144
- Number of Gates: 8000
- Voltage - Supply: 4.5 V ~ 5.5 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock2,560 |
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Xilinx Inc. |
IC FPGA 61 I/O 84PLCC
- Number of LABs/CLBs: 324
- Number of Logic Elements/Cells: 770
- Total RAM Bits: 10368
- Number of I/O: 61
- Number of Gates: 8000
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 84-LCC (J-Lead)
- Supplier Device Package: 84-PLCC (29.31x29.31)
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Package: 84-LCC (J-Lead) |
Stock6,948 |
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Xilinx Inc. |
IC FPGA 1200 I/O 1925FCBGA
- Number of LABs/CLBs: 152700
- Number of Logic Elements/Cells: 1954560
- Total RAM Bits: 47628288
- Number of I/O: 1200
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1924-BBGA, FCBGA
- Supplier Device Package: 1925-FCBGA (45x45)
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Package: 1924-BBGA, FCBGA |
Stock4,176 |
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Xilinx Inc. |
IC FPGA 702 I/O 1760FCBGA
- Number of LABs/CLBs: 82920
- Number of Logic Elements/Cells: 1451100
- Total RAM Bits: 77721600
- Number of I/O: 702
- Number of Gates: -
- Voltage - Supply: 0.922 V ~ 0.979 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock3,968 |
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Xilinx Inc. |
IC FPGA 640 I/O 1136FCBGA
- Number of LABs/CLBs: 12160
- Number of Logic Elements/Cells: 155648
- Total RAM Bits: 7815168
- Number of I/O: 640
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1136-BBGA, FCBGA
- Supplier Device Package: 1136-FCBGA (35x35)
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Package: 1136-BBGA, FCBGA |
Stock3,248 |
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Xilinx Inc. |
IC FPGA 360 I/O 1156FCBGA
- Number of LABs/CLBs: 11600
- Number of Logic Elements/Cells: 148480
- Total RAM Bits: 8404992
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
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Package: 1156-BBGA, FCBGA |
Stock7,376 |
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Xilinx Inc. |
IC FPGA 350 I/O 900FCBGA
- Number of LABs/CLBs: 31775
- Number of Logic Elements/Cells: 406720
- Total RAM Bits: 29306880
- Number of I/O: 350
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock6,720 |
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Xilinx Inc. |
IC FPGA 440 I/O 676FCBGA
- Number of LABs/CLBs: 6480
- Number of Logic Elements/Cells: 82944
- Total RAM Bits: 3538944
- Number of I/O: 440
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock6,416 |
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Xilinx Inc. |
IC FPGA 500 I/O 900FCBGA
- Number of LABs/CLBs: 31775
- Number of Logic Elements/Cells: 406720
- Total RAM Bits: 29306880
- Number of I/O: 500
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock4,976 |
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Xilinx Inc. |
IC FPGA 564 I/O 1152FCBGA
- Number of LABs/CLBs: 2320
- Number of Logic Elements/Cells: 20880
- Total RAM Bits: 1622016
- Number of I/O: 564
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,248 |
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Xilinx Inc. |
IC FPGA 2.5V 108K GATES 256-BGA
- Number of LABs/CLBs: 600
- Number of Logic Elements/Cells: 2700
- Total RAM Bits: 40960
- Number of I/O: 180
- Number of Gates: 108904
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C (TJ)
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (27x27)
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Package: 256-BBGA |
Stock6,736 |
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Xilinx Inc. |
IC FPGA 309 I/O 484CSBG
- Number of LABs/CLBs: 4160
- Number of Logic Elements/Cells: 37440
- Total RAM Bits: 1548288
- Number of I/O: 309
- Number of Gates: 1800000
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 484-FBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
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Package: 484-FBGA, CSPBGA |
Stock4,576 |
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Xilinx Inc. |
IC FPGA 140 I/O 208QFP
- Number of LABs/CLBs: 600
- Number of Logic Elements/Cells: 2700
- Total RAM Bits: 40960
- Number of I/O: 140
- Number of Gates: 100000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock6,928 |
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Xilinx Inc. |
IC CPLD 72MC 10NS 100TQFP
- Programmable Type: In System Programmable (min 10K program/erase cycles)
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 72
- Number of Gates: 1600
- Number of I/O: 72
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-TQFP (14x14)
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Package: 100-LQFP |
Stock27,588 |
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Xilinx Inc. |
IC CPLD 72MC 15.5NS 100TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 15.5ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 72
- Number of Gates: 1600
- Number of I/O: 72
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-TQFP (14x14)
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Package: 100-LQFP |
Stock7,504 |
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Xilinx Inc. |
IC CPLD 256MC 9NS 144TQFP
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max: 9.1ns
- Voltage Supply - Internal: 2.7 V ~ 3.6 V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 256
- Number of Gates: 6000
- Number of I/O: 120
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock41,220 |
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Xilinx Inc. |
XCVU11P-3FLGB2104E
- Number of LABs/CLBs: 162000
- Number of Logic Elements/Cells: 2835000
- Total RAM Bits: 396150400
- Number of I/O: 572
- Number of Gates: -
- Voltage - Supply: 0.873 V ~ 0.927 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2104-BBGA, FCBGA
- Supplier Device Package: 2104-FCBGA (47.5x47.5)
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Package: 2104-BBGA, FCBGA |
Stock3,456 |
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Xilinx Inc. |
XCVU11P-1FSGD2104I
- Number of LABs/CLBs: 162000
- Number of Logic Elements/Cells: 2835000
- Total RAM Bits: 396150400
- Number of I/O: 572
- Number of Gates: -
- Voltage - Supply: 0.825 V ~ 0.876 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2104-BBGA, FCBGA
- Supplier Device Package: 2104-FCBGA (47.5x47.5)
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Package: 2104-BBGA, FCBGA |
Stock7,968 |
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