Epson Electronics America Inc-Semiconductor Div Products

S1F81100F5R2000

Epson Electronics America Inc-Semiconductor Div

IC REG CTRLR 48QFP

• Output Type: -
• Function: -
• Output Configuration: -
• Topology: -
• Number of Outputs: 4
• Output Phases: -
• Voltage - Supply (Vcc/Vdd): 2.8 V ~ 5.5 V
• Frequency - Switching: -
• Duty Cycle (Max): -
• Synchronous Rectifier: -
• Clock Sync: -
• Serial Interfaces: -
• Control Features: -
• Operating Temperature: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP (7x7)

Package: 48-LQFP

S4E5B001B000A00

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC EPD CTRLR 76QFN

• Type: -
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 76-QFN Module
• Supplier Device Package: Module

Package: 76-QFN Module

S2D13P04F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100LQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

Package: 100-LQFP

S1D13719B00B100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 180FBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-PFBGA (10x10)

Package: 180-TFBGA

S1D13717F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 176QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP
• Supplier Device Package: 176-QFP (24x24)

Package: 176-LQFP

S1D13717B00B100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 160BGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-PFBGA (10x10)

Package: 160-TFBGA

S1D15721D01B000

Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

S1D15710D10B000

Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

• Type: Display Driver
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

Package: Die

S1D13L03F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 176QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP
• Supplier Device Package: 176-QFP (24x24)

Package: 176-LQFP

S1D13771B01B400

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 64WCSP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: 64-WCSP (4.46x4.46)

Package: -

S1D13T03F10A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC EPD CTRLR 64TQFP13

• Type: Graphic Controller
• Applications: EPD Panel
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

Package: 64-TQFP

S1D13513F01A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR H-S 208-QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-QFP
• Supplier Device Package: -

Package: 208-QFP

S1D13A04F00A

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP (14x14)

Package: 128-TQFP

S1C17564F111100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 128KB FLASH 64TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: -

Package: 64-TQFP

S1C17564D111000

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 128KB FLASH 64TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: -

Package: 64-TQFP

S1C17W18F101100-90

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

S1C17W13F001100-160

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

S1C17W18F101100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

S1D13513B01B100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 256-PBGA

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

S1D13700F02A100-160

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 32KB SRA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP13 (10x10)

Package: 64-TQFP

S1C17M24F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 32TQFP15

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 23
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 6x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP15 (7x7)

Package: -

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S1D13C00B00C10B

Epson Electronics America Inc-Semiconductor Div

S1D13C00 MEMORY DISPLAY CONTROLL

• Type: Interface
• Applications: Video Display
• Mounting Type: Surface Mount
• Package / Case: 64-WFBGA, WLCSP
• Supplier Device Package: 64-WCSP (3.45x3.45)

Package: -

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S1C17M40F702100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

Package: -

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S1C31D01F101000

Epson Electronics America Inc-Semiconductor Div

IC MCU 32BIT 256KB FLSH 80TQFP14

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP14 (12x12)

Package: -

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S1C31D01B10210B

Epson Electronics America Inc-Semiconductor Div

IC MCU 32BIT 256KB FLASH 96WLCSP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 96-WFBGA, WLCSP
• Supplier Device Package: 96-WLCSP (4.45x4.45)

Package: -

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S1C17M32F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 64TQFP13

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 17.12MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
• Number of I/O: 53
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 3x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP13 (10x10)

Package: -

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S1C17M25F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 39
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

Package: -

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S1C17M01F201100-160

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 64TQFP13

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.3MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: AMRC, LCD, PWM, RFC, Voltage Detect, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: -
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP13 (10x10)

Package: -

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S1C17M21F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 32TQFP15

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 23
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 6x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP15 (7x7)

Package: -

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S1C17M10F101100-90

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLSH 128TQFP15

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: -
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP15 (14x14)

Package: -

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