Page 10 - Embedded - Microcontroller, Microprocessor, FPGA Modules | Integrated Circuits (ICs)

CC-9P-V225-Z1-B
Digi International

MODULE 9P 32MB SDRAM 32MB FLASH

Package: -

Stock7,632
CC-9M-QA25-Z1-B
Digi International

MOD 9M 32MB SDRAM 32MB FLASH 25

Package: -

Stock6,272
SOMOMAP3530-11-1672IFXR
Logic

SYSTEM ON MODULE LV OMAP3530

Package: -

Stock6,912
M5485AFEE-D
Logic

MODULE MCF5485 FIRE ENGINE

Package: -

Stock6,144
DC-ME-01T-NC-1
Digi International

MOD ME 8MB SDRAM 2MB FLASH 1PACK

Package: -

Stock7,008
20-101-1006
Digi International

MODULE POWERCORE 3800

Package: -

Stock6,352
MOD5282-100CR
NetBurner Inc.

PROCESSOR MODULE 512KB FLASH

Package: -

Stock6,752
EZ80F915050MOD
Zilog

MODULE EZ80F91 512K 50MHZ

Package: -

Stock7,536
CC-MX-LB58-ZM-B
Digi International

MODULE I.MX51 256MB FLASH 25PK

Package: -

Stock6,000
CC-7U-Z113-Z1-B
Digi International

UMOD CONNECTCORE 7U 16MB SDRAM

Package: -

Stock2,272
EDM1-IMX6S-MSD
Wandboard.Org

EDM1-IMX6S-MSD SOM 10PK

Package: -

Stock7,232
20-101-1112
Digi International

MODULE RABBITCORE RCM4010

Package: -

Stock5,936
20-101-1131
Digi International

MODULE RCM4200 RABBITCORE

Package: -

Stock6,688
OSD3358-512M-BAS
Octavo Systems LLC

IC SIP BASED ON TI AM3358 400BGA

Package: -

Stock7,776
20-101-1318
Digi International

MINICORE MODULE RCM6700

Package: -

Stock15,720
DC-ME-01T-KC-1
Digi International

MODULE DIGI CONNECT ME

Package: -

Stock7,424
CC-MX-JN7A-Z1
Digi International

CONNECTCORE I.MX6UL SOM

Package: -

Stock6,640
TE0745-02-81C11-A
Trenz Electronic GmbH

SOM MIT XILINX ZYNQ

Package: -

Stock4,192
TE0813-01-3AE11-A
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Package: -

Request a Quote
TE0600-04-83I21-A
Trenz Electronic GmbH

IC MODULE GIGABEE

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-9P-V225-Z1-B	Digi International	MODULE 9P 32MB SDRAM 32MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock7,632	-	-	-	-	-	-	-	-
CC-9M-QA25-Z1-B	Digi International	MOD 9M 32MB SDRAM 32MB FLASH 25 Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 400MHz Flash Size: 32MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock6,272	ARM920T, SC2443	-	400MHz	32MB	32MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	0°C ~ 70°C
SOMOMAP3530-11-1672IFXR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: TMS320C64x (DSP) Speed: 600MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: -20°C ~ 70°C	Package: -	Stock6,912	ARM? Cortex?-A8, OMAP3530	TMS320C64x (DSP)	600MHz	256MB (NAND), 8MB (NOR)	128MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	-20°C ~ 70°C
M5485AFEE-D	Logic	MODULE MCF5485 FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5485 Co-Processor: - Speed: 200MHz Flash Size: 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (95mm x 114mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,144	ColdFire V4e, MCF5485	-	200MHz	2MB (Boot)	64MB	-	3.7" x 4.5" (95mm x 114mm)	-40°C ~ 85°C
DC-ME-01T-NC-1	Digi International	MOD ME 8MB SDRAM 2MB FLASH 1PACK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock7,008	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
20-101-1006	Digi International	MODULE POWERCORE 3800 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 51.6MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5, 1x3mm Size / Dimension: 2.35" x 4" (60mm x 102mm) Operating Temperature: -40°C ~ 70°C	Package: -	Stock6,352	Rabbit 3000	-	51.6MHz	512KB (Internal), 1MB (External)	1MB	IDC Header 2x25, 2x5, 1x3mm	2.35" x 4" (60mm x 102mm)	-40°C ~ 70°C
MOD5282-100CR	NetBurner Inc.	PROCESSOR MODULE 512KB FLASH Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5282 Co-Processor: - Speed: 66MHz Flash Size: 512KB RAM Size: 8.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock6,752	ColdFire 5282	-	66MHz	512KB	8.064MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
EZ80F915050MOD	Zilog	MODULE EZ80F91 512K 50MHZ Module/Board Type: MCU, Ethernet Core Core Processor: eZ80F91 Co-Processor: - Speed: 50MHz Flash Size: 256KB (Internal), 1MB (External) RAM Size: 8KB (Internal), 512KB (External) Connector Type: Header 2x30 Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock7,536	eZ80F91	-	50MHz	256KB (Internal), 1MB (External)	8KB (Internal), 512KB (External)	Header 2x30	2.5" x 3.1" (63.5mm x 78.7mm)	0°C ~ 70°C
CC-MX-LB58-ZM-B	Digi International	MODULE I.MX51 256MB FLASH 25PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock6,000	-	-	-	-	-	-	-	-
CC-7U-Z113-Z1-B	Digi International	UMOD CONNECTCORE 7U 16MB SDRAM Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 8MB RAM Size: 16MB Connector Type: 48-DIP Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock2,272	ARM7TDMI, NS7520	-	55MHz	8MB	16MB	48-DIP	2.48" x 0.73" (62.9mm x 18.5mm)	0°C ~ 70°C
EDM1-IMX6S-MSD	Wandboard.Org	EDM1-IMX6S-MSD SOM 10PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock7,232	-	-	-	-	-	-	-	-
20-101-1112	Digi International	MODULE RABBITCORE RCM4010 Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 512KB RAM Size: 512KB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.84" x 2.42" (47mm x 61mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock5,936	Rabbit 4000	-	58.98MHz	512KB	512KB	IDC Header 2x25, 2x5	1.84" x 2.42" (47mm x 61mm)	0°C ~ 70°C
20-101-1131	Digi International	MODULE RCM4200 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 512KB (Internal), 8MB (External) RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.84" x 2.42" (47mm x 61mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,688	Rabbit 4000	-	58.98MHz	512KB (Internal), 8MB (External)	1MB	IDC Header 2x25, 2x5	1.84" x 2.42" (47mm x 61mm)	-40°C ~ 85°C
OSD3358-512M-BAS	Octavo Systems LLC	IC SIP BASED ON TI AM3358 400BGA Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3358 Co-Processor: - Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: 400-BGA Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm) Operating Temperature: 0°C ~ 85°C	Package: -	Stock7,776	ARM? Cortex?-A8, AM3358	-	1GHz	-	512MB	400-BGA	1.06" x 1.06" (27.0mm x 27.0mm)	0°C ~ 85°C
20-101-1318	Digi International	MINICORE MODULE RCM6700 Module/Board Type: MPU Core Core Processor: Rabbit 6000 Co-Processor: - Speed: 162.5MHz Flash Size: 1MB RAM Size: 1.032MB Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock15,720	Rabbit 6000	-	162.5MHz	1MB	1.032MB	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
DC-ME-01T-KC-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock7,424	-	-	-	-	-	-	-	-
CC-MX-JN7A-Z1	Digi International	CONNECTCORE I.MX6UL SOM Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7 Co-Processor: NEON™ MPE Speed: 528MHz Flash Size: 1GB RAM Size: 1GB Connector Type: - Size / Dimension: 1.14" x 1.14" (29mm x 29mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,640	ARM® Cortex®-A7	NEON™ MPE	528MHz	1GB	1GB	-	1.14" x 1.14" (29mm x 29mm)	-40°C ~ 85°C
TE0745-02-81C11-A	Trenz Electronic GmbH	SOM MIT XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock4,192	ARM® Cortex®-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Samtec ST5	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
TE0813-01-3AE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ XCZU3CG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0600-04-83I21-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX150-3FGG484I Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 512MB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX150-3FGG484I	-	125MHz	16MB	512MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
IW-G47M-K19P-4E008G-Q128M-LIB	iWave Systems	Kintex UltraScale+FPGA KU19P SOM Module/Board Type: FPGA Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1.2GHz Flash Size: - RAM Size: 2GB Connector Type: - Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A7	-	1.2GHz	-	2GB	-	4.330" L x 2.950" W (110.00mm x 75.00mm)	-40°C ~ 85°C
TE0745-02-91C11-A	Trenz Electronic GmbH	SOM 1GB DDR3 XC7Z045-1FBG676C Module/Board Type: MPU Core Core Processor: Xilinx Zynq XC7Z045-1FBG676C Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	Xilinx Zynq XC7Z045-1FBG676C	-	-	64MB	1GB	Samtec ST5	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 70°C
SM-K26-XCL2GC	AMD	IC MOD SOM K26C ZYNQ MPSOC Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Speed: 533MHz, 1.333GHz Flash Size: 16GB eMMC, 64MB QSPI RAM Size: 4GB Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Operating Temperature: 0°C ~ 85°C (TJ)	Package: -	Stock405	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	16GB eMMC, 64MB QSPI	4GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	0°C ~ 85°C (TJ)
DC-ME-Y402-S-UPW	Digi	IC CONNECT ME 9210 4/8-S 8MB Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.450" L x 0.750" W (36.70mm x 19.10mm) Operating Temperature: -40°C ~ 80°C	Package: -	Stock210	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.450" L x 0.750" W (36.70mm x 19.10mm)	-40°C ~ 80°C
TE0600-03-72C21-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-100 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	Spartan-6 LX-100	-	125MHz	16MB	256MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
FORLINX-FETT507-C-152GSE8GIA10	Forlinx Embedded	Allwinner T507SOM, 2GB DDR3L, 8G Module/Board Type: MPU Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.5GHz Flash Size: 8GB eMMC RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.760" L x 1.570" W (70.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53	-	1.5GHz	8GB eMMC	2GB	Board-to-Board (BTB) Socket - 240	2.760" L x 1.570" W (70.00mm x 40.00mm)	-40°C ~ 85°C
TE0808-05-9GI21-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC-MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: 4 x 160 Pin Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	4 x 160 Pin	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
MYC-JX8MMA7-8E2D-32Q256D-180-C	MYIR Tech Limited	ARM i.MX 8M Mini + Artix-7 FPGA Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Co-Processor: Xilinx Artix-7 XC7A25T Speed: 1.8GHz Flash Size: 8GB eMMC, 32MB QSPI RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 3.228" L x 1.772" W (82.00mm x 45.00mm) Operating Temperature: -40°C ~ 105°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-M4	Xilinx Artix-7 XC7A25T	1.8GHz	8GB eMMC, 32MB QSPI	2GB	Pin(s)	3.228" L x 1.772" W (82.00mm x 45.00mm)	-40°C ~ 105°C