Texas Instruments (TI) has announced key updates to its complete real-time operating system (RTOS), which brings the ease-of-use associated with power management operations in high-level operating systems, such as Android and Windows, to embedded microcontroller (MCU)-based applications.
Analog Devices’ ADRF6820 quadrature demodulator was designed as a highly-integrated demodulator and synthesizer for next-generation communication systems.
NXP’s BLF2425M6LS180P 180W LDMOS transistor is covering the industrial, scientific and medical (ISM) band of 2400MHz to 2500MHz.
Diodes' highly-integrated PAM8009 Series 3W Class-D audio power amplifiers are for driving bridged-tied (BTL) stereo speakers.
A high-performance Molex 1.2mm in-line connector system, the new Molex MXP120 sealed connector system for automotive and commercial vehicles is designed to replace traditional 1.5mm terminals in in-line harness applications, saving space and providing high performance within harsh environments.
The first member of its new radiation tolerant space system manager (SSM) family of special-purpose mixed-signal devices, the LX7730 telemetry controller integrated circuit, has been unveiled by Microsemi. The LX7730 integrates the required functions in satellite telemetry systems and interfaces with radiation-tolerant FPGAs.
Texas Instruments'(TI) highly-versatile MSP430i204x, MSP430i203x, MSP430i202x 16-bit mixed-signal microcontrollers consist of a powerful 16-bit RISC CPU and a DCO-based clock system that generates system clocks.
Single-contact version of its proven 9176 Series insulation displacement connectors (IDCs) have been introduced by AVX. The IDCs are widely recognized for providing highly-reliable, gas-tight wire-to-board connections in a range of harsh environment applications.
The Taiwan Semiconductor range includes discrete power rectifiers, analogue ICs, voltage references, sensors, linear and switching regulators, op-amps, comparators, and lighting ICs.
Designed to provide a complete, highly-integrated solution for signal and power isolation, a new family of high-speed, multi-channel digital isolators has been unveiled by Silicon Labs.
With new devices featuring smaller case sizes and lower profiles, Vishay has announced that it has broadened its offering of solid tantalum surface-mount moulded chip capacitors. The TMCJ and TMCP are offered in the J (1608-09) and P (2012-12) case sizes, respectively, while the TMCU is available in the ultra-flat, low-profile UA (3216-12) and UB (3528-12) packages.
Introduced as the highest-Q 01005 MLCC available on today's market for ultra high frequency (UHF) band applications (300MHz–3GHz), AVX has unveiled the new CU Series.
Speaking in public is the top fear for many people. Now, researchers from the Human-Computer Interaction Group at the University of Rochester have developed an intelligent user interface for "smart glasses" that gives real-time feedback to the speaker on volume modulation and speaking rate, while being minimally distracting.
SAN JOSE, Calif. – Wall Street’s excitement on Friday over reports x86 giant Intel Corp. was in talks to acquire FPGA maker Altera has left some analysts cold on Monday morning.
PORTLAND, Ore.-- Researchers sponsored by the Semiconductor Research Corp. (SRC, Research Triangle Park, N.C.) claim they have extended Moore's Law by finding a way to cut serial link power by as much as 80 percent. The innovation at the University of Illinois (Urbana) is a new on/off transceiver to be used on chips, between chips, between boards and between servers at data centers.
Microchip has announced that the MOST Cooperation has released its MOST150 Technology Coaxial Physical Layer specification.
Maxim Integrated's new IO-Link smart temperature sensor reference design lowers cost and increases uptime for industrial control and automation, says the company.
The new generation AZV3001 single-channel comparator, from Diodes Incorporated, has been specifically developed for use in battery-powered equipment that needs to operate at low voltage.