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Altera |
IC SOC FPGA 492 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,736 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
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Altera |
IC FPGA 170 I/O 896FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 462K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BBGA, FCBGA |
Stock2,272 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 462K Logic Elements | -40°C ~ 100°C (TJ) | 896-BBGA, FCBGA | 896-FBGA (31x31) |
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Altera |
IC FPGA 288 I/O 896FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 700MHz
- Primary Attributes: FPGA - 85K Logic Elements
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 896-BGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BGA |
Stock7,920 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 85K Logic Elements | -40°C ~ 125°C (TJ) | 896-BGA | 896-FBGA (31x31) |
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Xilinx Inc. |
XCZU3CG-2SFVA625I
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
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Package: 625-BFBGA, FCBGA |
Stock5,520 |
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Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | 625-FCBGA (21x21) |
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Microsemi Corporation |
IC FPGA SOC 150K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 150K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 536-LFBGA
- Supplier Device Package: 536-BGA (16x16)
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Package: 536-LFBGA |
Stock7,920 |
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ARM? Cortex?-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | 536-LFBGA | 536-BGA (16x16) |
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Microsemi Corporation |
IC FPGA SOC 50K LUTS 896FBGA
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 50K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock4,928 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | 0°C ~ 85°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Microsemi Corporation |
IC FPGA SOC 10K LUTS 484FBGA
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 10K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock6,912 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | 0°C ~ 85°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Microsemi Corporation |
IC FPGA SOC 5K LUTS 484FBGA
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 128KB
- RAM Size: 64KB
- Peripherals: DDR
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 5K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock3,568 |
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ARM? Cortex?-M3 | 128KB | 64KB | DDR | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Broadcom Limited |
SOC DIGITAL GATEWAY
- Architecture: -
- Core Processor: MIPS32®/16e
- Flash Size: -
- RAM Size: -
- Peripherals: DDR2, DMA
- Connectivity: EBI/EMI, Ethernet, UART/USART, USB
- Speed: 400MHz
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,728 |
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MIPS32®/16e | - | - | DDR2, DMA | EBI/EMI, Ethernet, UART/USART, USB | 400MHz | - | - | - | - |
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Intel |
IC SOC FPGA 384 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,784 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |
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Microchip Technology |
IC SOC RISC-V 1152FCBGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128kB
- RAM Size: 3.95MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 461K Logic Modules
- Operating Temperature: 0°C ~ 100°C
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: - |
Request a Quote |
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RISC-V | 128kB | 3.95MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 461K Logic Modules | 0°C ~ 100°C | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
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Microchip Technology |
IC SOC RISC-V 536LFBGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128kB
- RAM Size: 857.6kB
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 93K Logic Modules
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 536-BGA
- Supplier Device Package: 536-LFBGA
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Package: - |
Stock9 |
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RISC-V | 128kB | 857.6kB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -40°C ~ 100°C | 536-BGA | 536-LFBGA |
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AMD |
IC VERSAL AICORE FPGA 2197BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.4GHz
- Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ AI Core FPGA, 1.9M Logic Cells | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
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Microchip Technology |
IC SOC RISC-V 784FCBGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128kB
- RAM Size: 2.2MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 254K Logic Modules
- Operating Temperature: 0°C ~ 100°C
- Package / Case: 784-BFBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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Package: - |
Request a Quote |
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RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | 784-BFBGA, FCBGA | 784-FCBGA (23x23) |
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Intel |
IC FPGA STRATIX 10 1760FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) |
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AMD |
IC VERSALPRIME ACAP FPGA 1596BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.3GHz
- Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1596-BFBGA
- Supplier Device Package: 1596-BGA (37.5x37.5)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ Prime FPGA, 1.2M Logic Cells | -40°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) |
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AMD |
IC VERSAL AI-CORE FPGA 1596BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 400MHz, 1GHz
- Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1596-BFBGA
- Supplier Device Package: 1596-BGA (37.5x37.5)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1M Logic Cells | 0°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) |
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Intel |
IC FPGA AGILEX-F 1546FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 573K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) |
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Intel |
IC FPGA AGILEX-F 1546FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 573K Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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AMD |
IC VERSALPRIME ACAP FPGA 1024BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 400MHz, 1GHz
- Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1024-BFBGA
- Supplier Device Package: 1024-BGA (31x31)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ Prime FPGA, 70k Logic Cells | 0°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) |
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Intel |
IC FPGA AGILEX-I 3184BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
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Intel |
IC FPGA AGILEX-I 3184BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
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Microchip Technology |
IC SOC RISC-V 784FCBGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128KB
- RAM Size: 1.4125MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 161K Logic Modules
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 784-BFBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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Package: - |
Request a Quote |
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RISC-V | 128KB | 1.4125MB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 125°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) |
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NXP Semiconductors |
88MW322 - 88MW32X 802.11n Wi-Fi
- Architecture: MPU
- Core Processor: ARM® Cortex®-M4F
- Flash Size: -
- RAM Size: 512kB
- Peripherals: DMA, PWM
- Connectivity: I2C, SPI, SSP, UART
- Speed: 200MHz
- Primary Attributes: -
- Operating Temperature: -30°C ~ 85°C
- Package / Case: 88-VFQFN Exposed Pad
- Supplier Device Package: 88-QFN (10x10)
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Package: - |
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ARM® Cortex®-M4F | - | 512kB | DMA, PWM | I2C, SPI, SSP, UART | 200MHz | - | -30°C ~ 85°C | 88-VFQFN Exposed Pad | 88-QFN (10x10) |
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Intel |
IC FPGA AGILEX-F 2486FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.4M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA AGILEX-F 3184BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |