Page 156 - Embedded - System On Chip (SoC) | Integrated Circuits (ICs)

XCZU17EG-2FFVE1924I
Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

Package: 1924-BBGA, FCBGA

Stock6,208
XCZU19EG-1FFVB1517I
Xilinx Inc.

IC FPGA 644 I/O 1517FCBGA

Package: 1517-BBGA, FCBGA

Stock2,384
XCZU11EG-1FFVB1517I
Xilinx Inc.

IC FPGA 488 I/O 1517FCBGA

Package: 1517-BBGA, FCBGA

Stock5,664
XCZU2CG-L1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Package: 784-BBGA, FCBGA

Stock3,296
M2S090T-FGG484I
Microsemi Corporation

IC FPGA SOC 90K LUTS 484FBGA

Package: 484-BGA

Stock2,256
XC7Z015-1CL485I
Xilinx Inc.

IC FPGA

Package: 484-LFBGA, CSPBGA

Stock4,832
M2S060T-1FG676
Microsemi Corporation

IC FPGA SOC 60K LUTS

Package: 676-BGA

Stock2,848
5CSXFC2C6U23I7N
Altera

IC FPGA 224 I/O 672UBGA

Package: 672-FBGA

Stock5,376
BCM33843GUKFSBG
Broadcom Limited

CABLE MODEM

Package: -

Stock2,112
1SX250LH2F55I2LG
Intel

2912-PIN FBGA

Package: -

Stock2,736
10AS057N2F40I2LG
Intel

IC SOC FPGA 588 I/O 1517FBGA

Package: 1517-BBGA, FCBGA

Stock4,928
10AS066N4F40E3SG
Intel

IC SOC FPGA 588 I/O 1517FBGA

Package: 1517-BBGA, FCBGA

Stock7,152
5CSEBA2U19C7SN
Intel

IC FPGA 161 I/O 484FBGA

Package: 484-FBGA

Stock3,552
BCM3384DSA01
Broadcom Limited

24X8 DOCSIS 3.0 MODEM 3384D

Package: -

Stock7,712
BCM53570B0KFSBG
Broadcom Limited

24X10G L2 SWITCH

Package: -

Request a Quote
AGIB027R31A1I1VB
Intel

IC FPGA AGILEX-I 3184FBGA

Package: -

Request a Quote
XCVM1302-2LLENBVB1024
AMD

IC VERSALPRIME ACAP FPGA 1024BGA

Package: -

Request a Quote
AGID019R31B1E1V
Intel

IC FPGA AGILEX-I 3184FBGA

Package: -

Request a Quote
XCVC1702-1LSINSVG1369
AMD

IC VERSAL AI-CORE FPGA 1369BGA

Package: -

Request a Quote
1SX085HN1F43I2LG
Intel

IC FPGA STRATIX 10 1760FBGA

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
XCZU17EG-2FFVE1924I	Xilinx Inc.	IC FPGA 668 I/O 1924FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	Package: 1924-BBGA, FCBGA	Stock6,208	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 926K+ Logic Cells	-40°C ~ 100°C (TJ)	1924-BBGA, FCBGA	1924-FCBGA (45x45)
XCZU19EG-1FFVB1517I	Xilinx Inc.	IC FPGA 644 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock2,384	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 1143K+ Logic Cells	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
XCZU11EG-1FFVB1517I	Xilinx Inc.	IC FPGA 488 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock5,664	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 653K+ Logic Cells	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
XCZU2CG-L1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: 784-BBGA, FCBGA	Stock3,296	Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.3GHz	Zynq?UltraScale+? FPGA, 103K+ Logic Cells	-40°C ~ 100°C (TJ)	784-BBGA, FCBGA	784-FCBGA (23x23)
M2S090T-FGG484I	Microsemi Corporation	IC FPGA SOC 90K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	Package: 484-BGA	Stock2,256	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)	484-BGA	484-FPBGA (23x23)
XC7Z015-1CL485I	Xilinx Inc.	IC FPGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix?-7 FPGA, 74K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	Package: 484-LFBGA, CSPBGA	Stock4,832	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	667MHz	Artix?-7 FPGA, 74K Logic Cells	-40°C ~ 100°C (TJ)	484-LFBGA, CSPBGA	484-CSPBGA (19x19)
M2S060T-1FG676	Microsemi Corporation	IC FPGA SOC 60K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	Package: 676-BGA	Stock2,848	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	676-BGA	676-FBGA (27x27)
5CSXFC2C6U23I7N	Altera	IC FPGA 224 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	Package: 672-FBGA	Stock5,376	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 25K Logic Elements	-40°C ~ 100°C (TJ)	672-FBGA	672-UBGA (23x23)
BCM33843GUKFSBG	Broadcom Limited	CABLE MODEM Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,112	-	-	-	-	-	-	-	-	-	-
1SX250LH2F55I2LG	Intel	2912-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock2,736	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2500K Logic Elements	-40°C ~ 100°C (TJ)	-	-
10AS057N2F40I2LG	Intel	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock4,928	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 570K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
10AS066N4F40E3SG	Intel	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock7,152	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
5CSEBA2U19C7SN	Intel	IC FPGA 161 I/O 484FBGA Architecture: MCU, FPGA Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	Package: 484-FBGA	Stock3,552	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 25K Logic Elements	0°C ~ 85°C (TJ)	484-FBGA	484-UBGA (19x19)
BCM3384DSA01	Broadcom Limited	24X8 DOCSIS 3.0 MODEM 3384D Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,712	-	-	-	-	-	-	-	-	-	-
BCM53570B0KFSBG	Broadcom Limited	24X10G L2 SWITCH Architecture: MPU Core Processor: ARM® Cortex®-A9, ARM® Cortex®-R5 Flash Size: - RAM Size: - Peripherals: SERDES Connectivity: ACL, MAC, QSGMII Speed: 1.25GHz Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	ARM® Cortex®-A9, ARM® Cortex®-R5	-	-	SERDES	ACL, MAC, QSGMII	1.25GHz	-	-	-	-
AGIB027R31A1I1VB	Intel	IC FPGA AGILEX-I 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.7M Logic Elements	-40°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
XCVM1302-2LLENBVB1024	AMD	IC VERSALPRIME ACAP FPGA 1024BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 450MHz, 1.08GHz Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1024-BFBGA Supplier Device Package: 1024-BGA (31x31)	Package: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	450MHz, 1.08GHz	Versal™ Prime FPGA, 70k Logic Cells	0°C ~ 100°C (TJ)	1024-BFBGA	1024-BGA (31x31)
AGID019R31B1E1V	Intel	IC FPGA AGILEX-I 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.9M Logic Elements	0°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
XCVC1702-1LSINSVG1369	AMD	IC VERSAL AI-CORE FPGA 1369BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 400MHz, 1GHz Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1369-BFBGA, FCBGA Supplier Device Package: 1369-FCBGA (35x35)	Package: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	400MHz, 1GHz	Versal™ AI Core FPGA, 1M Logic Cells	-40°C ~ 100°C (TJ)	1369-BFBGA, FCBGA	1369-FCBGA (35x35)
1SX085HN1F43I2LG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 850K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 850K Logic Elements	-40°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FBGA (42.5x42.5)
MPFS460TS-FCG1152IPP	Microchip Technology	IC SOC RISC-V 1152FCBGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128kB RAM Size: 3.95MB Peripherals: DMA, PCI, PWM Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 461K Logic Modules Operating Temperature: -40°C ~ 100°C Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	Package: -	Request a Quote	RISC-V	128kB	3.95MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 461K Logic Modules	-40°C ~ 100°C	1152-BBGA, FCBGA	1152-FCBGA (35x35)
1SX280HH2F55I2LG	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2800K Logic Elements	-40°C ~ 100°C (TJ)	2912-BBGA, FCBGA	2912-FBGA, FC (55x55)
TDA2EEBEQCBDRQ1	Texas Instruments	PROTOTYPE Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-	-	-
1SX065HH3F35I2VG	Intel	IC FPGA STRATIX10SX 1152FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 650K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 650K Logic Elements	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
AGFA022R24C2I1V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.2M Logic Elements	-40°C ~ 100°C (TJ)	-	-
AGID019R18A1I1V	Intel	IC FPGA AGILEX-I 1805FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1805-BBGA Exposed Pad Supplier Device Package: 1805-BGA (42.5x42.5)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.9M Logic Elements	-40°C ~ 100°C (TJ)	1805-BBGA Exposed Pad	1805-BGA (42.5x42.5)
XCZU1CG-L2SFVC784E	AMD	IC ZUP MPSOC LP A53 FPGA 784BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: - Speed: 533MHz, 1.333GHz Primary Attributes: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: -	Request a Quote	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	-	533MHz, 1.333GHz	-	0°C ~ 100°C (TJ)	784-BFBGA, FCBGA	784-FCBGA (23x23)
XCZU43DR-2FSVE1156I	AMD	IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.333GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.333GHz	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-40°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)