Page 128 - Intel Products | Heisener Electronics

EP1C12F256C8EC
Intel

IC FPGA FBGA

Package: 256-BGA

Stock7,280
MPF10K10TI144AA
Intel

IC FPGA

Package: 144-LQFP

Stock4,704
EP2A40F1020I8
Intel

IC FPGA 735 I/O 1020FBGA

Package: 1020-BBGA

Stock7,696
EPF6024AFI256-2
Intel

IC FPGA 219 I/O 256FBGA

Package: 256-BGA

Stock7,968
10M50DAF484I7G
Intel

IC FPGA 360 I/O 484FBGA

Package: 484-BGA

Stock3,152
EP4SE530H40C3N
Intel

IC FPGA 976 I/O 1517HBGA

Package: 1517-BBGA, FCBGA

Stock4,528
5SGXEA3K1F35C2L
Intel

IC FPGA 432 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock4,240
5SGXMA4K2F40I2N
Intel

IC FPGA 696 I/O 1517FBGA

Package: 1517-BBGA, FCBGA

Stock2,208
5AGXFA5H4F35I3G
Intel

IC FPGA 544 I/O 1152FBGA

Package: 1152-BBGA, FCBGA Exposed Pad

Stock5,328
EP2AGX95EF29I3G
Intel

IC FPGA 372 I/O 780FBGA

Package: 780-BBGA, FCBGA

Stock6,528
EP2C35F484C8N
Intel

IC FPGA 322 I/O 3484FBGA

Package: 484-BGA

Stock9,240
EP4CE55F29I7
Intel

IC FPGA 374 I/O 780FBGA

Package: 780-BGA

Stock6,080
EPM7256BTC144-7
Intel

IC CPLD 256MC 7.5NS 144TQFP

Package: 144-LQFP

Stock6,400
5M1270ZT144A5N
Intel

IC CPLD 980MC 6.2NS 144TQFP

Package: 144-LQFP

Stock17,124
DCF0780FA1
Intel

IC MECHANICAL SAMPLE

Package: -

Stock7,232
5SGXEB6R2F43I2G
Intel

IC FPGA 600 I/O 1760FBGA

Package: -

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AGIB041R29D1E1VB
Intel

IC FPGA AGILEX-I 2957BGA

Package: -

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AGFC023R24C2I3E
Intel

IC FPGA AGILEX-F 2340BGA

Package: -

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UM80536UC800512
Intel

CELERON PROCESSOR

Package: -

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1ST110ES3F50I3VG
Intel

IC FPGA STRATIX10TX 2397FBGA

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock
EP1C12F256C8EC	Intel	IC FPGA FBGA Number of LABs/CLBs: 1206 Number of Logic Elements/Cells: 12060 Total RAM Bits: 239616 Number of I/O: 185 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock7,280
MPF10K10TI144AA	Intel	IC FPGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: Surface Mount Operating Temperature: - Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock4,704
EP2A40F1020I8	Intel	IC FPGA 735 I/O 1020FBGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 38400 Total RAM Bits: 655360 Number of I/O: 735 Number of Gates: 3000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	Package: 1020-BBGA	Stock7,696
EPF6024AFI256-2	Intel	IC FPGA 219 I/O 256FBGA Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 1960 Total RAM Bits: - Number of I/O: 219 Number of Gates: 24000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock7,968
10M50DAF484I7G	Intel	IC FPGA 360 I/O 484FBGA Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 360 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BGA	Stock3,152
EP4SE530H40C3N	Intel	IC FPGA 976 I/O 1517HBGA Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Total RAM Bits: 28033024 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (42.5x42.5)	Package: 1517-BBGA, FCBGA	Stock4,528
5SGXEA3K1F35C2L	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock4,240
5SGXMA4K2F40I2N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock2,208
5AGXFA5H4F35I3G	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 8962 Number of Logic Elements/Cells: 190000 Total RAM Bits: 13284352 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.12 V ~ 1.18 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA Exposed Pad	Stock5,328
EP2AGX95EF29I3G	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 3747 Number of Logic Elements/Cells: 89178 Total RAM Bits: 6839296 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock6,528
EP2C35F484C8N	Intel	IC FPGA 322 I/O 3484FBGA Number of LABs/CLBs: 2076 Number of Logic Elements/Cells: 33216 Total RAM Bits: 483840 Number of I/O: 322 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BGA	Stock9,240
EP4CE55F29I7	Intel	IC FPGA 374 I/O 780FBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 374 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BGA	Stock6,080
EPM7256BTC144-7	Intel	IC CPLD 256MC 7.5NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 120 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock6,400
5M1270ZT144A5N	Intel	IC CPLD 980MC 6.2NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.2ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 1270 Number of Macrocells: 980 Number of Gates: - Number of I/O: 114 Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock17,124
DCF0780FA1	Intel	IC MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,232
5SGXEB6R2F43I2G	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: -	Request a Quote
AGIB041R29D1E1VB	Intel	IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	Package: -	Request a Quote
AGFC023R24C2I3E	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote
UM80536UC800512	Intel	CELERON PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
1ST110ES3F50I3VG	Intel	IC FPGA STRATIX10TX 2397FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 1325000 Total RAM Bits: 112197632 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote
AGFB019R31C2E1VB	Intel	IC FPGA AGILEX-F 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
AGFA027R24C2I3E	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
AGFB008R16A2I2VB	Intel	IC FPGA AGILEX-F 1546BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 764K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1546-BFBGA Exposed Pad Supplier Device Package: 1546-BGA (37.5x34)	Package: -	Request a Quote
5SGXEB6R1F40I2G	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-FBGA (40x40) Supplier Device Package: 1517-FBGA (40x40)	Package: -	Request a Quote
AGFA019R31C3I3E	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
1SG166HN2F43I2LG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote
AGFD023R31C3E3V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
1SG165HU2F50I2VG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote