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NG80960JD3V50
Intel

IC MPU I960 50MHZ 132QFP

Package: 132-QFP

Stock4,352
1SX280LU3F50I3VG
Intel

2397-PIN FBGA

Package: -

Stock2,976
10AS027E4F27E3SG
Intel

672-PIN FBGA

Package: -

Stock6,512
EPC2TC32
Intel

IC CONFIG DEVICE 1.6MBIT 32TQFP

Package: 32-TQFP

Stock6,400
EP20K60EBC356-3
Intel

IC FPGA 196 I/O 356BGA

Package: 356-LBGA

Stock5,552
EP20K100BC356-1
Intel

IC FPGA 252 I/O 356BGA

Package: 356-LBGA

Stock6,384
EPF10K10LC84-4
Intel

IC FPGA 59 I/O 84PLCC

Package: 84-LCC (J-Lead)

Stock5,072
EP3C55F484I7N
Intel

IC FPGA 327 I/O 484FBGA

Package: 484-BGA

Stock21,600
EP4SE820H40C3
Intel

IC FPGA 976 I/O 1517HBGA

Package: 1517-BBGA, FCBGA

Stock3,584
5SGXEA3K1F35C2N
Intel

IC FPGA 432 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock6,224
5SGXMA3K2F40C2LN
Intel

IC FPGA 696 I/O 1517FBGA

Package: 1517-BBGA, FCBGA

Stock7,552
5AGXBA1D4F27C5N
Intel

IC FPGA 336 I/O 672FBGA

Package: 672-BBGA, FCBGA

Stock7,856
EPM9320LC84-20
Intel

IC CPLD 320MC 20NS 84PLCC

Package: 84-LCC (J-Lead)

Stock2,144
EPM7064STC44-7N
Intel

IC CPLD 64MC 7.5NS 44TQFP

Package: 44-TQFP

Stock16,104
1SG065HH3F35I3XG
Intel

IC FPGA STRATIX10GX 1152FBGA

Package: -

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5SGXMA9K3H40I3NCV
Intel

IC FPGA 696 I/O 1517HBGA

Package: -

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5SGXMB5R3F43C3G
Intel

IC FPGA 600 I/O 1760FBGA

Package: -

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AGIB019R18A2E1VB
Intel

IC FPGA AGILEX-I 1805BGA

Package: -

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1SD280PT2F55E1VGS1
Intel

IC FPGA 816 I/O 2912FBGA

Package: -

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AGFD023R24C2I2V
Intel

IC

Package: -

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Part Number	Manufacturer	Description	Package	Stock
NG80960JD3V50	Intel	IC MPU I960 50MHZ 132QFP Core Processor: i960 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 100°C (TC) Security Features: - Package / Case: 132-QFP Supplier Device Package: 132-PQFP (24.13x24.13)	Package: 132-QFP	Stock4,352
1SX280LU3F50I3VG	Intel	2397-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock2,976
10AS027E4F27E3SG	Intel	672-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock6,512
EPC2TC32	Intel	IC CONFIG DEVICE 1.6MBIT 32TQFP Programmable Type: In System Programmable Memory Size: 1.6Mb Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 32-TQFP Supplier Device Package: 32-TQFP (7x7)	Package: 32-TQFP	Stock6,400
EP20K60EBC356-3	Intel	IC FPGA 196 I/O 356BGA Number of LABs/CLBs: 2560 Number of Logic Elements/Cells: 2560 Total RAM Bits: 32768 Number of I/O: 196 Number of Gates: 162000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	Package: 356-LBGA	Stock5,552
EP20K100BC356-1	Intel	IC FPGA 252 I/O 356BGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 252 Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	Package: 356-LBGA	Stock6,384
EPF10K10LC84-4	Intel	IC FPGA 59 I/O 84PLCC Number of LABs/CLBs: 72 Number of Logic Elements/Cells: 576 Total RAM Bits: 6144 Number of I/O: 59 Number of Gates: 31000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	Package: 84-LCC (J-Lead)	Stock5,072
EP3C55F484I7N	Intel	IC FPGA 327 I/O 484FBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 327 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BGA	Stock21,600
EP4SE820H40C3	Intel	IC FPGA 976 I/O 1517HBGA Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Total RAM Bits: 34093056 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (42.5x42.5)	Package: 1517-BBGA, FCBGA	Stock3,584
5SGXEA3K1F35C2N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock6,224
5SGXMA3K2F40C2LN	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock7,552
5AGXBA1D4F27C5N	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 3537 Number of Logic Elements/Cells: 75000 Total RAM Bits: 8666112 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BBGA, FCBGA	Stock7,856
EPM9320LC84-20	Intel	IC CPLD 320MC 20NS 84PLCC Programmable Type: In System Programmable Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 20 Number of Macrocells: 320 Number of Gates: 6000 Number of I/O: 60 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	Package: 84-LCC (J-Lead)	Stock2,144
EPM7064STC44-7N	Intel	IC CPLD 64MC 7.5NS 44TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 36 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-TQFP (10x10)	Package: 44-TQFP	Stock16,104
1SG065HH3F35I3XG	Intel	IC FPGA STRATIX10GX 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 612000 Total RAM Bits: 51380224 Number of I/O: 392 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
5SGXMA9K3H40I3NCV	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	Package: -	Request a Quote
5SGXMB5R3F43C3G	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: -	Request a Quote
AGIB019R18A2E1VB	Intel	IC FPGA AGILEX-I 1805BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1805-BBGA Exposed Pad Supplier Device Package: 1805-BGA (42.5x42.5)	Package: -	Request a Quote
1SD280PT2F55E1VGS1	Intel	IC FPGA 816 I/O 2912FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 2753000 Total RAM Bits: 240123904 Number of I/O: 816 Number of Gates: - Voltage - Supply: - Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA (55x55)	Package: -	Request a Quote
AGFD023R24C2I2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote
1SX065HH2F35E2VG	Intel	IC FPGA STRATIX10SX 1152FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 650K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
5962-8766803MYA	Intel	IC MPU MG80386 20MHZ 164CQFP Core Processor: 80386 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 20MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5V Operating Temperature: -55°C ~ 125°C (TC) Security Features: - Package / Case: 164-BCQFP Exposed Pad Supplier Device Package: 164-CQFP (28.71x28.71)	Package: -	Request a Quote
5SGSMD4E2H29I3G	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 19456000 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	Package: -	Request a Quote
AGFA027R31C2E4X	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
AGFA014R24C2I3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
5SGXMA7K2F35I2LG	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
AGFB008R16A3I3E	Intel	IC FPGA AGILEX-F 1546FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 764K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
1SX110HN2F43I2LG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 1100K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote