Page 12 - Embedded - Microcontroller, Microprocessor, FPGA Modules | Integrated Circuits (ICs)

SOMDM3730-30-1880AKIR
Logic

SYSTEM ON MODULE TORP

Package: -

Stock3,376
DC-SP-01R-C-W
Digi International

ADAPTER SP CUSTOMIZABLE MODEL

Package: -

Stock7,600
DC-ME-Y413-C-B
Digi International

MOD ME 9210 16MB SDRAM 8MB FLASH

Package: -

Stock7,968
20-101-1307
Digi International

CORE MODULE RCM5760

Package: -

Stock5,920
20-101-1235
Digi International

CORE MODULE RCM5700

Package: -

Stock4,128
101-0521
Digi International

MODULE RABBITCORE RCM3210

Package: -

Stock3,408
CENGLH79524-10-403HC
Logic

CARD ENGINE 16MB FLASH 32MB RAM

Package: -

Stock5,120
101-0950
Digi International

MODULE RABBITCORE RCM3370

Package: -

Stock2,096
101-0497
Digi International

MODULAR RABBIT CORE OP6810

Package: -

Stock7,856
TE0712-02-100-2C3
Trenz Electronic GmbH

SOM ARTIX7 XC7A100T-2C 1GB LOPRO

Package: -

Stock3,872
CC-7U-Z111-Z1
Digi International

MODULE 7U 16MB SDRAM 2MB FLASH

Package: -

Stock2,960
CC-MX-L96C-Z1-1
Digi International

MOD WI-I.MX6

Package: -

Stock4,336
20-101-0453
Digi International

MODULE RABBITCORE RCM2300

Package: -

Stock7,608
OSD3358-512M-ISM
Octavo Systems LLC

IC SIP ARM A8 21MM 256BGA

Package: -

Stock15,444
TE0820-03-03CG-1ED
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 1GB 128MB

Package: -

Stock6,416
TE0630-02IBF
Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

Package: -

Stock6,960
MRZG2LS-BAA
ARIES Embedded

SOM RZ/G2L

Package: -

Request a Quote
TE0726-03-41C64-A
Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Package: -

Request a Quote
TE0630-03-63I22-A
Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

Package: -

Request a Quote
ME-XU8-7EV-2I-D12E-R2-2
Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU7EV

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
SOMDM3730-30-1880AKIR	Logic	SYSTEM ON MODULE TORP Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock3,376	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	512MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	-40°C ~ 85°C
DC-SP-01R-C-W	Digi International	ADAPTER SP CUSTOMIZABLE MODEL Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock7,600	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
DC-ME-Y413-C-B	Digi International	MOD ME 9210 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 16MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	Package: -	Stock7,968	ARM926EJ-S, NS9210	-	75MHz	16MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
20-101-1307	Digi International	CORE MODULE RCM5760 Module/Board Type: MPU Core Core Processor: Rabbit 5000 Co-Processor: - Speed: 50MHz Flash Size: 1MB (Internal), 2MB (External) RAM Size: 128KB (Internal), 512KB (External) Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock5,920	Rabbit 5000	-	50MHz	1MB (Internal), 2MB (External)	128KB (Internal), 512KB (External)	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
20-101-1235	Digi International	CORE MODULE RCM5700 Module/Board Type: MPU Core Core Processor: Rabbit 5000 Co-Processor: - Speed: 50MHz Flash Size: 1MB RAM Size: 128KB Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock4,128	Rabbit 5000	-	50MHz	1MB	128KB	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
101-0521	Digi International	MODULE RABBITCORE RCM3210 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.5MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	Package: -	Stock3,408	Rabbit 3000	-	29.5MHz	256KB	128KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CENGLH79524-10-403HC	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM720T, LH79524 Co-Processor: - Speed: 77.4MHz Flash Size: 16MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock5,120	ARM720T, LH79524	-	77.4MHz	16MB	32MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0950	Digi International	MODULE RABBITCORE RCM3370 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	Package: -	Stock2,096	Rabbit 3000	-	44.2MHz	512KB	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
101-0497	Digi International	MODULAR RABBIT CORE OP6810 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: IDC Header 2x20 Size / Dimension: 2.6" x 3" (66mm x 76mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock7,856	Rabbit 2000	-	22.1MHz	256KB	128KB	IDC Header 2x20	2.6" x 3" (66mm x 76mm)	-40°C ~ 85°C
TE0712-02-100-2C3	Trenz Electronic GmbH	SOM ARTIX7 XC7A100T-2C 1GB LOPRO Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock3,872	Artix-7 A100T	-	200MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
CC-7U-Z111-Z1	Digi International	MODULE 7U 16MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 16MB Connector Type: 48-DIP Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock2,960	ARM7TDMI, NS7520	-	55MHz	2MB	16MB	48-DIP	2.48" x 0.73" (62.9mm x 18.5mm)	0°C ~ 70°C
CC-MX-L96C-Z1-1	Digi International	MOD WI-I.MX6 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A9, i.MX6Quad Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock4,336	ARM? Cortex?-A9, i.MX6Quad	-	800MHz	4GB	512MB	-	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
20-101-0453	Digi International	MODULE RABBITCORE RCM2300 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x26 Size / Dimension: 1.15" x 1.6" (29mm x 41mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock7,608	Rabbit 2000	-	22.1MHz	256KB	128KB	2 IDC Headers 2x26	1.15" x 1.6" (29mm x 41mm)	-40°C ~ 85°C
OSD3358-512M-ISM	Octavo Systems LLC	IC SIP ARM A8 21MM 256BGA Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: NEON™ SIMD Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: 256-BGA Size / Dimension: 0.83" x 0.83" (21mm x 21mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock15,444	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.83" x 0.83" (21mm x 21mm)	-40°C ~ 85°C
TE0820-03-03CG-1ED	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 1GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	Package: -	Stock6,416	Zynq UltraScale+ XCZU3CG-1SFVC784E	-	-	128MB	1GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
TE0630-02IBF	Trenz Electronic GmbH	IC MOD SPARTAN-6 100MHZ 128MB Module/Board Type: FPGA, USB Core Core Processor: Spartan-6 LX-75 Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 8MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,960	Spartan-6 LX-75	Cypress EZ-USB FX2LP	100MHz	8MB	128MB	B2B	1.6" x 1.9" (40.5mm x 47.5mm)	-40°C ~ 85°C
MRZG2LS-BAA	ARIES Embedded	SOM RZ/G2L Module/Board Type: MCU Core Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Co-Processor: - Speed: 1.5GHz Flash Size: 4GB eMMC, 128MB (NOR) RAM Size: 1GB Connector Type: Pin(s) Size / Dimension: 32.283" L x 19.685" W (820.00mm x 500.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-M33	-	1.5GHz	4GB eMMC, 128MB (NOR)	1GB	Pin(s)	32.283" L x 19.685" W (820.00mm x 500.00mm)	-40°C ~ 85°C
TE0726-03-41C64-A	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7010)	-	16MB	512MB	CSI, DSI	1.180" L x 1.570" W (30.00mm x 40.00mm)	0°C ~ 70°C
TE0630-03-63I22-A	Trenz Electronic GmbH	IC MOD SPARTAN-6 100MHZ 128MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU8-7EV-2I-D12E-R2-2	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU7EV Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0710-02-72I21-A	Trenz Electronic GmbH	MOD FPGA ARTIX7 100T 512MB 78BGA Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Artix-7 A100T	-	100MHz	32MB	512MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0715-04-51I33-L	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0803-03-3BE11-AS	Trenz Electronic GmbH	MODULE SOM TE0803-03 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0820-05-3BE21ML	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
6231-IX-XXA-RI	Critical Link LLC	SOM WITH TI SITARA AM6231, 1GHZ, Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: - RAM Size: 1GB Connector Type: SO-DIMM-260 Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53	NEON SIMD	800MHz	-	1GB	SO-DIMM-260	2.740" L x 1.500" W (69.60mm x 38.10mm)	-40°C ~ 85°C
TE0745-03-93E31-A	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7045-3E, 1 GBY Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-3FFG676E Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-3FFG676E	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0818-02-9BE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH AMD Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0808-04-9BE21-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C